CN202496133U - Integrated flexible printed circuit board - Google Patents

Integrated flexible printed circuit board Download PDF

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Publication number
CN202496133U
CN202496133U CN2012200674509U CN201220067450U CN202496133U CN 202496133 U CN202496133 U CN 202496133U CN 2012200674509 U CN2012200674509 U CN 2012200674509U CN 201220067450 U CN201220067450 U CN 201220067450U CN 202496133 U CN202496133 U CN 202496133U
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CN
China
Prior art keywords
printed circuit
circuit board
flexible printed
conductive layer
insulated substrate
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2012200674509U
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Chinese (zh)
Inventor
宋成志
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BYD Co Ltd
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BYD Co Ltd
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Publication date
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Priority to CN2012200674509U priority Critical patent/CN202496133U/en
Application granted granted Critical
Publication of CN202496133U publication Critical patent/CN202496133U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

An integrated flexible printed circuit board comprises a first flexible printed circuit board and a second flexible printed circuit board, and a bulge formed through the welding between the first flexible printed circuit board and the second flexible printed circuit board. The first flexible printed circuit board comprises an insulating base layer, a conductive layer and an insulating cover film; the insulating base layer and a first conductive layer used for welding are respectively recessed opposite to the direction of the second flexible printed circuit board to form a corresponding recessed portion; and the insulating base layer is etched with a second conductive layer bonded to the insulating cover film of the second flexible printed circuit board to form a recessed hole used for accommodating the first conductive layer and the insulating base layer. Therefore, the thickness of a welded portion of the integrated flexible printed circuit board is obviously reduced and tends to be close to the thicknesses of the other portions of the integrated flexible printed circuit board, thereby, avoiding break-off of the welded portion of the integrated flexible printed circuit board and preventing failure of the integrated flexible printed circuit board.

Description

A kind of integrated flexible printed circuit board
Technical field
The utility model relates to a kind of integrated flexible printed circuit board.
Background technology
Flexible printed circuit board, English are FPC (Flexible Printed Circuit), have that thin thickness, light weight, circuit are intensive, bent, the characteristics of deflection, and particularly the thickness requirement to flexible printed circuit board is very high.Flexible printed circuit board is in some concrete application; Need at least two flexible printed circuit boards are welded as an integrated flexible printed circuit board; Liquid crystal display module that has touch-screen for example; Usually the connection flexible printed circuit board with touch-screen welds with scolding tin with the flexible printed circuit board that is connected backlight, forms an integrated flexible printed circuit board, obviously does advantage easy and simple to handle, with low cost like this.
Shown in Figure 1 is integrated flexible printed circuit board of the prior art; Comprise two flexible printed circuit boards 100,200; One of them flexible printed circuit board 100 comprises two conductive layers 102,103 that are provided with at interval; Be clamped in two between the conductive layer insulated substrate 101 and form two of these flexible printed circuit board two end opposite insulation epiphragmas 104,105; Said insulated substrate 101, conductive layer 102,103 and insulation epiphragma 104, bonding between 105 through adhesive; The conductive layer 104 of said flexible printed circuit board 100 has the solder side 114 that is used to weld; After another flexible printed circuit board 200 and above-mentioned flexible printed circuit board 100 usefulness scolding tin welding form an integrated flexible printed circuit board; Formed a scolding tin convexity 300, the gross thickness of so integrated flexible printed circuit board welding position is the thickness and the protruding 300 thickness sums of scolding tin of each flexible printed circuit board 100,200 welding position, and the thickness of obvious integrated flexible print circuit welding position is greater than the thickness of other positions of integrated flexible printed circuit board.Like this, the scolding tin that is used to weld protruding 300 is provided with respect to the surface of integrated flexible printed circuit board is obviously outstanding, is easy to generate integrated flexible printed circuit board and fractures in the welding position, causes the inefficacy of integrated flexible printed circuit board.
Summary of the invention
The utility model technical problem to be solved be to two flexible printed circuit boards in the prior art after being welded into an integrated flexible printed circuit board; The thickness of integrated flexible printed circuit board welding position is greater than the thickness of other positions of integrated flexible printed circuit board; Being easy to generate integrated flexible printed circuit board fractures in the welding position; The problem that causes integrated flexible printed circuit board to lose efficacy; A kind of integrated flexible printed circuit board welding position thickness, integrated flexible printed circuit board of effectively avoiding integrated flexible printed circuit board to fracture in the welding position of reducing is provided.
The above-mentioned technical problem of the utility model is achieved through following technical scheme: a kind of integrated flexible printed circuit board; Comprise first flexible printed circuit board; Be welded on second flexible printed circuit board on first flexible printed circuit board; And first convexity that forms of flexible printed circuit board and second flexible printed circuit board welding; Said first flexible printed circuit board comprises at least two conductive layers that are provided with at interval and is arranged alternately and is used for the insulating barrier of isolate conductive layers with said conductive layer; Said insulating barrier comprises two insulation epiphragmas that are bonded in the insulated substrate between the conductive layer and form first flexible printed circuit board, two opposite side; Wherein windowing near the insulation epiphragma of second flexible printed circuit board makes the conductive layer near second flexible printed circuit board of first flexible printed circuit board have the solder side that is connected with second flexible printed circuit board; Said insulated substrate with the conductive layer that is used to weld respectively to the direction depression that deviates from second flexible printed circuit board and form corresponding depressed part; Said solder side is arranged on the depressed part of conductive layer, and with form a shrinkage pool that is used for the depressed part of the ccontaining insulated substrate and first conductive layer away from the bonding conductive layer etching of the insulation epiphragma of second flexible printed circuit board.
Further; Said first flexible printed circuit board; Comprise two conductive layers that are provided with at interval, said conductive layer be respectively with bonding first conductive layer of the epiphragma that insulate and with the second bonding conductive layer of insulation epiphragma, and be bonded in two insulated substrate between the conductive layer.
Further, the depressed part shape of the depressed part of said first conductive layer and insulated substrate is suitable.
Further, the depressed part of said insulated substrate is fitted with the insulation epiphragma away from second flexible printed circuit board.
Further, the sectional area of said shrinkage pool is greater than the area of said solder side.
Further, said insulation epiphragma away from second flexible printed circuit board forms the suitable through hole of cross sectional shape, the depressed part of the common ccontaining insulated substrate of said through hole and shrinkage pool and first conductive layer at the position uplifting window corresponding with shrinkage pool.
Further, the depressed part of said insulated substrate is fair away from the end face of second flexible printed circuit board away from the end face and first flexible printed circuit board of second flexible printed circuit board.
A kind of integrated flexible printed circuit board that provides according to the utility model; Comprise first flexible printed circuit board; Be welded on second flexible printed circuit board on first flexible printed circuit board; And first convexity that forms of flexible printed circuit board and second flexible printed circuit board welding; Said first flexible printed circuit board comprises at least two conductive layers that are provided with at interval and is arranged alternately and is used for the insulating barrier of isolate conductive layers with said conductive layer; Said insulating barrier comprises two insulation epiphragmas that are bonded in the insulated substrate between the conductive layer and form first flexible printed circuit board, two opposite side; Wherein windowing near the insulation epiphragma of second flexible printed circuit board makes the conductive layer near second flexible printed circuit board of first flexible printed circuit board have the solder side that is connected with second flexible printed circuit board; Said insulated substrate with the conductive layer that is used to weld respectively to the direction depression that deviates from second flexible printed circuit board and form corresponding depressed part; Said solder side is arranged on the depressed part of conductive layer, and with form a shrinkage pool that is used for the depressed part of the ccontaining insulated substrate and first conductive layer away from the bonding conductive layer etching of the insulation epiphragma of second flexible printed circuit board.Said away from the shrinkage pool on the conductive layer of second flexible printed circuit board ccontaining depressed part and the depressed part of insulated substrate of conductive layer of depression with solder side; Make on the integrated flexible printed circuit board convexity also with solder side to shrinkage pool near; Integrated flexible printed circuit board obviously reduces at the thickness at place, welding position; The thickness of integrated flexible print circuit welding position is tending towards the thickness near other positions of integrated flexible printed circuit board; Effectively like this avoided integrated flexible printed circuit board to fracture, prevented integrated flexible printed circuit board in the welding position.
Description of drawings
Fig. 1 is the cutaway view of a kind of integrated flexible printed circuit board in the prior art.
Fig. 2 is the cutaway view of integrated flexible printed circuit board among first kind of embodiment providing of the utility model.
Fig. 3 is the cutaway view of integrated flexible printed circuit board among second kind of embodiment providing of the utility model.
Embodiment
For technical problem, technical scheme and beneficial effect that the utility model is solved clearer; Below in conjunction with accompanying drawing and embodiment; The utility model is further elaborated; Should be appreciated that specific embodiment described herein only in order to explanation the utility model, and be not used in qualification the utility model.
In the description of the utility model, need to prove that only if clear and definite regulation and qualification are arranged in addition, term " installation ", " linking to each other ", " connection " should be done broad understanding, for example, can be to be fixedly connected, also can be to removably connect, or connect integratedly; Can be mechanical connection, also can be to be electrically connected; Can be directly to link to each other, also can link to each other indirectly through intermediary, can be the connection of two element internals.For those of ordinary skill in the art, can concrete condition understand the concrete implication of above-mentioned term in the utility model.In addition, term " first ", " second " only are used to describe purpose, and can not be interpreted as indication or hint relative importance.
As shown in Figures 2 and 3; A kind of integrated flexible printed circuit board; Comprise first flexible printed circuit board 10; Be welded on second flexible printed circuit board 20 on first flexible printed circuit board 10; And first convexity 30 that forms of flexible printed circuit board 10 and the welding of second flexible printed circuit board 20; Said first flexible printed circuit board 10 comprises at least two conductive layers that are provided with at interval and is arranged alternately and is used for the insulating barrier of isolate conductive layers with said conductive layer; Two insulation epiphragmas 14,15 that said insulating barrier comprises the insulated substrate 11 that is bonded between the conductive layer and forms 10 liang of opposite side of first flexible printed circuit board; Wherein windowing near the insulation epiphragma 14 of second flexible printed circuit board 20 makes the conductive layer 12 near second flexible printed circuit board of first flexible printed circuit board 10 have the solder side 121 that is connected with second flexible printed circuit board 20; Said insulated substrate 11 with the conductive layer 12 that is used to weld respectively to the direction depression that deviates from second flexible printed circuit board 20 and form corresponding depressed part 110,120; The depressed part 120 that to be the depressed part that has of insulated substrate 11 110 have with conductive layer, said solder side 121 is arranged on the depressed part 120 of conductive layer 12, and forms a shrinkage pool 131 that is used for ccontaining insulated substrate 11 and conductive layer 12 depressed parts 110,120 with insulation epiphragma 15 bonding conductive layer 13 etchings away from second flexible printed circuit board 20.Said " windowing " and " etching " are the technical term in flexible printed circuit board field, and the insulation epiphragma " is windowed ", and the epiphragma that is about to insulate is removed appropriate section; Second conductive layer " etching " is about to second conductive layer and uses chemical reaction to remove appropriate section.
Cutaway view, the direction of dissecing and the Surface Vertical of integrated flexible printed circuit board of integrated flexible printed circuit board among first kind of embodiment that the utility model as shown in Figure 2 provides.In the present embodiment; Said first flexible printed circuit board 10; Comprise two conductive layers that are provided with at interval; Said conductive layer is a copper-foil conducting electricity, and conductive layer is respectively and bonding first conductive layer 12 of the epiphragma 14 of insulating and second conductive layer 13 bonding with insulation epiphragma 15, is bonded in two conductive layers 12, the insulated substrate between 13 11; Said first conductive layer 12, second conductive layer 13, insulated substrate 11 and insulation epiphragma 14,15; Bonding through adhesive, wherein the insulation epiphragma 14 near second flexible printed circuit board 20 makes first conductive layer 12 of first flexible printed circuit board 10 have the solder side 121 that is connected with second flexible printed circuit board 20, said insulated substrate 11 with first conductive layer 12 that is used to weld respectively to the direction depression that deviates from second flexible printed circuit board 20 and form corresponding depressed part 110,120; Said solder side 121 is arranged on the depressed part 120 of first conductive layer; And form a shrinkage pool 131 that is used for ccontaining insulated substrate 11 and first conductive layer, 12 depressed parts 110,120 with insulation epiphragma 15 bonding second conductive layer, 13 etchings away from second flexible printed circuit board 20, in the present embodiment, above-mentioned insulation epiphragma 15 away from second flexible printed circuit board 20; Do not window; Still complete, preferably, the depressed part 110 of said insulated substrate is fitted with the insulation epiphragma 15 away from second flexible printed circuit board 20.The depressed part 120 of first conductive layer 12 with solder side 121 of depression that the shrinkage pool 131 on said second conductive layer 13 is ccontaining and the depressed part 110 of insulated substrate 11; Make on the integrated flexible printed circuit board convexity 30 also with solder side 121 to shrinkage pool 131 near; Integrated flexible printed circuit board obviously reduces at the thickness at place, welding position; The thickness of integrated flexible print circuit welding position is tending towards the thickness near other positions of integrated flexible printed circuit board; Effectively like this avoided integrated flexible printed circuit board to fracture, prevented the generation of integrated flexible printed circuit board failure phenomenon in the welding position.
The depressed part 120 of said first conductive layer and depressed part 110 shapes of insulated substrate are suitable; Above-mentioned first conductive layer 12 just was designed to said concave shape with insulated substrate 11 before the welding of first flexible printed circuit board; Under the situation that does not need external force, the depressed part 120 of the conductive layer 12 of winning and the depressed part 110 of insulated substrate 11 are arranged in the shrinkage pool 131 like this; As other a kind of execution mode; Above-mentioned first conductive layer 12 just was designed to straight before 10 welding of first flexible printed circuit board with insulated substrate 11; In the welding process of integrated like this flexible printed circuit board; Need apply certain external force with insulated substrate 11 to first conductive layer 12; Make above-mentioned first conductive layer 12 and insulated substrate 11 depression take place and form corresponding depressed part 120,110, the depressed part 120 of the conductive layer 12 of winning and the depressed part 110 of insulated substrate 11 are arranged in the shrinkage pool 131.
Preferably, the sectional area of said shrinkage pool 131 is greater than the area of said solder side 121, and shrinkage pool 131 has enough spaces and is used for the depressed part 120 of the first ccontaining conductive layer 12 and the depressed part 110 of insulated substrate 11 like this.
Cutaway view, the direction of dissecing and the Surface Vertical of integrated flexible printed circuit board of integrated flexible printed circuit board among second kind of embodiment that the utility model as shown in Figure 3 provides.Integrated flexible printed circuit board among second kind of embodiment is the improvement on first kind of embodiment basis, and identical parts adopt identical drawing reference numeral, and identical component no longer is given unnecessary details.Insulation epiphragma 15 away from second flexible printed circuit board 20 in first flexible printed circuit board 10 that present embodiment provides is forming the suitable through hole 151 of cross sectional shape with shrinkage pool 131 corresponding position uplifting windows; The depressed part 110,120 of said through hole 151 and the shrinkage pool 131 common ccontaining insulated substrate 11 and first conductive layer 12; Said shrinkage pool 131 makes that with through hole 151 having more space is used for first conductive layer 12 of ccontaining generation depression and the depressed part 110,120 of insulated substrate 11; As long as change the angle of first conductive layer 12 and insulated substrate 11 depressions; Just can select the thickness of the convexity 30 of two flexible printed circuit boards, 10,20 welding formation better, make the thickness of integrated flexible print circuit welding position more be tending towards thickness near other positions of integrated flexible printed circuit board.
Preferably; The depressed part 110 of said insulated substrate maintains an equal level away from the end face 1101 of second flexible printed circuit board 20 and first flexible printed circuit board 10 end face 150 away from second flexible printed circuit board 20, promptly the depressed part 110 of said insulated substrate away from the end face 1101 of second flexible printed circuit board 20 and first flexible printed circuit board 10 away from the end face 150 of second flexible printed circuit board 20 on same plane.
The above is merely the utility model preferred embodiment; Not in order to restriction the utility model; Any modification of being done within all spirit and principles at the utility model, be equal to replacement and improvement etc., all should be included within the protection range of the utility model.

Claims (7)

1. integrated flexible printed circuit board; Comprise first flexible printed circuit board (10); Be welded on second flexible printed circuit board (20) on first flexible printed circuit board (10); And first convexity (30) that forms of flexible printed circuit board (10) and second flexible printed circuit board (20) welding; Said first flexible printed circuit board (10) comprises at least two conductive layers that are provided with at interval and is arranged alternately and is used for the insulating barrier of isolate conductive layers with said conductive layer; Two insulation epiphragmas (14,15) that said insulating barrier comprises the insulated substrate (11) that is bonded between the conductive layer and forms first flexible printed circuit board (10) two opposite side; Wherein has the solder side (121) that is connected with second flexible printed circuit board (20) near the insulation epiphragma (14) of second flexible printed circuit board (20) conductive layer near second flexible printed circuit board (12) that makes first flexible printed circuit board (10) of windowing; It is characterized in that; Said insulated substrate (11) and the conductive layer (12) that is used to weld are respectively to the direction depression that deviates from second flexible printed circuit board (20) and form corresponding depressed part (110,120); Said solder side (121) is arranged on the depressed part (120) of conductive layer (12), and with form a shrinkage pool (131) that is used for the depressed part (110,120) of ccontaining insulated substrate (11) and conductive layer (12) away from bonding conductive layer (13) etching of the insulation epiphragma (15) of second flexible printed circuit board (20).
2. integrated flexible printed circuit board as claimed in claim 1; It is characterized in that; Said first flexible printed circuit board (10); Comprise two conductive layers that are provided with at interval, said conductive layer be respectively with bonding first conductive layer (12) of the epiphragma (14) that insulate and with bonding second conductive layer (13) of insulation epiphragma (15), and be bonded in the insulated substrate (11) between two conductive layers (12,13).
3. integrated flexible printed circuit board as claimed in claim 2 is characterized in that, depressed part (110) shape of depressed part of said first conductive layer (120) and insulated substrate is suitable.
4. integrated flexible printed circuit board as claimed in claim 3 is characterized in that, the depressed part of said insulated substrate (110) is fitted with the insulation epiphragma (15) away from second flexible printed circuit board (20).
5. integrated flexible printed circuit board as claimed in claim 4 is characterized in that, the sectional area of said shrinkage pool (131) is greater than the area of said solder side (121).
6. integrated flexible printed circuit board as claimed in claim 5; It is characterized in that; Said insulation epiphragma (15) away from second flexible printed circuit board (20) forms the suitable through hole (151) of cross sectional shape, the depressed part (110,120) of said through hole (151) and the common ccontaining insulated substrate of shrinkage pool (131) (11) and first conductive layer (12) at the position uplifting window corresponding with shrinkage pool (131).
7. integrated flexible printed circuit board as claimed in claim 6; It is characterized in that the depressed part of said insulated substrate (110) maintains an equal level with the end face (150) of first flexible printed circuit board (10) away from second flexible printed circuit board (20) away from the end face (1101) of second flexible printed circuit board (20).
CN2012200674509U 2012-02-28 2012-02-28 Integrated flexible printed circuit board Expired - Fee Related CN202496133U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2012200674509U CN202496133U (en) 2012-02-28 2012-02-28 Integrated flexible printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2012200674509U CN202496133U (en) 2012-02-28 2012-02-28 Integrated flexible printed circuit board

Publications (1)

Publication Number Publication Date
CN202496133U true CN202496133U (en) 2012-10-17

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2012200674509U Expired - Fee Related CN202496133U (en) 2012-02-28 2012-02-28 Integrated flexible printed circuit board

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CN (1) CN202496133U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109315068A (en) * 2016-05-11 2019-02-05 伟创立汽车工业有限公司 Circuit unit and its manufacturing method
CN111142696A (en) * 2018-11-05 2020-05-12 上海和辉光电有限公司 Bendable touch screen
CN112913338A (en) * 2018-11-08 2021-06-04 罗伯特·博世有限公司 Circuit board system, electric energy storage and method for manufacturing circuit board system

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109315068A (en) * 2016-05-11 2019-02-05 伟创立汽车工业有限公司 Circuit unit and its manufacturing method
CN111142696A (en) * 2018-11-05 2020-05-12 上海和辉光电有限公司 Bendable touch screen
CN111142696B (en) * 2018-11-05 2023-04-28 上海和辉光电股份有限公司 Bendable touch screen
CN112913338A (en) * 2018-11-08 2021-06-04 罗伯特·博世有限公司 Circuit board system, electric energy storage and method for manufacturing circuit board system

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20121017

Termination date: 20210228

CF01 Termination of patent right due to non-payment of annual fee