CN202551595U - Device for cooling box body of pitch system - Google Patents

Device for cooling box body of pitch system Download PDF

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Publication number
CN202551595U
CN202551595U CN2012201319538U CN201220131953U CN202551595U CN 202551595 U CN202551595 U CN 202551595U CN 2012201319538 U CN2012201319538 U CN 2012201319538U CN 201220131953 U CN201220131953 U CN 201220131953U CN 202551595 U CN202551595 U CN 202551595U
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CN
China
Prior art keywords
chilling plate
semiconductor chilling
pitch
casing
controlled system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN2012201319538U
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Chinese (zh)
Inventor
江显平
曲吉桢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SSB WIND ENERGY TECHNOLOGY (QINGDAO) Co Ltd
SSB Antriebstechnik GmbH and Co KG
Original Assignee
SSB WIND ENERGY TECHNOLOGY (QINGDAO) Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SSB WIND ENERGY TECHNOLOGY (QINGDAO) Co Ltd filed Critical SSB WIND ENERGY TECHNOLOGY (QINGDAO) Co Ltd
Priority to CN2012201319538U priority Critical patent/CN202551595U/en
Application granted granted Critical
Publication of CN202551595U publication Critical patent/CN202551595U/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

The utility model discloses a device for cooling a box body of a pitch system. The device comprises a semiconductor refrigeration sheet which is arranged on the box body and is connected with a direct current power supply in the box body, wherein the cold end of the semiconductor refrigeration sheet faces the inner part of the box body, and the hot end of the semiconductor refrigeration sheet faces the outer part of the box body. By arranging the semiconductor refrigeration sheet on the box body of the pitch system, the box body can be cooled under the conditions that a special box body material is not required to be used, and holes are not required to be formed in the sealed box body.

Description

A kind of pitch-controlled system casing heat abstractor
Technical field
The utility model relates to a kind of heat abstractor, relates to the heat abstractor on a kind of pitch-controlled system casing that is applied to wind-driven generator specifically.
Background technology
Electric power is indispensable form of energy in daily production and the life.Traditional thermal power generation not only will consume a large amount of fossil resources, and can discharge a large amount of greenhouse gas; Though nuclear energy power generation is emission greenhouse gas not, danger very in case accident occurs, will cause irreversible destruction to environment, so various countries are the clean energy resource of representative greatly developing with the wind power generation all in recent years.
Pitch-controlled system is the vitals in the complete blower; Its effect is the rotating speed of angle with the change blade that facing the wind through adjustment blower fan blade; Can optimize the generating efficiency of complete blower at ordinary times; If blower fan generation part fault or ambient wind velocity are too fast, it can utilize the stall principle to make the blower fan blade arrive feather position again and stop operating, thereby avoids complete blower stall to collapse.Critical pieces such as the motor driver of pitch-controlled system, back-up source all are installed in the casing separately; But because pitch-controlled system may be worked under hot environment sometimes; And its internal components also can distribute heat in the process of work, therefore need carry out necessary radiating treatment to the casing of pitch-controlled system.
In the prior art, normally adopt the heat radiation of casing body perhaps to reduce spin manifold temperature through the mode of fan heat radiation.But adopt the mode of casing body heat radiation that tank material is had relatively high expectations, not only radiating effect is bad, but also extra increase the cost of casing; Adopt the mode of fan heat radiation need perforate on casing; Though radiating effect is better; But sealing is poor, sucks dust in the casing easily, though can improve through the method that increases filter screen; But filter screen needs often to clean, otherwise filter screen is stopped up and blocking-up heat radiation wind path by dust easily.
The utility model content
The utility model technical problem to be solved just provides a kind of heat abstractor that can dispel the heat for the pitch-controlled system casing of sealing.
In order to solve the problems of the technologies described above, the utility model adopts following technical scheme:
A kind of pitch-controlled system casing heat abstractor, this device comprise be installed on the casing with casing in the semiconductor chilling plate that is connected of DC power supply, wherein the cold junction of semiconductor chilling plate is towards box house, the hot junction is outside towards casing.
Further, semiconductor chilling plate links to each other with DC power supply through temperature relay, and wherein temperature relay is a normally opened contact, but in temperature its contact of closure during more than or equal to a certain temperature.
Further, described closed temperature is more than or equal to 25 ℃.
Further, outside the cold junction of semiconductor chilling plate and hot junction, all post fin.
Further, between semiconductor chilling plate and fin, be coated with heat conductive silica gel.
Further, on the described fin that is attached to the semiconductor chilling plate cold junction internal fan is installed, is attached on the fin in semiconductor chilling plate hot junction external fan is installed.
Further, described internal fan is blown to fin, and described external fan is to the outside air-supply of casing.
The beneficial effect of the utility model is:
The utility model discloses a kind of pitch-controlled system casing heat abstractor; This heat abstractor is through installing semiconductor chilling plate on the casing of pitch-controlled system; Neither need use special tank material, also need not perforate on the casing of sealing, just can realize the casing heat radiation.
Through increasing temperature relay, can select the start-up temperature of semiconductor chilling plate flexibly, heat abstractor is moved under suitable situation.
Through increasing fin, heat conductive silica gel and interior external fan, can further improve the heat-sinking capability of semiconductor chilling plate, optimize the radiating effect of this heat abstractor.
Description of drawings
Fig. 1 is the structural representation of the utility model semiconductor chilling plate;
Fig. 2 is the scheme of installation of the utility model embodiment 3.
Embodiment
For the purpose, technical scheme and the advantage that make the utility model is clearer,, the utility model is further elaborated below in conjunction with accompanying drawing and embodiment.Should be appreciated that specific embodiment described herein only in order to explanation the utility model, and be not used in qualification the utility model.
Please with reference to Fig. 1; Fig. 1 schematically shows the structure of the employed semiconductor chilling plate of the utility model; It alternately is in series through metallic conductor 1 by one group of N type semiconductor and one group of P type semiconductor successively, clamps N type semiconductor and P type semiconductor with two insulation and the good potsherd 2 of heat conductivility more at last.The positive pole of DC power supply 3 connects the top of N type semiconductor; Negative pole connects the end of P type semiconductor; The potsherd that electric current flows to P type semiconductor by N type semiconductor absorbs heat becomes cold junction 4, flows to the potsherd release heat of N type semiconductor by P type semiconductor, becomes hot junction 5.
Embodiment 1; Present embodiment discloses a kind of pitch-controlled system casing heat abstractor; This device comprise be installed on the casing 6 with casing in the semiconductor chilling plate that is connected of DC power supply 3; The structure of this semiconductor chilling plate is as shown in Figure 1, and wherein the cold junction 4 of semiconductor chilling plate is towards box house, and hot junction 5 is outside towards casing.
The disclosed heat abstractor of present embodiment neither need use special tank material, also need not perforate on the casing of sealing, just can realize the casing heat radiation.
Embodiment 2; Present embodiment discloses another kind of pitch-controlled system casing heat abstractor; Its difference with embodiment 1 is that semiconductor chilling plate passes through temperature relay 7 and links to each other with DC power supply, and wherein temperature relay is a normally opened contact, but in temperature closed its contact during more than or equal to 25 ℃; This moment, circuit was connected, and the cold junction of semiconductor chilling plate is discharged heat transferred outside the casing to the hot junction of semiconductor chilling plate after absorbing the heat in the casing again.
Present embodiment can be selected the start-up temperature of semiconductor chilling plate flexibly through increasing temperature relay, and heat abstractor is moved under suitable situation.
Embodiment 3; As shown in Figure 2; Present embodiment discloses another kind of pitch-controlled system casing heat abstractor, and the difference of itself and embodiment 2 is outside the cold junction of semiconductor chilling plate and hot junction, all to post fin 8, and between semiconductor chilling plate and fin, is coated with heat conductive silica gel.On the described fin that is attached to the semiconductor chilling plate cold junction internal fan 9 is installed, this internal fan is blown to fin; Be attached on the fin in semiconductor chilling plate hot junction external fan 10 is installed, this external fan is to the outside air-supply of casing.When temperature in the casing during more than or equal to closed its contacts of 25 ℃ of temperature relays circuit connect; This moment, internal fan began to blow to fin; Thereby be transported to the heat in the casing endlessly on the fin that is attached to the semiconductor chilling plate cold junction; Heat on the fin is passed through the heat conductive silica gel fast Absorption by the cold junction of semiconductor chilling plate subsequently; And then be delivered to the hot junction of semiconductor chilling plate, more then by the fin that is attached to the semiconductor chilling plate hot junction through after the heat conductive silica gel fast Absorption, outside external fan is discharged from casing.
Present embodiment can further improve the heat-sinking capability of semiconductor chilling plate through increasing fin, heat conductive silica gel and interior external fan, optimizes the radiating effect of this heat abstractor.

Claims (7)

1. pitch-controlled system casing heat abstractor is characterized in that: this device comprise be installed on the casing with casing in the semiconductor chilling plate that is connected of DC power supply, wherein the cold junction of semiconductor chilling plate is towards box house, the hot junction is outside towards casing.
2. pitch-controlled system casing heat abstractor according to claim 1 is characterized in that: semiconductor chilling plate links to each other with DC power supply through temperature relay, and wherein temperature relay is a normally opened contact, but in temperature its contact of closure during more than or equal to a certain temperature.
3. pitch-controlled system casing heat abstractor according to claim 2 is characterized in that: described closed temperature is more than or equal to 25 ℃.
4. pitch-controlled system casing heat abstractor according to claim 1 is characterized in that: outside the cold junction of semiconductor chilling plate and hot junction, all post fin.
5. pitch-controlled system casing heat abstractor according to claim 4 is characterized in that: between semiconductor chilling plate and fin, be coated with heat conductive silica gel.
6. pitch-controlled system casing heat abstractor according to claim 4 is characterized in that: on the described fin that is attached to the semiconductor chilling plate cold junction internal fan is installed, is attached on the fin in semiconductor chilling plate hot junction external fan is installed.
7. pitch-controlled system casing heat abstractor according to claim 6, it is characterized in that: described internal fan is blown to fin, and described external fan is to the outside air-supply of casing.
CN2012201319538U 2012-03-23 2012-03-23 Device for cooling box body of pitch system Expired - Lifetime CN202551595U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2012201319538U CN202551595U (en) 2012-03-23 2012-03-23 Device for cooling box body of pitch system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2012201319538U CN202551595U (en) 2012-03-23 2012-03-23 Device for cooling box body of pitch system

Publications (1)

Publication Number Publication Date
CN202551595U true CN202551595U (en) 2012-11-21

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CN2012201319538U Expired - Lifetime CN202551595U (en) 2012-03-23 2012-03-23 Device for cooling box body of pitch system

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CN (1) CN202551595U (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104703438A (en) * 2013-12-09 2015-06-10 中冶长天国际工程有限责任公司 Cooling device and system
CN104703437A (en) * 2013-12-09 2015-06-10 中冶长天国际工程有限责任公司 Cooling device and cooling system
CN110351978A (en) * 2019-06-06 2019-10-18 新华三技术有限公司 The control method of radiator, electronic equipment and radiator
CN112484338A (en) * 2020-12-02 2021-03-12 天津瑞源电气有限公司 Anti-condensation refrigerating device and method for variable pitch system

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104703438A (en) * 2013-12-09 2015-06-10 中冶长天国际工程有限责任公司 Cooling device and system
CN104703437A (en) * 2013-12-09 2015-06-10 中冶长天国际工程有限责任公司 Cooling device and cooling system
CN104703437B (en) * 2013-12-09 2017-11-24 中冶长天国际工程有限责任公司 A kind of cooling device and system
CN104703438B (en) * 2013-12-09 2017-12-22 中冶长天国际工程有限责任公司 A kind of cooling device and system
CN110351978A (en) * 2019-06-06 2019-10-18 新华三技术有限公司 The control method of radiator, electronic equipment and radiator
CN110351978B (en) * 2019-06-06 2020-11-10 新华三技术有限公司 Heat dissipation device, electronic equipment and control method of heat dissipation device
CN112484338A (en) * 2020-12-02 2021-03-12 天津瑞源电气有限公司 Anti-condensation refrigerating device and method for variable pitch system

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Granted publication date: 20121121

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