CN202530149U - Easily welded mask plate for evaporation - Google Patents

Easily welded mask plate for evaporation Download PDF

Info

Publication number
CN202530149U
CN202530149U CN201220015932XU CN201220015932U CN202530149U CN 202530149 U CN202530149 U CN 202530149U CN 201220015932X U CN201220015932X U CN 201220015932XU CN 201220015932 U CN201220015932 U CN 201220015932U CN 202530149 U CN202530149 U CN 202530149U
Authority
CN
China
Prior art keywords
mask plate
layer
vapor deposition
welding
evaporation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201220015932XU
Other languages
Chinese (zh)
Inventor
魏志凌
高小平
郑庆靓
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kunshan Power Stencil Co Ltd
Original Assignee
Kunshan Power Stencil Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kunshan Power Stencil Co Ltd filed Critical Kunshan Power Stencil Co Ltd
Priority to CN201220015932XU priority Critical patent/CN202530149U/en
Application granted granted Critical
Publication of CN202530149U publication Critical patent/CN202530149U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Abstract

An easily welded mask plate for evaporation comprises an evaporation layer and a thickening layer, wherein the evaporation layer comprises an opening graphic area, and the thickening layer comprises a peripheral area outside the opening graphic area of the evaporation layer. The mask plate for evaporation has the advantages that faulty welding such as lack of penetration and welding penetration is avoided, the welding quality of the thin mask plate is improved, evaporation requirements and welding requirements of the mask plate and a mask frame are simultaneously met, the surface of the mask plate is smooth, and the mask plate is free of defects such as burrs and scratch, and has low surface roughness and uniform thickness.

Description

A kind of vapor deposition that is easy to weld is used mask plate
Technical field
The utility model relates to a kind of mask plate, is specifically related to a kind of vapor deposition that is easy to weld that is used to make el display device (OLED) and uses mask plate.
Background technology
Materials classification according to luminescent layer is different, and el display device (OLED) can be divided into inorganic EL display unit and organic electroluminescence display device and method of manufacturing same.Owing to compare with the inorganic EL display unit; Organic electroluminescence display device and method of manufacturing same can have higher brightness and time of response faster; And can color display, so in the field of organic electroluminescence display device and method of manufacturing same, obtained development at full speed in recent years.
Organic light-emitting display device comprises the organic luminous layer between anode and the negative electrode.Its principle of luminosity is that hole and electronics remove to produce the exciton of excited state from anode and negative electrode, and exciton reconfigures with luminous.As a rule, the formation method of the meticulous pattern of the film of formation organic light-emitting display device comprises photoetching method or the deposition method that uses patterned mask.
Because organic emission layer is to humidity sensitive, thereby use traditional photoetching method to be difficult to form organic emission layer.Therefore in photoresist layer and etching treatment procedure, the photoetching method that is exposed to moisture is inappropriate for the deposition organic emission layer.In order to address this problem, the method for using the mask plate with certain patterns to deposit organic emissive material has in a vacuum obtained widespread use.
Because evaporation process require to use is thin mask plate, make it have better vapor deposition effect, again so existing technology has been used the mask plate that is as thin as 10 μ m.
But simultaneously because the size of mask plate is too thin; And brought new problem: present technology is through welding process mask plate to be fixed on the mask frame, and thickness is thin more, difficult more welding; The phenomenon that occurs burn-through or not weld penetration easily; In general, if above-mentioned welding flaw can appear in the mask plate rack of fusion of thickness below 50 μ m.Because plate is thin more, just more difficult assurance parameters of welding for light gauge welding, if the laser energy of welding is higher, burn-through phenomenon (Fig. 4) will occur; If the laser energy of welding is on the low side, weldering will occurs and not wear phenomenon (Fig. 5).
So it is very urgent to prepare a kind of mask plate that can make thin plate be easy to weld to satisfy the vapor deposition requirement simultaneously.
The utility model content
The utility model is intended to solve above technical problem, and utility model is a kind of to have bilayer structure, comprises that the vapor deposition of vapor deposition layer and thickening layer is used mask plate, when guaranteeing to satisfy the vapor deposition requirement, satisfies the welding requirements of mask plate and mask frame again.Simultaneously, the utility model uses electroforming process to carry out the preparation of mask plate, to guarantee defectives such as mask plate smooth surface, no burr, cut, has the lower surfaceness and the size of uniform in thickness.
A kind of vapor deposition that is easy to weld is used mask plate, is made up of two-layer, comprising: the first layer is the vapor deposition layer, and the second layer is a thickening layer.
Wherein, the vapor deposition layer comprises the opening figure zone (Fig. 2) of satisfying the vapor deposition requirement.
Wherein, the zone of thickening layer be beyond the vapor deposition layer opening figure zone around (Fig. 2).
Preferably, the thickness of vapor deposition layer is 20-50 μ m.
Preferably, the thickness of thickening layer is 20-50 μ m.
The core technology of the utility model is to go up on the basis that the electroforming the first layer is the vapor deposition layer through pad pasting exposure imaging electroforming once more at core (substrate); Electroforming second layer thickening layer (Fig. 2) around the opening figure of vapor deposition layer is extra-regional; Promptly in the thickening of bond pad locations zone; To increase the metallic substance thickness of welding region, avoid the rack of fusion phenomenon.By technique scheme, the utility model has advantage and beneficial effect at least:
(1) avoids bad welding, like phenomenons such as not weld penetration, burn-through (Fig. 4, Fig. 5);
(2) improve the welding quality (Fig. 3) that approaches mask plate;
(3) satisfy welding requirements and vapor deposition requirement simultaneously.
Description of drawings
Above-mentioned and/or additional aspect of the utility model and advantage obviously with are easily understood becoming the description of embodiment from combining figs.
Fig. 1. the single layer mask plate
1-opening figure zone
2-bond pad locations (around Mask)
The 3-mask plate
Fig. 2. double-deck mask plate
The thickening of 1-frame bond pad locations, the electroforming second layer
2-the first layer mask plate (vapor deposition layer)
3-opening figure zone
Fig. 3. weld good synoptic diagram:
Fig. 4. not weld penetration (high-energy) synoptic diagram:
The 1-mask plate
The 2-mask frame
The 3-scolder
Fig. 5. burn-through (low-yield) synoptic diagram:
The 1-mask plate
The 2-mask frame
The 3-scolder
Embodiment
Describe the embodiment of the utility model below in detail, the example of said embodiment is shown in the drawings, and wherein identical from start to finish or similar label is represented identical or similar elements or the element with identical or similar functions.Be exemplary through the embodiment that is described with reference to the drawings below, only be used to explain the utility model, and can not be interpreted as restriction the utility model.
The utility model discloses a kind of vapor deposition that is easy to weld and uses mask plate, and this mask plate is made up of two-layer, and is as shown in Figure 2; Comprise: the first layer is the vapor deposition layer, and shown among Fig. 22, it comprises the opening figure zone; Shown among Fig. 23, the second layer is a thickening layer, shown among Fig. 21; It is the second layer of electroforming, and main purpose is with the position thickening that is used for solder joint around the mask plate, under the suitably thin prerequisite of the thickness of the vapor deposition layer (figure open area) that guarantees to be used for evaporated segment with vapor deposition; Increase the thickness of weld, to guarantee welding quality.
Itself and common vapor deposition are that with the key distinction of mask plate the mask plate of common welding usefulness does not have thickening layer, and is as shown in Figure 1.In order to obtain better effect when the vapor deposition, logical producing adopted the mask plate that is as thin as 10 μ m.And the thickness of mask plate is thin more, and the phenomenon of burn-through or not weld penetration appears in difficult more welding easily, in general, if welding flaw can appear in the mask plate rack of fusion of thickness below 50 μ m.Because plate is thin more, just more difficult assurance parameters of welding for light gauge welding, if the laser energy of welding is higher, the burn-through phenomenon will occur, and as shown in Figure 4, promptly scolder 3 is welded on the mask frame 2, and not bonding with mask plate 1.If the laser energy of welding is on the low side, weldering will occur and not wear phenomenon, as shown in Figure 5 is that scolder 3 still is trapped on the mask plate 1, and not bonding with mask frame.This dual mode all can cause the bonding bad of mask plate and mask frame, and can't reach the purpose of firm welding.
Generally, ideal welding should be as shown in Figure 3, promptly scolder 3 mask plate 1 and mask frame 3 are carried out firm bonding, thereby mask plate 1 is defined on the mask frame 3.Therefore, the utility model has been taked the vapor deposition zone treatment process different with the thickness of welding region, thereby when guaranteeing to satisfy the vapor deposition requirement, satisfies the welding requirements of mask plate and mask frame again.
Satisfy in the time of for assurance vapor deposition and welding requirements, the utility model also limits respectively the thickness of thickening layer and vapor deposition layer, and wherein, the thickness range of thickening layer is at 20-50 μ m, and the thickness range of vapor deposition layer is at 20-50 μ m.
In the description of this specification sheets, the description of reference term " embodiment ", " some embodiment ", " illustrative examples ", " example ", " concrete example " or " some examples " etc. means the concrete characteristic, structure, material or the characteristics that combine this embodiment or example to describe and is contained among at least one embodiment or example of the utility model.In this manual, the schematic statement to above-mentioned term not necessarily refers to identical embodiment or example.And concrete characteristic, structure, material or the characteristics of description can combine with suitable manner in any one or more embodiment or example.
Although illustrated and described the embodiment of the utility model; Those having ordinary skill in the art will appreciate that: under the situation of principle that does not break away from the utility model and aim, can carry out multiple variation, modification, replacement and modification to these embodiment, the scope of the utility model is limited claim and equivalent thereof.

Claims (5)

1. a vapor deposition that is easy to weld is used mask plate, is made up of two-layer, comprising: the first layer is the vapor deposition layer, and the second layer is a thickening layer.
2. the vapor deposition that is easy to weld according to claim 1 is used mask plate, it is characterized in that, the vapor deposition layer comprises the opening figure zone of satisfying the vapor deposition requirement.
3. the vapor deposition that is easy to weld according to claim 1 is used mask plate, it is characterized in that, the zone of thickening layer be beyond the vapor deposition layer opening figure zone around.
4. the vapor deposition that is easy to weld according to claim 1 is used mask plate, it is characterized in that, the thickness of vapor deposition layer is 20-50 μ m.
5. the vapor deposition that is easy to weld according to claim 1 is used mask plate, it is characterized in that, the thickness of thickening layer is 20-50 μ m.
CN201220015932XU 2012-01-16 2012-01-16 Easily welded mask plate for evaporation Expired - Fee Related CN202530149U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201220015932XU CN202530149U (en) 2012-01-16 2012-01-16 Easily welded mask plate for evaporation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201220015932XU CN202530149U (en) 2012-01-16 2012-01-16 Easily welded mask plate for evaporation

Publications (1)

Publication Number Publication Date
CN202530149U true CN202530149U (en) 2012-11-14

Family

ID=47131345

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201220015932XU Expired - Fee Related CN202530149U (en) 2012-01-16 2012-01-16 Easily welded mask plate for evaporation

Country Status (1)

Country Link
CN (1) CN202530149U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104118198A (en) * 2013-04-28 2014-10-29 昆山允升吉光电科技有限公司 Emulsion-free solar cell screen
CN111378923A (en) * 2018-12-28 2020-07-07 乐金显示有限公司 Mask and method for manufacturing the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104118198A (en) * 2013-04-28 2014-10-29 昆山允升吉光电科技有限公司 Emulsion-free solar cell screen
CN111378923A (en) * 2018-12-28 2020-07-07 乐金显示有限公司 Mask and method for manufacturing the same
CN111378923B (en) * 2018-12-28 2023-04-18 乐金显示有限公司 Mask and method for manufacturing the same

Similar Documents

Publication Publication Date Title
US8890133B2 (en) Support with a diffusing layer for an organic light-emitting diode device, and organic light-emitting device comprising such a support
TWI583562B (en) A fabrication method of a flexible electronic device
US9518344B1 (en) Mask, method of manufacturing a mask and method of manufacturing an OLED panel
RU2013128449A (en) METHOD FOR MANUFACTURING A PANEL INCLUDING A WEAR-RESISTANT LAYER AND A PANEL
CN109713009B (en) Electroluminescent device and manufacturing method thereof
CN106601768A (en) Transparent display device and preparation method therefor
DE102013110037B4 (en) Method for producing an optoelectronic component
CN206711922U (en) A kind of flexible display panels and Flexible Displays motherboard
JP5804162B2 (en) Top emission type organic electroluminescence display device manufacturing method and top emission type organic electroluminescence display device forming lid
CN202530149U (en) Easily welded mask plate for evaporation
CN104862646B (en) A kind of mask board component, display device and preparation method
CN103314642B (en) Organic EL luminous element and manufacture method thereof
WO2014153892A1 (en) Substrate encapsulation method
CN103205672B (en) A kind of preparation technology of the evaporation mask plate for being easy to welding
KR101970167B1 (en) Electrolytic copper foil and manufacturing method therefor
US6462470B1 (en) Organic electroluminescent display with three kinds of layer-stacked devices
KR20170031142A (en) Transparent diffusive oled substrate and method for producing such a substrate
CN103205683A (en) Easily weldable vapor plating mask plate and its preparation process
CN107863453B (en) OLED device based on end face packaging and preparation method thereof
CN110883439A (en) Flexible AMOLED cutting method
US20090294157A1 (en) Electro-optic device and method for manufacturing the same
CN206460978U (en) A kind of OLED and OLED luminaire that structure is taken out with light
CN106653807A (en) Surface mounting type OLED display unit device, display screen and manufacturing method thereof
TW201508965A (en) Organic semiconductor device
CN108893710A (en) Mask plate, Vapor deposition mask plate component and its manufacturing method, evaporated device

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
PP01 Preservation of patent right

Effective date of registration: 20190808

Granted publication date: 20121114

PP01 Preservation of patent right
PD01 Discharge of preservation of patent

Date of cancellation: 20220116

Granted publication date: 20121114

PD01 Discharge of preservation of patent
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20121114

Termination date: 20200116

CF01 Termination of patent right due to non-payment of annual fee