CN202495433U - IC card package cold pressing die - Google Patents
IC card package cold pressing die Download PDFInfo
- Publication number
- CN202495433U CN202495433U CN2012201140941U CN201220114094U CN202495433U CN 202495433 U CN202495433 U CN 202495433U CN 2012201140941 U CN2012201140941 U CN 2012201140941U CN 201220114094 U CN201220114094 U CN 201220114094U CN 202495433 U CN202495433 U CN 202495433U
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- CN
- China
- Prior art keywords
- card
- stamping die
- face
- air
- cold stamping
- Prior art date
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- Expired - Fee Related
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Abstract
The utility model provides an IC card package cold pressing die which has an upper end face, a lower end face, a left end face and a right end face. The IC card package cold pressing die is internally provided with an air hole which is communicated with the upper end face and the lower end face. The IC card package cold pressing die also is internally provided with a cooling cycle water hole which is not communicated with the air hole. A water inlet and a water outlet of the cooling cycle water hole are arranged at the right end face of the die. In specific using, an air compressor fills air into the air hole, the air is discharged from an opening of the lower end face, a buffering force generated by air discharge is used, when in IC card package production, an impact force on an IC card surface by the cold pressing die is reduced, and a problem of damaging an IC card integrated circuit is prevented.
Description
Technical field
The utility model relates to a kind of cold stamping die, more specifically is meant a kind of cold stamping die that is used to encapsulate IC-card.
Background technology
At present the IC-card cold stamping die on the IC-card packaging machine is to adopt the cold pressing chip module of IC-card of encapsulation of the mode of cooling circulating water; The mold head of cold stamping die is a metal flat; And the middle body of the chip module of IC-card is integrated circuit block zone, the IC-card packaging machine when producing the surface of the chip module of IC-card because cold stamping die is colded pressing; Thus an impulsive force is caused in the integrated circuit zone of IC-card chip module; This impulsive force is damaged the inner integrated circuit of IC-card easily, causes the function of use of IC to lose efficacy, and causes the production waste product.
Summary of the invention
The main purpose of the utility model is to provide a kind of IC-card encapsulation cold stamping die, and this mould utilizes architecture advances to reduce the impulsive force of cold stamping die to IC-card chip module surface, prevents the problem of damaging the IC-card internal integrated circuit.Solve the surface of cold stamping die IC-card chip module of technology existence at present because cold stamping die is colded pressing; Thus the integrated circuit region of the chip of IC-card is caused an impulsive force; This impulsive force is damaged the inner integrated circuit of IC-card easily; Cause the function of use of IC to lose efficacy, cause the problem of producing waste product.
Another purpose of the utility model is to provide a kind of IC-card encapsulation cold stamping die; The air vent hole of its upper surface of the conducting of this its set inside of mould and lower surface; Utilize air at the cushion effect that its lower surface discharging produces, reduce the impulsive force of cold stamping die IC-card chip module surface.
Another purpose of the utility model provides a kind of IC-card encapsulation cold stamping die, and this mould structure is simple, be easy to realize, can be widely used in the existing IC-card packaging machine equipment.
The technical scheme that the utility model adopts is following.
A kind of IC-card encapsulation cold stamping die; It has upper surface, lower surface, left side and right side; The set inside of said IC-card encapsulation cold stamping die has the air vent hole of its upper surface of conducting and lower surface; The inside of said IC-card encapsulation cold stamping die also is provided with the cool cycles aquaporin, and this cool cycles aquaporin has water inlet, delivery port, and said water inlet, delivery port are arranged on the right side.
Said lower surface is a cooling and plane, and the outlet of said air vent hole in said lower surface is positioned at the middle part of lower surface.
The place, aperture of the air vent hole of said upper surface is equipped with appendix.
In the said appendix air pressure regulator is installed.
The water inlet of said right side, delivery port all are equipped with water pipe.
The beneficial effect of the utility model is: the utility model structurally has upper surface, lower surface, left side and right side; The set inside of this IC-card encapsulation cold stamping die has the air vent hole of its upper surface of conducting and lower surface; The inside of this IC-card encapsulation cold stamping die also is provided with the cool cycles water hole that does not connect with this air vent hole, and the water inlet in this cool cycles water hole, delivery port are arranged on this right side.In concrete the use; Air compressor machine is input to air in this air vent hole; Air is from this externally discharging of place, aperture, lower surface, and the cushion effect that utilizes the air discharging to produce is when the IC-card encapsulation is produced; Reduce the impulsive force of cold stamping die, prevent the problem of damaging the IC-card internal integrated circuit the IC-card surface.
Description of drawings
Fig. 1 is the cross-sectional view of the utility model.
Fig. 2 is the cross-sectional view of the air vent hole of the utility model.
Fig. 3 is the cross-sectional view in the cool cycles water hole of the utility model.
Embodiment
Extremely shown in Figure 3 like Fig. 1 is a kind of preferable practical implementation example of the utility model; A kind of IC-card encapsulation cold stamping die 10; It has upper surface 11, lower surface 12, left side 13 and right side 14; The set inside of this IC-card encapsulation cold stamping die 10 has the air vent hole 15 of its upper surface 11 of conducting and lower surface 12; The inside of this IC-card encapsulation cold stamping die 10 also is provided with the cool cycles water hole 16 that does not connect with this air vent hole 15, and the water inlet 161 in this cool cycles water hole 16, delivery port 162 are arranged on this right side 14.
Further, the utility model is in concrete the use, and its lower surface 12 is a cooling and plane, and this air vent hole 15 is the midway that are positioned at this lower surface 12 at the place, aperture of this lower surface 12.
The place, aperture of this air vent hole 15 of this upper surface 11 is equipped with appendix 151, in this appendix 151 air pressure regulator 152 is installed, in concrete the use; This appendix 151 connects with air compressor machine; Air compressor machine is input to air in this air vent hole 15, and air is from this externally discharging of place, 12 apertures, lower surface, through regulating the air pressure size of air pressure regulator 152; The cushion effect that utilizes the air discharging to produce; When the IC-card encapsulation is produced, reduce the impulsive force of cold stamping die to IC-card chip module surface, prevent the problem of damaging the IC-card internal integrated circuit.
Embodiment of the utility model and accompanying drawing are just in order to show the design concept of the utility model, and the protection range of the utility model should not be confined to this embodiment.
In a word; The above is merely the preferred embodiment of the utility model; Not in order to restriction the utility model, any modification of being done within all spirit at the utility model and the principle, be equal to and replace and improvement etc., all should be included within the protection range of the utility model.
Claims (5)
1. an IC-card encapsulates cold stamping die; It has upper surface, lower surface, left side and right side; It is characterized in that: the set inside of said IC-card encapsulation cold stamping die has the air vent hole of its upper surface of conducting and lower surface; The inside of said IC-card encapsulation cold stamping die also is provided with the cool cycles aquaporin, and this cool cycles aquaporin has water inlet, delivery port, and said water inlet, delivery port are arranged on the right side.
2. a kind of IC-card encapsulation cold stamping die as claimed in claim 1 is characterized in that said lower surface is a cooling and plane, and the outlet of said air vent hole in said lower surface is positioned at the middle part of lower surface.
3. a kind of IC-card encapsulation cold stamping die as claimed in claim 2 is characterized in that the exit of the air vent hole of said upper surface is equipped with appendix.
4. a kind of IC-card encapsulation cold stamping die as claimed in claim 3 is characterized in that, in the said appendix air pressure regulator is installed.
5. a kind of IC-card encapsulation cold stamping die as claimed in claim 1 is characterized in that the water inlet of said right side, delivery port all are equipped with water pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012201140941U CN202495433U (en) | 2012-03-24 | 2012-03-24 | IC card package cold pressing die |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012201140941U CN202495433U (en) | 2012-03-24 | 2012-03-24 | IC card package cold pressing die |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202495433U true CN202495433U (en) | 2012-10-17 |
Family
ID=47001646
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012201140941U Expired - Fee Related CN202495433U (en) | 2012-03-24 | 2012-03-24 | IC card package cold pressing die |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202495433U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112542393A (en) * | 2020-12-10 | 2021-03-23 | 温州大学 | Discharging device for integrated circuit packaging mold |
-
2012
- 2012-03-24 CN CN2012201140941U patent/CN202495433U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112542393A (en) * | 2020-12-10 | 2021-03-23 | 温州大学 | Discharging device for integrated circuit packaging mold |
| CN112542393B (en) * | 2020-12-10 | 2023-06-02 | 温州大学 | Discharging device for integrated circuit packaging mold |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121017 Termination date: 20180324 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |