CN202564238U

CN202564238U - Multi-base-island-exposed type multi-circle multi-chip flip packaging structure

Info

Publication number: CN202564238U
Application number: CN 201220204446
Authority: CN
Inventors: 王新潮; 李维平; 梁志忠
Original assignee: Jiangsu Changjiang Electronics Technology Co Ltd
Current assignee: JCET Group Co Ltd
Priority date: 2012-05-09
Filing date: 2012-05-09
Publication date: 2012-11-28
Anticipated expiration: 2022-05-09

Abstract

The utility model relates to a multi-base-island-exposed type multi-circle multi-chip flip packaging structure, comprising a plurality of the base islands (1), the pins (2) and a plurality of chips (3). The plurality of chips (3) is inversely arranged on the fronts of the plurality of the base islands (1) and the pins (2). Bottom filling glue (8) is mounted between the bottom of the chips (3) and the fronts of the base islands (1) and the pins (2). Plastic package materials (4) are packaged on a peripheral area of the base islands (1), an area between the base islands (1) and the pins (2), an area between the pins (2) and outside of the chips (3). The holes (5) are opened on the surface of the plastic package materials (4) on a lower part of the base islands (1) and the pins (2). Metal balls (7) are disposed in the holes (5). There are multiple circles of the pins (2). The beneficial effects of the utility model are that manufacturing cost is reduced, security and reliability of the packaging structure are raised and the structure can really achieve design and manufacturing of a high-density circuit.

Description

The many flip chip encapsulation structures of the many circles of many base island exposed types

Technical field

The utility model relates to the many flip chip encapsulation structures of the many circles of a kind of how base island exposed type, belongs to the semiconductor packaging field.

Background technology

The manufacturing process flow of traditional high-density base board encapsulating structure is as follows:

Step 1, referring to Fig. 3, get the substrate that a glass fiber material is processed,

Step 2, referring to Fig. 4, perforate on desired position on the glass fiber substrate,

Step 3, referring to Fig. 5, at the back side of glass fiber substrate coating one deck Copper Foil,

Step 4, referring to Fig. 6, insert conductive materials in the position of glass fiber substrate punching,

Step 5, referring to Fig. 7, at positive coating one deck Copper Foil of glass fiber substrate,

Step 6, referring to Fig. 8, the coating photoresistance film on glass fiber substrate surface,

Step 7, referring to Fig. 9, the photoresistance film is carried out exposure imaging in the position of needs windows,

Step 8, referring to Figure 10, the part that completion is windowed is carried out etching,

Step 9, referring to Figure 11, the photoresistance film of substrate surface is divested,

Step 10, referring to Figure 12, carry out the coating of anti-welding lacquer (being commonly called as green lacquer) on the surface of copper foil circuit layer,

Step 11, referring to Figure 13, need carry out load and the zone of routing bonding of back operation at anti-welding lacquer and window,

Step 12, referring to Figure 14, electroplate in the zone that step 11 is windowed, form Ji Dao and pin relatively,

Step 13, accomplish follow-up load, routing, seal, concerned process steps such as cutting.

Above-mentioned traditional high-density base board encapsulating structure exists following deficiency and defective:

1, many glass fiber materials of one deck, same also many costs of layer of glass;

2, because must use glass fiber, so with regard to many thickness space of about 100 ~ 150 μ m of layer of glass thickness;

3, glass fiber itself is exactly a kind of foaming substance, so easily because time of placing and environment suck moisture and moisture, directly have influence on the security capabilities of reliability or the grade of reliability;

4, the fiberglass surfacing Copper Foil metal layer thickness of about 50 ~ 100 μ m of one deck that has been covered; And the etching of metal level circuit and circuit distance also because the etched gap that the characteristic of etching factor can only be accomplished 50 ~ 100 μ m (referring to Figure 15; Best making ability is that etched gap is equal to the thickness that is etched object approximately), so the design of accomplishing high-density line and manufacturing that can't be real;

5, because must use the Copper Foil metal level, and the Copper Foil metal level is the mode that the employing high pressure is pasted, so the thickness of Copper Foil is difficult to be lower than the thickness of 50 μ m, otherwise just is difficult to operation like out-of-flatness or Copper Foil breakage or Copper Foil extension displacement or the like;

6, also because the whole base plate material is to adopt glass fiber material, thus significantly increased thickness 100 ~ 150 μ m of glass layer, can't be real accomplish ultra-thin encapsulation;

7, the traditional glass fiber stick on Copper Foil technology because material property difference very big (coefficient of expansion) causes stress deformation easily in the operation of adverse circumstances, directly have influence on precision and element and substrate adherence and reliability that element loads.

Summary of the invention

The purpose of the utility model is to overcome above-mentioned deficiency, provides the many circles of a kind of how base island exposed type many flip chip encapsulation structures, and its technology is simple; Need not use glass layer; Reduce manufacturing cost, improved the fail safe and the reliability of packaging body, reduced the environmental pollution that glass fiber material brings; And the metal substrate line layer adopts is electro-plating method, can really accomplish the design and the manufacturing of high-density line.

The purpose of the utility model is achieved in that the many flip chip encapsulation structures of the many circles of a kind of how base island exposed type; It comprises Ji Dao, pin and chip; Said Ji Dao and chip all have a plurality of, and said a plurality of flip-chip are positive in a plurality of Ji Dao and pin, are provided with underfill between said chip bottom and Ji Dao and the pin front; The zone and the chip of zone, Ji Dao and the pin bottom on zone, Ji Dao and pin top between zone, pin and the pin between zone, Ji Dao and the pin of periphery, said basic island all are encapsulated with plastic packaging material outward; Offer aperture on the plastic packaging material surface of said Ji Dao and pin bottom, said aperture is connected with the Ji Dao or the pin back side, is provided with metal ball in the said aperture; Said metal ball contacts with the Ji Dao or the pin back side, and said pin has many circles.

Be provided with coat of metal between said metal ball and Ji Dao or the pin back side.

Said Ji Dao comprises Ji Dao top, Ji Dao bottom and intermediate barrier layers, and said Ji Dao top and Ji Dao bottom form by the single or multiple lift metal plating, and said intermediate barrier layers is nickel dam, titanium layer or copper layer.

Said pin comprises pin top, pin bottom and intermediate barrier layers, and said pin top and pin bottom form by the single or multiple lift metal plating, and said intermediate barrier layers is nickel dam, titanium layer or copper layer.

Compared with prior art, the utlity model has following beneficial effect:

1, the utility model need not use glass layer, so can reduce the cost that glass layer brings;

2, the utility model does not use the foaming substance of glass layer, so the grade of reliability can improve again, the fail safe to packaging body will improve relatively;

3, the utility model need not use the glass layer material, so just can reduce the environmental pollution that glass fiber material brings;

What 4, the two-dimensional metallic substrate circuit layer of the utility model was adopted is electro-plating method; And the gross thickness of electrodeposited coating is about 10 ~ 15 μ m; And the gap between circuit and the circuit can reach the gap below the 25 μ m easily, so can accomplish the technical capability of pin circuit tiling in the high density veritably;

5, the two-dimensional metallic substrate of the utility model is the metal level galvanoplastic because of what adopt; So the technology than glass fiber high pressure Copper Foil metal level is come simply, and do not have metal level because high pressure produces bad or puzzled that metal level out-of-flatness, metal level breakage and metal level extend and be shifted;

6, the two-dimensional metallic substrate circuit layer of the utility model is to carry out metal plating on the surface of metal base; So the material characteristic is basic identical; So the internal stress of coating circuit and metal base is basic identical, can carries out the back engineering (like the surface mount work of high temperature eutectic load, high temperature tin material scolder load and high temperature passive device) of adverse circumstances easily and be not easy to produce stress deformation.

Description of drawings

Fig. 1 is the sketch map of the many flip chip encapsulation structures of the many circles of a kind of how base island exposed type of the utility model.

Fig. 2 is the vertical view of Fig. 1.

Fig. 3 ~ Figure 14 is each operation sketch map of the manufacturing process flow of traditional high-density base board encapsulating structure.

Figure 15 is the etching situation sketch map of fiberglass surfacing Copper Foil metal level.

Wherein:

Base island 1

Pin 2

Chip 3

Plastic packaging material 4

Aperture 5

Coat of metal 6

Metal ball 7

Underfill 8.

Embodiment

Referring to Fig. 1, Fig. 2; The many flip chip encapsulation structures of the many circles of a kind of how base island exposed type of the utility model; It comprises basic island 1, pin 2 and chip 3; Said basic island 1 and chip 3 all have a plurality of, and said a plurality of chip 3 upside-down mountings are provided with underfill 8 in a plurality of basic islands 1 and pin 2 fronts between said chip 3 bottoms and basic island 1 and pin 2 fronts; The zone of zone, basic island 1 and pin 2 bottoms on zone, basic island 1 and pin 2 tops between zone, pin 2 and the pin 2 between zone, basic island 1 and the pin 2 of 1 periphery, said basic island and the chip 3 outer plastic packaging materials 4 that all are encapsulated with; Offer aperture 5 on plastic packaging material 4 surfaces of said basic island 1 and pin 2 bottoms, said aperture 5 is connected with the basic island 1 or pin 2 back sides, is provided with metal ball 7 in the said aperture 5; Said metal ball 7 contacts with the basic island 1 or pin 2 back sides, and said pin 2 has many circles.

Be provided with coat of metal 6 between said metal ball 7 and basic island 1 or pin 2 back sides, said coat of metal 6 is an oxidation inhibitor.

Said metal ball 7 materials adopt tin or ashbury metal.

Said basic island 1 comprises Ji Dao top, Ji Dao bottom and intermediate barrier layers, and said Ji Dao top and Ji Dao bottom form by the single or multiple lift metal plating, and said intermediate barrier layers is nickel dam, titanium layer or copper layer.

Said pin 2 comprises pin top, pin bottom and intermediate barrier layers, and said pin top and pin bottom form by the single or multiple lift metal plating, and said intermediate barrier layers is nickel dam, titanium layer or copper layer.

Claims

1. base island exposed type more than a kind encloses many flip chip encapsulation structures more; It is characterized in that: it comprises Ji Dao (1), pin (2) and chip (3); Said Ji Dao (1) and chip (3) all have a plurality of; Said a plurality of chip (3) upside-down mounting is in a plurality of Ji Dao (1) and pin (2) front; Be provided with underfill (8) between said chip (3) bottom and Ji Dao (1) and pin (2) front; The outer plastic packaging material (4) that all is encapsulated with of the zone of zone, Ji Dao (1) and pin (2) bottom on zone, Ji Dao (1) and pin (2) top between zone, pin (2) and the pin (2) between zone, Ji Dao (1) and the pin (2) of said Ji Dao (1) periphery and chip (3); Offer aperture (5) on plastic packaging material (4) surface of said Ji Dao (1) and pin (2) bottom, said aperture (5) is connected with the Ji Dao (1) or pin (2) back side, is provided with metal ball (7) in the said aperture (5); Said metal ball (7) contacts with the Ji Dao (1) or pin (2) back side, and said pin (2) has many circles.

2. the many flip chip encapsulation structures of the many circles of a kind of how base island exposed type according to claim 1 is characterized in that: be provided with coat of metal (6) between said metal ball (7) and Ji Dao (1) or pin (2) back side.

3. the many flip chip encapsulation structures of the many circles of a kind of how base island exposed type according to claim 1; It is characterized in that: said Ji Dao (1) comprises Ji Dao top, Ji Dao bottom and intermediate barrier layers; Said Ji Dao top and Ji Dao bottom form by the single or multiple lift metal plating, and said intermediate barrier layers is nickel dam, titanium layer or copper layer.

4. the many flip chip encapsulation structures of the many circles of a kind of how base island exposed type according to claim 1; It is characterized in that: said pin (2) comprises pin top, pin bottom and intermediate barrier layers; Said pin top and pin bottom form by the single or multiple lift metal plating, and said intermediate barrier layers is nickel dam, titanium layer or copper layer.