CN202485627U - Three-dimensional detection apparatus for integrated circuit pin - Google Patents
Three-dimensional detection apparatus for integrated circuit pin Download PDFInfo
- Publication number
- CN202485627U CN202485627U CN2011205236169U CN201120523616U CN202485627U CN 202485627 U CN202485627 U CN 202485627U CN 2011205236169 U CN2011205236169 U CN 2011205236169U CN 201120523616 U CN201120523616 U CN 201120523616U CN 202485627 U CN202485627 U CN 202485627U
- Authority
- CN
- China
- Prior art keywords
- pin
- chip
- image
- detected
- processing unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
Links
Images
Landscapes
- Length Measuring Devices By Optical Means (AREA)
Abstract
The utility model discloses a three-dimensional detection apparatus for an integrated circuit pin. The three-dimensional detection apparatus for an integrated circuit pin comprises image acquisition units (2, 3), a planar mirror (4), a light source (5), a reflector panel (6) and an image detection processing unit (1). After a chip to be detected (8) is arranged below the reflector panel (6), the light beam emitted by the light source (5) is reflected to irradiate the chip to be detected (8), then the light beam is reflected by the planar mirror (4) to the image acquisition units (2, 3) which are connected with the image detection processing unit (1), the image acquisition units (2, 3) acquire the images of the chip to be detected (8), the acquired images are sent to the image detection processing unit (1), and three-dimensional detection to the pin of the chip is realized after process. According to the utility model, pin lack and break of the chip can be automatically detected, so do the profile geometrical key parameter information such as width, spacing and stack height of the chip pin, and the chip is determined to be whether qualified.
Description
Technical field
The utility model relates to the IC chip detection range; Be particularly related to a kind of ic pin three-dimensional detection device and method; Can detect pin width, spacing, lack, lose, how much key parameters of profile such as stack height and judge whether chip qualified; Can well be directed against how much key parameters of the flat encapsulation of square (Plastic Quad Flat Package is called for short QFP) its profile of chip detection.
Background technology
IC chip (IC) needs could guarantee its quality through detecting after packaging process is accomplished; And the detection of packaged chip pin three-dimensional appearance is exactly the important ring in the packaged chip detection link.Iff detects the electric property of packaged chip, detects and ignore outward appearance, and it is qualified and there is the chip of defective in outward appearance then possibly to export electric property, must cause product percent of pass to descend like this, influences product brand.
Usually the method that adopts artificial naked eyes to detect is traditionally carried out outward appearance to packaged chip and is detected, but this method obviously exists that efficient is low, poor reliability and the high defective of labour cost.The traditional detection method of this backwardness for a change, China invests research and development packaged chip outward appearance automatic checkout equipment energetically.At present, the appearance delection device based on computing machine and associated picture Processing Algorithm more and more widely is applied in the industrial circle.This device is made up of computing machine, image acquisition equipment and corresponding software; By the appearance images of image acquisition equipment acquisition object, handle image by software through the associated picture Processing Algorithm and obtain correlation parameter, accomplish the detection task.This device can substitute the manual detection method, and the outward appearance of the completion packaged chip of high-speed and high-efficiency, high-accuracy detects.
The packaged chip pin-pitch that the QFP encapsulation technology realizes is very little, and pin is very thin, and general extensive or VLSI (very large scale integrated circuits) adopts this packing forms, and its number of pins is generally all more than 100.Easy to operate during this technology packaged chip, reliability is high; And its packaging appearance size is less, and parasitic parameter reduces, and is fit to frequency applications; This technology mainly is applicable to surface mounting technology (SMT) installation wiring on PCB.
The QFP encapsulation technology is one of surface mounting technology, and pin is drawn from four sides and is gull wings (L) type; Pin centre distance has plurality of specifications such as 1.0mm, 0.8mm, 0.65mm, 0.5mm, 0.4mm, 0.3mm.The qualified QFP chip of a slice outward appearance is had, profile key parameters such as the width of pin, spacing, flexibility, stack height is had strict requirement, with the difference of standard value must be in the margin tolerance that allows.
Now existing appearance delection device based on computer vision technique exist precision low, stablize problems such as qualitative poor, consuming time length and software performance difference, can't be suitable for chip encapsulation technology high-speed, high precision, reliable and stable demand for development.
The utility model content
The purpose of the utility model is to overcome the shortcoming and the deficiency of prior art; A kind of ic pin three-dimensional detection device is provided; Can detect software systems through the ic pin three-dimensional appearance and carry out the device that outward appearance detects, have simple to operate, high speed and super precision, reliable and stable characteristics pin.
The purpose of the utility model also is to provide the ic pin three-dimensional appearance detection method that is realized by said apparatus.
The purpose of the utility model realizes through following proposal:
A kind of ic pin three-dimensional detection device; Comprise image acquisition units, plane mirror, light source, reflector and image detection processing unit; Chip to be detected is arranged on the reflector below, and the light beam that said light source sends is radiated on the chip to be detected after the reflector reflection, after the plane mirror emission, incides image acquisition units again; This image acquisition units is connected with the image detection processing unit; The image acquisition units collection obtains the image of chip to be detected, is sent to the image detection processing unit, can realize after treatment the three-dimensional of chip pin is detected.
The utility model has following advantage with respect to prior art:
(1) can detect automatically to the ic pin three-dimensional appearance, and simple to operate, detection system is stable, efficient is high and precision is high.
(2) this detection system has three kinds of operational modes, i.e. autosensing mode, manual online detecting pattern and manual offline inspection pattern, and the user is the selective system operational mode as required.
Description of drawings
Fig. 1 is an ic pin three-dimensional appearance pick-up unit structural representation.
Fig. 2 is the structural representation of detection module.
Fig. 3 is the testing process figure of detection module.
Fig. 4 is the decision flow chart of pin disappearance.
Fig. 5 is the light path synoptic diagram.
Among the figure: the 1PC machine; The 2CCD camera; 3 camera lenses; Four plane mirrors around 4 distributions; 5 light sources; 6 reflectors; 8 chips to be measured.
Embodiment
Below in conjunction with accompanying drawing and embodiment the utility model is done further explain.
As shown in Figure 1; The utility model ic pin three-dimensional detection device comprises image acquisition units, plane mirror 4, light source 5, reflector 6 and image detection processing unit 1, and chip 8 to be detected is arranged on reflector 6 belows; The light beam that said light source 5 sends is radiated on the chip to be detected 8 after reflector 6 reflections; After plane mirror 4 emissions, incide image acquisition units again, this image acquisition units is connected with image detection processing unit 1, and the image acquisition units collection obtains the image of chip 8 to be detected; Be sent to image detection processing unit 1, can realize after treatment the three-dimensional of chip pin is detected.
As shown in Figure 2, said image detection processing unit 1 comprises camera control module 11, image demarcating module 12 and image detection module 14.
Camera control module 11 is used for image acquisition units, comprises that external trigger adopts chart-pattern and adopt chart-pattern continuously, accomplishes IMAQ and sends the IMAQ signal that finishes to system.
The 12 main realizations of image demarcating module are made, are preserved and load and demarcate file function, and image is carried out treatment for correcting.
Image detection module 14 realizes the measuring ability of all pin key parameters and judges whether chip is qualified, preserves testing result.The pin parameter that detects comprises two-dimensional parameter (lack, lose, width, spacing, deviation, flexibility, span, row are curved, inclination etc.) and three-dimensional parameter (stack height, coplane degree etc.) profile geometry key parameters.
The image detection processing unit 1 of the appearance delection device of the utility model can also comprise parameter management module 13 and statistical module 15 as a result.Parameter management module 13 is main realize the pin parameters editor, revise, be saved on the disk and function such as parameter acquiring.Statistical module 15 major functions are for generating product final report, the single batch of final report, product accounting, the single batch of statistics, 5 kinds of forms of indicator-specific statistics as a result; And the demonstration of each form, preservation, deletion and printing.
1 work of image detection processing unit may further comprise the steps: at first get into demarcating module 12, the demarcation file is demarcated and preserved to camera; Then get into parameter management module 13, select the detection chip model of wanting and the tolerance value of respective standard parameter value and permission is set; Send signal controlling CCD camera and adopt figure, image is shown on the interface in real time; Through 14 pairs of image processing and analyzings of being gathered of detection module, and preserve testing result in database; Compare with standard value, judge according to the allowable tolerance value whether chip is qualified.
Image detection processing unit 1 mode of operation comprises automatic detection detecting pattern, manual online detecting pattern and manual offline inspection pattern: autosensing mode is that pick-up unit detects in the separation system as a module job at chip automatically; And can with other module communication, the collaborative work of accomplishing chip detection and sub-electing specification product; Manual online detecting pattern is that pick-up unit works alone, and detects software systems control CCD camera and adopts figure, then image is handled, and obtains testing result; Manually the offline inspection mode class is like manual online detecting pattern, and just image credit is in disk.
As shown in Figure 3, pin senses module testing process figure, the pin senses module is to realize the nucleus module of ic pin three-dimensional detection device image detection processing unit.Its flow process may further comprise the steps:
(1) according to demarcating correcting image distortion;
(2) to gather to such an extent that image carries out rim detection, obtain bottom view in surface level with the angle of camera coordinates system;
(3) image segmentation intercepting bottom view and according to angle rotation bottom view, the camera coordinates system in the surface level ajusts image relatively;
(4) edge extracting obtains the detection reference in bottom view and four side views, and benchmark is the central point on each limit of chip basal body, and loads the detection block in each pin district according to benchmark;
(5) detect pin width and spacing: edge extracting; Obtain the marginal position of pin striped and the point midway between the edge; The edge spacing of striped is the pin width of institute's detection chip; Distance between the adjacent stripes mid point is lead pin pitch, and writes down testing result with array, and array length is corresponding with institute detection chip number of pins;
(6) ask the pin disappearance according to lead pin pitch, comprise pin disappearance position, the disappearance number of pin;
(7) according to pin disappearance information width and spacing are reset, made it corresponding, its value is changed to 0 for the position that lacks with the physical location of pin;
(8) edge extracting obtains the pin fringe area, obtains each pin middle part coordinate position according to stripe edge, and the pin end location is also reset data according to disappearance information, and calculate flexibility;
(9) detect each pin end location in each side view, reach each pin district informal voucher line point midway in the side view, and data are reset according to disappearance information; Through obtain these in point coordinate with the least square fitting straight line, ask the pin length in the side view with this straight line as datum line;
(10) through each pin end mid point coordinate Calculation deviation, coplane degree, span, curved, the inclination of row in the bottom view; High according to the pin length computation stack in the lateral plan;
(11) judge according to testing result whether chip is qualified.
Pin disappearance decision flow chart as shown in Figure 4 is mainly obtained pin disappearance information such as chip pin disappearance location index and disappearance quantity.Its step mainly comprises:
(1) detected pin number and standard pin number are compared, confirm pin disappearance sum;
(2) disappearance of head end is judged, according to detected pin first place put the side benchmark apart from d, and should judge apart from difference of theoretical value D in the chip parameter.Then the number of pins of first topagnosis is:
k＝[d/D+0.5]；
(3) according to the lead pin pitch P [i] of pin normal pitch P with middle certain position, calculating pin disappearance number is: k=[P [i]/P+0.5]-1;
(4) terminal if any the pin disappearance, then lack total disappearance number that number calculates for (1) deduct disappearance number that (2) and (3) calculate with;
(5) when calculating the disappearance number, write down the index that respectively lacks the position successively, disappearance information is saved among the result goes.
As shown in Figure 5, in the step (10) described in the pin senses module testing process according to the high method of pin length computation stack in the lateral plan be:
Stoff representes stack high (for chip parameter to be calculated); Slead representes pin length in the side view (for Flame Image Process gained parameter); Fb representes the distance (for chip known parameters) of pin end to chip basal body; θ representes the angle between incident ray and horizontal line, the parameter value of when light path design, confirming; Then computing formula is:
stoff＝slead/cosθ-fb*tanθ。
The alternative conventional artificial detection method of the utility model overcomes the deficiency that has the integrated circuit encapsulation chip detection technique, realizes pin senses technology automatic, stable, high speed and super precision, has improved efficient greatly.
Claims (1)
1. an ic pin three-dimensional detection device is characterized in that, comprises image acquisition units (2; 3), plane mirror (4), light source (5), reflector (6) and image detection processing unit (1), chip to be detected (8) is arranged on reflector (6) below, the light beam that said light source (5) sends is radiated on the chip to be detected (8) after reflector (6) reflection; After plane mirror (4) emission, incide image acquisition units (2 again; 3), this image acquisition units (2,3) is connected with image detection processing unit (1); Image acquisition units (2; 3) gather the image that obtains chip (8) to be detected, be sent to image detection processing unit (1), can realize after treatment the three-dimensional of chip pin is detected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205236169U CN202485627U (en) | 2011-12-14 | 2011-12-14 | Three-dimensional detection apparatus for integrated circuit pin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205236169U CN202485627U (en) | 2011-12-14 | 2011-12-14 | Three-dimensional detection apparatus for integrated circuit pin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202485627U true CN202485627U (en) | 2012-10-10 |
Family
ID=46960044
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011205236169U Withdrawn - After Issue CN202485627U (en) | 2011-12-14 | 2011-12-14 | Three-dimensional detection apparatus for integrated circuit pin |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202485627U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103196920A (en) * | 2013-03-27 | 2013-07-10 | 贵州蓝科睿思技术研发中心 | System and method for automatically detecting defects of gem crystal |
| CN105424714A (en) * | 2015-12-21 | 2016-03-23 | 南京河豚自动化科技有限公司 | Multi-pin-based defect detection device and detection method thereof |
| CN105717136A (en) * | 2016-01-28 | 2016-06-29 | 浙江工业大学 | Pin inclination defect detecting method based on machine vision |
-
2011
- 2011-12-14 CN CN2011205236169U patent/CN202485627U/en not_active Withdrawn - After Issue
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103196920A (en) * | 2013-03-27 | 2013-07-10 | 贵州蓝科睿思技术研发中心 | System and method for automatically detecting defects of gem crystal |
| CN105424714A (en) * | 2015-12-21 | 2016-03-23 | 南京河豚自动化科技有限公司 | Multi-pin-based defect detection device and detection method thereof |
| CN105424714B (en) * | 2015-12-21 | 2018-04-27 | 南京河豚自动化科技有限公司 | The defects of based on multi-pipe pin detection device and its detection method |
| CN105717136A (en) * | 2016-01-28 | 2016-06-29 | 浙江工业大学 | Pin inclination defect detecting method based on machine vision |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102313745B (en) | Three-dimensional detection device of integrated circuit base pins and detection method | |
| CN103299177B (en) | Soldering inspection method and base plate inspection system and soldering inspection machine | |
| CN102425997B (en) | Tire shape measuring system | |
| US7746481B2 (en) | Method for measuring center of rotation of a nozzle of a pick and place machine using a collimated laser beam | |
| US8249304B2 (en) | System and method for measuring gaps between object parts | |
| US20100021068A1 (en) | System and method for extracting boundary elements of an object | |
| CA2908521C (en) | Method and system for determining the spatial structure of an object | |
| CN105184793A (en) | Electric energy meter sample appearance and PCB element detection method | |
| CN109855562A (en) | Measurement of rail wear method and device | |
| CN202485627U (en) | Three-dimensional detection apparatus for integrated circuit pin | |
| CN103090792A (en) | Method and device which are based on machine vision and used for automatic and separate detection of unaccepted ball-pin product | |
| CN108731602A (en) | Object thickness measurement system, method, detection device and computer program product | |
| CN107607064A (en) | LED fluorescent powder glue coating planeness detection system and method based on a cloud information | |
| CN109978938A (en) | A kind of pillow spring detection method based on machine vision | |
| EP3916677A1 (en) | Three-dimensional measurement device | |
| CN100385197C (en) | Portable railless-structured optical three-D scanning measuring system and measuring method therefor | |
| CN113124763A (en) | Optical axis calibration method, device, terminal, system and medium for optical axis detection system | |
| CN105424721A (en) | Metal strain gauge defect automatic detection system | |
| CN108507484A (en) | Bundled round steel multi-vision visual identifying system and method for counting | |
| CN101907490B (en) | Method for measuring small facula intensity distribution based on two-dimension subdivision method | |
| CN100359286C (en) | Method for improving laser measuring accuracy in image processing | |
| CN204705323U (en) | A kind of car body controller connector pin normotopia degree pick-up unit | |
| CN104515477A (en) | Three-dimensional measurement device, three-dimensional measurement method, and manufacturing method of substrate | |
| CN105387812A (en) | Measuring gauge electronization method and device of oil well pipe | |
| Krotova et al. | Development of a trajectory planning algorithm for moving measuring instrument for binding a basic coordinate system based on a machine vision system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20121010 Effective date of abandoning: 20130123 |
|
| C20 | Patent right or utility model deemed to be abandoned or is abandoned |