CN202447778U - Liquid nitrogen-cooled reflow soldering system - Google Patents
Liquid nitrogen-cooled reflow soldering system Download PDFInfo
- Publication number
- CN202447778U CN202447778U CN2012200655813U CN201220065581U CN202447778U CN 202447778 U CN202447778 U CN 202447778U CN 2012200655813 U CN2012200655813 U CN 2012200655813U CN 201220065581 U CN201220065581 U CN 201220065581U CN 202447778 U CN202447778 U CN 202447778U
- Authority
- CN
- China
- Prior art keywords
- liquid nitrogen
- heating
- temperature
- reflow soldering
- nitrogen
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
Links
Images
Abstract
The utility model discloses a reflow soldering system, which comprises a sealed test chamber, a working turntable, an electric heating device and a liquid nitrogen cooling device, wherein the sealed test chamber is filled with nitrogen; the working turntable is arranged in the test chamber, and consists of a rotating shaft and a turntable; the turntable is fixed on the rotating shaft, rotates together with the rotating shaft, and is used for placing an electronic component to be soldered and a solder; the electric heating device comprises a power supply, an electric heating element and a corresponding fan; and the liquid nitrogen cooling device comprises an auto-boosting liquid nitrogen tank, a liquid nitrogen distributor, a low temperature valve and a corresponding fan. By the reflow soldering system, a protective gas can be electrically heated by utilizing nitrogen, and liquid nitrogen is used for cooling, so that the technical effects of uniform solder heating and cooling, one-step batch soldering and the like in a mionectic environment can be achieved.
Description
Technical field
The utility model relates to welding field, more specifically, relates to a kind of reflow soldering system.
Background technology
At present, the reflow ovens of big-and-middle-sized welding printed base plate generally is made up of heating zone, heat preservation zone, weld zone and cooling zone, and small-sized reflow soldering furnace then adopts and realizes heating and cooling in the chamber.In the welding process, solder cream solidifies from being molten to, and forms a finished product electronic circuit thus.
As the heating arrangements of reflow soldering, prior art adopts infrared heater and hot blast heater usually.Infrared heater adopts quartz ampoule to carry out Infrared Heating mostly.The temperature control of this heating means is difficulty comparatively.The hot blast mode of heating then has the heat transference efficiency height, the heating efficiency excellent characteristics.
As the type of cooling of reflow soldering, prior art generally then adopts fan cooled.Adopt air cooling effect relatively poor relatively, and cooling velocity is slow, cooling does not then reach requirement fast if desired.In pb-free solder technology, reach higher intensity in order to make solder joint, the pb-free solder after need complete fusion being refluxed is carried out quench cooled, and this just needs a kind of new type of cooling.And the technical scheme bubbling air in reflow ovens that adopts at present, air forms hot-air after the heating of the thermal treatment zone of reflow ovens, and the Hot air quilt fan blows to scolder and carries out the fusion backflow again.After treating that the complete fusion of scolder refluxes, in reflow ovens, feed cold air again, the heater of the while closing volume stove thermal treatment zone, cold air blows to the lead-free solder of complete fusion through the thermal treatment zone.The shortcoming of this scheme is, when the scolder that the cooling fusion refluxes, just the heat generating core of the thermal treatment zone is closed, but heat generating core also has surplus heat, and cold air temperature behind heat generating core can raise, so cold air can not promptly reach the standard of chilling temperature.
In order to reduce high-temperature oxydation, people's more and more inert gas or vacuum of adopting in welding process are protected.Carry out reflow soldering under the vacuum, then require reflow soldering to have the better seal performance, also will increase vacuumizing device.And inert gas is relatively more expensive, adopts inert gas to make protection gas, then can increase the cost of welding.
In addition, reflow soldering has certain requirement to heating situation in the stove and temperature homogeneity.If during heating, the temperature of the thermal treatment zone fluctuates up and down, then printed circuit board (PCB) can not be caused overheated to part property and underheat, thereby make electronic component do not melted by fire damage and soldering paste by heating equably.So formation temperature uniform heating or cooled region in the working region of reflow soldering furnace, seem is necessary very much.
The utility model content
The purpose of the utility model is to provide a kind of nitrogen that utilizes to carry out electrical heating, utilize liquid nitrogen to realize the reflow soldering system of cooling simultaneously as protective gas, and the environment that is implemented in few oxygen thus can carry out the technique effect of aspects such as scolder heating, solder cools and disposable welding in enormous quantities down equably.
According to an aspect of the utility model, a kind of reflow soldering system is provided, this system comprises:
Inside is full of the chamber that nitrogen is sealing state;
Working rotary table, this working rotary table are arranged in the said chamber, are made up of rotating shaft and rotating disk, and said rotating disk is fixed in the rotating shaft, rotates together with rotating shaft, are used to place electronic devices and components to be welded and scolder;
Electric heater unit, this electric heater unit comprise power supply, power supply constitutes the loop and is arranged on the heating of said working rotary table one side therewith, and are arranged near the fan that is used for the nitrogen after the heating is blowed to the working rotary table zone heating;
The cooled with liquid nitrogen device; This cooled with liquid nitrogen device comprise be used to store liquid nitrogen from the supercharging liquid nitrogen container, with the liquid nitrogen distributor that is communicated with and is arranged on the other side of said working rotary table from the supercharging liquid nitrogen container, be used to control from being communicated with or the low temperature valve of disconnection between supercharging liquid nitrogen container and the liquid nitrogen distributor, and be arranged on and be used near the liquid nitrogen distributor gas in liquid nitrogen steam and the chamber is stirred the fan that mixes.
The above technical scheme of conceiving according to the utility model; To reflow soldering furnace in the prior art is to rely on radiation heating to weld mostly; The temperature that the utilization ratio of its heating is on the low side to be difficult to reach big zone evenly and in welding process, utilize fan cooled can't reach the technological deficiency of chilling; Through adopting electrical heating nitrogen and utilizing fan to produce convection current, utilize the mode and the supporting structure thereof of cooled with liquid nitrogen simultaneously; Can under the environment of few oxygen, realize reflow soldering, and can reach the well temperature homogeneity in big zone, can realize cooling fast simultaneously.
In addition; After the heating heating; Adopt fan to blow to the working rotary table zone to hot nitrogen the working region temperature is raise, owing to there is nitrogen to blow on heating, heating can not produce local high temperature; Therefore even if can guarantee heating element heater in the temperature more than 500 ℃, high-temperature chemical reaction can not take place in nitrogen yet.Through adopting nitrogen to cool off, can fast cooling and cooling rate controlled.After the liquid nitrogen spout ejection of liquid nitrogen from the liquid nitrogen distributor, the evaporation heat absorption is with refrigeration work rotating disk zone.After liquid nitrogen vaporization produces cold energy, can also serve as the nitrogen atmosphere in the chamber, impel old nitrogen to drain, so can also strengthen " metabolism " of nitrogen from atmospheric valve.Adopt fan disturbance liquid nitrogen steam, can prevent that like this liquid nitrogen ejection back from producing local overcooling.
As further preferably, said working rotary table comprises a plurality of rotating disks, and these rotating disks are fixedly mounted on the differing heights position of said rotating shaft, and the card of rotating disk has a plurality of open-celled structures separately.
Because working rotary table comprises a plurality of locational rotating disks of differing heights that are in, can increase the zone of welding greatly, simultaneously disposablely carry out large batch of production.In addition,, can accelerate the process of air-flow thus, the heating and cooling process is all produced desirable influence because each rotating disk has a plurality of open-celled structures on its card.
As further preferably, said heating is resistance heating wire or electrothermal tube, and near the said fan that is used for the nitrogen after the heating is blowed to the working rotary table zone heating that is arranged on is processed by heat proof material.
The utility model is when increasing the cooled with liquid nitrogen function; Less demanding to heater; Therefore can adopt resistance heating wire or electrothermal tube to heat; Corresponding low cost and realize the electrical heating process expeditiously, and fan is processed by heat proof material and can be guaranteed the long production cycle and can at high temperature not damage or be out of shape.
As further preferably, described liquid nitrogen distributor can be the snail tubular construction, and on its tube wall, has a plurality of poroid spouts.
Through studying and facts have proved that the liquid nitrogen distributor is set to this snail tubular construction and on its tube wall, has a plurality of poroid spouts, mainly contains the benefit of two aspects.This structure and fan cyclone structure match on the one hand, can form a large-scale liquid nitrogen ejection zone on the other hand.Have in picturesque disorder gap between the helix tube, air-flow and liquid nitrogen steam is mixed when helping fan running.
As further preferably, the coiled pipe structure that said liquid nitrogen distributor can be symmetry up and down and be interconnected, and on its tube wall, have a plurality of poroid spouts.
Through studying and facts have proved; The liquid nitrogen distributor is set to this up and down symmetry and the coiled pipe structure that is interconnected and on its tube wall, has a plurality of poroid spouts; So just be placed into same end to the liquid nitrogen of distributor inlet and liquid nitrogen outlet, the effect of being convenient to install has been arranged.Simultaneously, this liquid nitrogen distributor also can form a large-scale liquid nitrogen ejection zone, and improves ejection efficient, helps the cooling procedure to scolder.
As further preferably, above-mentioned reflow soldering system also comprises temperature control equipment, and said temperature control equipment is made up of temperature element, heating and temperature control device and chilling temperature control device jointly.Said heating and temperature control device comprises the heating temperature control device that determines whether to continue to heat according to the measured temperature of temperature element and is communicated with or breaks off the relay in loop, heating place according to the instruction that said heating temperature control device is sent; Said chilling temperature control device comprises the cooling temperature controller that determines whether to continue to carry liquid nitrogen execution cooling according to the measured temperature of temperature element, and is communicated with or breaks off the low-temperature solenoid valve from carrying between said low temperature valve to the liquid nitrogen distributor of liquid nitrogen according to the instruction that this cooling temperature controller is sent.
Through adopting measurement mechanism and corresponding temperature control equipment, can realize more accurately and efficiently heating and Cooling Control in the solder reflow process are improved the efficient and the end product quality of welding simultaneously.
As further preferably, said chamber also comprises atmospheric valve, and this atmospheric valve is the hypobaric effect of landing when nitrogen pressure is too high in chamber.
Through in chamber, disposing atmospheric valve, can prevent that nitrogen pressure in heating or cooling procedure is increasingly high and cause welding process is had a negative impact.
Description of drawings
Fig. 1 is the plane according to the major function assembly of the reflow soldering system of the utility model;
Fig. 2 is the structural representation according to the electric heater unit of the utility model;
Fig. 3 is the structural representation according to the cooled with liquid nitrogen device of the utility model;
Fig. 4 a is the structural representation according to the liquid nitrogen distributor of a preferred embodiment of the utility model;
Fig. 4 b is the structural representation according to the liquid nitrogen distributor of another preferred embodiment of the utility model;
Fig. 5 is the three-dimensional structure diagram according to the working rotary table with a plurality of rotating disks of the utility model;
Fig. 6 is the pairing Reflow Soldering curve map of reflow soldering system that utilizes the utility model.
In institute's drawings attached, identical Reference numeral is used for representing components identical or parts, wherein:
1 fan, 2 heatings, 3 working rotary tables, 4 liquid nitrogen distributors, 5 fans, 6 liquid nitrogen spouts, 7 chambers, 8 low temperature valves, 9 low-temperature solenoid valves, 10 cooling temperature controllers 11 are from supercharging liquid nitrogen container 12 temperature elements 13 atmospheric valves 14 relays 15 dc sources 16 heating temperature control devices 17 rotating shafts 18 rotating disks
The specific embodiment
For the purpose, technical scheme and the advantage that make the utility model is clearer,, the utility model is further elaborated below in conjunction with accompanying drawing and embodiment.Should be appreciated that specific embodiment described herein only in order to explanation the utility model, and be not used in qualification the utility model.
Fig. 1 is the plane according to the major function assembly of the reflow soldering system of the utility model.As shown in fig. 1; Mainly comprise chamber 7 that inside is full of nitrogen and is sealing state, be arranged on the working rotary table 3 that chamber 7 inside are used to place electronic devices and components to be welded and scolder according to the reflow soldering system of the utility model; Be used for the used scolder of welding process is carried out the electric heater unit of heating, and the scolder that is used for that fusion is refluxed is carried out the formations such as cooled with liquid nitrogen device of cooling.Chamber 7 is hexahedral seal chamber structure in the present embodiment, and its inside is full of nitrogen with the protective gas as reflow soldering.Chamber 7 when refrigeration nitrogen can emptying, there is certain seal request in laboratory, but seal request is not high.Owing to have heating element heater heating and liquid nitrogen to cool off,, can both weld for general electronic devices and components so can form the reflow soldering curve.Welding is under protection of nitrogen gas atmosphere, to carry out, and can prevent like this in the welding process because the existence of oxygen produces the cavity, to improve welding quality.
In chamber 7 inside, be provided with working rotary table 3, the both sides of working rotary table 3 then are respectively arranged with heating 2 that constitutes the electric heater unit part and the liquid nitrogen distributor 4 that constitutes cooled with liquid nitrogen device part.Near heating 2 and liquid nitrogen distributor 4, be respectively arranged with fan 1 and fan 5.In addition, chamber 7 also is equipped with the liquid nitrogen atmospheric valve 13 that is used for pressure release, and gas expands when the nitrogen of ejection makes the air pressure rising in the chamber 7 in the liquid nitrogen distributor 4 when perhaps cooling off when heating, and atmospheric valve 13 is just opened and carried out work.
Fig. 2 is the structural representation according to the electric heater unit of the utility model.As shown in Figure 2, electric heater unit mainly comprises the AC power of 220V, power supply links to each other and constitutes the heating 2 in loop therewith, and is arranged near the fan 1 the heating 2.When energized, heating 2 heating is also heated the nitrogen of chamber inside, and the nitrogen after 1 in fan will heat blows to the working rotary table zone, realizes the fusion backflow of scolder when the temperature in chamber reaches welding temperature thus.The characteristics of the current loop of this 220V are that current ratio is bigger, help heating and carry out powerful electrical heating.
In the loop of 220V AC power and heating 2 formations, also be provided with relay 14.Adopted the loop of little electric current to control opening and cutting off of big current loop.Relay 14 and one for example be the dry battery power formation another one loop of 24V; In this loop, be provided with heating temperature control device 16; This heating temperature control device 16 links to each other with temperature element 12 functions that are arranged on chamber 7 interior appropriate locations; Pass through the measurement and the feedback of 12 pairs of chamber 7 inner heating-up temperatures of temperature element like this; Can correspondingly make 16 actions of heating temperature control device and utilize relay 14 to control connection and the cut-out that constitutes the loop by 220V AC power and 2 of heatings, realize adjusting and control thus the heating-up temperature of chamber 7 inside.The circuit of the display part of heating controller 16 is by the power drives of 220V.Little current reflux is then driven by the dc source of 24V.
Fig. 3 is the structural representation according to the cooled with liquid nitrogen device of the utility model.As shown in Figure 3, the cooled with liquid nitrogen device mainly comprises from parts such as supercharging liquid nitrogen container 11, low temperature valve 8, low-temperature solenoid valve 9, liquid nitrogen distributor 4 and fans 5.From supercharging liquid nitrogen container 11 are pressure vessels that roughly are cylindrical shape; Process by stainless steel material, be used for preserving the nitrogen that is in liquid condition and utilize in the container a small amount of liquid nitrogen to absorb vaporizing and make container can discharge liquid nitrogen automatically to produce pressure from the heat of environment.Low temperature valve 8 is operate as normal at low temperatures, is used for manually controlling liquid nitrogen from the conveying to low-temperature solenoid valve 9 or stop to carry from supercharging liquid nitrogen container 11.Low-temperature solenoid valve 9 is controlled the break-make that liquid nitrogen continues on to liquid nitrogen distributor 4 automatically through cooling temperature controller 10.Liquid nitrogen distributor 4 is the elements that possess a plurality of spouts, is used for the scolder ejection liquid nitrogen that refluxes to fusion and makes it accomplish cooling.Though the temperature of liquid nitrogen is extremely low; Can reach low-down temperature in moment; But owing to can accurately control to the flow of the liquid nitrogen that from liquid nitrogen spout 6, comes out; And liquid nitrogen come out the back rapidly and the air-flow from fan 5 mix mutually, can not produce chilling temperature and cross cold or the uncontrollable situation of temperature.In order to improve the temperature homogeneity of the scolder that fusion refluxes; Through overtesting with facts have proved; Through rear portion corresponding fan 5 is set at liquid nitrogen distributor 4; Can come gas in disturbance and mixed liquor nitrogen vapor and the chamber 7 through the rotation of fan 5, thereby prevent that liquid nitrogen ejection back from producing the problem of local overcooling.
Fig. 4 a is the structural representation according to the liquid nitrogen distributor of a preferred embodiment of the utility model.Shown in Fig. 4 a, it is tubular that liquid nitrogen distributor 4 is snail, and have many circular holes on the tube wall as liquid nitrogen spout 6, and the certain spacing of being separated by between the Kong Yukong is in picturesque disorder.Liquid nitrogen gets into from an end of snail pipe, and gradually from the ejection of liquid nitrogen spout, the flow of the liquid nitrogen that comes out from the other end is seldom or even very little to liquid nitrogen along pipeline.
Fig. 4 b is the structural representation according to the liquid nitrogen distributor of another preferred embodiment of the utility model.Shown in Fig. 4 b, liquid nitrogen distributor 4 is coiled pipe structure symmetrical up and down and that be interconnected, and on its tube wall, has a plurality of poroid spouts 6.Along snakelike pipeline direction, arrange that at a distance from a segment distance circular hole is as the liquid nitrogen spout.The design of this liquid nitrogen distributor, being used in the chamber of cuboid has certain advantage.The import and the outlet of liquid nitrogen are arranged in the same side, make things convenient for the installation of liquid nitrogen distributor 4.
Fig. 5 is the three-dimensional structure diagram according to the working rotary table with a plurality of rotating disks of the utility model.As shown in Figure 5; In the present embodiment; Working rotary table 3 comprises rotating shaft 17 and is fixedly mounted in locational three rotating disks 18 of rotating shaft 17 differing heights that rotating disk 18 is disc, has the cavernous structure of a plurality of circles on its card; This kind cavernous structure helps the circulation of the gas in the chamber 7, thereby it is even to help on the card temperature of scolder.
Fig. 6 is the pairing Reflow Soldering curve map of reflow soldering system that utilizes the utility model.As shown in Figure 6, electrical heating raises the gas temperature in the chamber 7, through the measurement of temperature element and the control action of temperature controller, to form above-mentioned reflow soldering temperature curve.Temperature is raised to 160 ℃ by normal temperature, and heating rate is 3 ℃/second, and temperature kept 60～120 seconds then, and heating rate is reduced to 0.5～1.5 ℃/second, then gets into the reflow soldering section, reaches 217 ℃ of the fusing points of pb-free solder, melt solder.To the welding warm area, temperature rise rate is 2～3 ℃/second to temperature from heat preservation zone, continues 30～50 seconds at 220 ℃.Next, carry out the welding of fusion the cooled with liquid nitrogen of Controllable Temperature exactly, cooling velocity is 2～6 ℃/second.This welding temperature curve is the desirable sketch map of welding control, and actual temperature curve transition is comparatively slick and sly.
To specifically describe the process of carrying out welding and quick cooling according to the reflow soldering system of the utility model of using below.
At first, before reflow soldering, be placed on the working rotary table 3 reposefully electronic devices and components to be soldered and scolder and the sealing property of guarantee test case 7.
Then, let electric heater unit heat up, heating 2 begins heating, and fan 1 begins to rotate simultaneously, blows to the working rotary table 3 that is in the working region to the hot nitrogen after the heating.The air of working region can be got back to the fan place again through the air channel, and heating circulates.When heating the nitrogen atmosphere in the chamber 7, form rework profile intensification section as shown in Figure 6, carry out solder reflow process thus.After reaching welding temperature; The heating of heating 2 stops, and opens the low-temperature solenoid valve 9 from supercharging liquid nitrogen container 7, and liquid nitrogen just gushes out from the liquid nitrogen spout 6 of liquid nitrogen distributor 4; Flow perturbation through passing through fan 5 produces just can cool off the space in the chamber 7.The cooling that in chamber 7, circulates of liquid nitrogen atmosphere just forms the rework profile temperature descending section in as shown in Figure 6 behind the certain hour.After cooling finishes, just accomplished welding process one time.
Those skilled in the art will readily understand; The above is merely the preferred embodiment of the utility model; Not in order to restriction the utility model; Any modification of being done within all spirit and principles at the utility model, be equal to replacement and improvement etc., all should be included within the protection domain of the utility model.
Claims (8)
1. reflow soldering system, this system comprises:
Inside is full of the chamber that nitrogen is sealing state;
Working rotary table, this working rotary table are arranged in the said chamber, are made up of rotating shaft and rotating disk, and said rotating disk is fixed in the rotating shaft, rotates together with rotating shaft, are used to place electronic devices and components to be welded and scolder;
Electric heater unit, this electric heater unit comprise power supply, power supply constitutes the loop and is arranged on the heating of said working rotary table one side therewith, and are arranged near the fan that is used for the nitrogen after the heating is blowed to the working rotary table zone heating;
The cooled with liquid nitrogen device; This cooled with liquid nitrogen device comprise be used to store liquid nitrogen from the supercharging liquid nitrogen container, with the liquid nitrogen distributor that is communicated with and is arranged on the other side of said working rotary table from the supercharging liquid nitrogen container, be used to control from being communicated with or the low temperature valve of disconnection between supercharging liquid nitrogen container and the liquid nitrogen distributor, and be arranged on and be used near the liquid nitrogen distributor gas in liquid nitrogen steam and the chamber is stirred the fan that mixes.
2. reflow soldering as claimed in claim 1 system is characterized in that said working rotary table comprises a plurality of rotating disks, and these rotating disks are fixedly mounted on the differing heights position of said rotating shaft, and the card of rotating disk has a plurality of open-celled structures separately.
3. according to claim 1 or claim 2 reflow soldering system is characterized in that said heating is resistance heating wire or electrothermal tube, and near the said fan that is used for the nitrogen after the heating is blowed to the working rotary table zone heating that is arranged on is processed by heat proof material.
4. according to claim 1 or claim 2 reflow soldering system is characterized in that described liquid nitrogen distributor is the snail tubular construction, and on its tube wall, has a plurality of poroid spouts.
5. according to claim 1 or claim 2 reflow soldering system is characterized in that, the coiled pipe structure that said liquid nitrogen distributor is symmetry up and down and is interconnected, and on its tube wall, have a plurality of poroid spouts.
6. according to claim 1 or claim 2 reflow soldering system is characterized in that, said reflow soldering system also comprises temperature control equipment, and said temperature control equipment is made up of temperature element, heating and temperature control device and chilling temperature control device jointly.
7. reflow soldering as claimed in claim 6 system; It is characterized in that; Said heating and temperature control device comprises the heating temperature control device that determines whether to continue to heat according to the measured temperature of temperature element and is communicated with or breaks off the relay in loop, heating place according to the instruction that said heating temperature control device is sent; Said chilling temperature control device comprises according to the measured temperature of temperature element and determines whether to continue the cooling temperature controller of carrying liquid nitrogen to cool off, and is communicated with or breaks off the low-temperature solenoid valve from carrying between said low temperature valve to the liquid nitrogen distributor of liquid nitrogen according to the instruction that this cooling temperature controller is sent.
8. reflow soldering as claimed in claim 1 system is characterized in that said chamber also comprises atmospheric valve, and this atmospheric valve is the hypobaric effect of landing when nitrogen pressure is too high in chamber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200655813U CN202447778U (en) | 2012-02-27 | 2012-02-27 | Liquid nitrogen-cooled reflow soldering system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200655813U CN202447778U (en) | 2012-02-27 | 2012-02-27 | Liquid nitrogen-cooled reflow soldering system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202447778U true CN202447778U (en) | 2012-09-26 |
Family
ID=46863672
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012200655813U Withdrawn - After Issue CN202447778U (en) | 2012-02-27 | 2012-02-27 | Liquid nitrogen-cooled reflow soldering system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202447778U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102615370A (en) * | 2012-02-27 | 2012-08-01 | 华中科技大学 | Reflow soldering system by aid of liquid nitrogen cooling and soldering method thereof |
| CN104425389A (en) * | 2013-09-03 | 2015-03-18 | 千住金属工业株式会社 | Bump electrode, board which has bump electrodes, and method for manufacturing the board |
-
2012
- 2012-02-27 CN CN2012200655813U patent/CN202447778U/en not_active Withdrawn - After Issue
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102615370A (en) * | 2012-02-27 | 2012-08-01 | 华中科技大学 | Reflow soldering system by aid of liquid nitrogen cooling and soldering method thereof |
| CN102615370B (en) * | 2012-02-27 | 2014-07-23 | 华中科技大学 | Reflow soldering system by aid of liquid nitrogen cooling and soldering method thereof |
| CN104425389A (en) * | 2013-09-03 | 2015-03-18 | 千住金属工业株式会社 | Bump electrode, board which has bump electrodes, and method for manufacturing the board |
| CN104425389B (en) * | 2013-09-03 | 2017-05-03 | 千住金属工业株式会社 | Bump electrode, board which has bump electrodes, and method for manufacturing the board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102615370B (en) | Reflow soldering system by aid of liquid nitrogen cooling and soldering method thereof | |
| CN102092926B (en) | Toughened grass homogenizing furnace | |
| CN202181316U (en) | Novel heated air circulation low-temperature tempering furnace | |
| CN201306928Y (en) | Air circulation structure of large straight-flow furnace | |
| CN202792913U (en) | High temperature sintering resistance furnace | |
| CN202447778U (en) | Liquid nitrogen-cooled reflow soldering system | |
| CN106229385A (en) | Solar cell radiation annealing stove | |
| CN112662857A (en) | Atmosphere heat treatment furnace for improving material cooling rate | |
| CN102045953A (en) | Heating component of reflow soldering machine | |
| CN203117597U (en) | Liquid crystal molecular orientation repairing system | |
| CN207944125U (en) | A kind of Equipment for Heating Processing of alloy material | |
| CN201227707Y (en) | Transverse refluxing mixed gas heating apparatus | |
| CN203923307U (en) | vertical annealing furnace | |
| CN111451592B (en) | Through hole reflow soldering equipment and through hole reflow soldering processing method | |
| CN205166094U (en) | Burning furnace is baked over a slow fire to copper radiator solder brazing chain belt | |
| CN201529826U (en) | Heating component of reflow welder | |
| JP6336707B2 (en) | Reflow device | |
| CN113880397B (en) | Intelligent control system for technological parameters of glass wine bottle production line and use method | |
| CN106435144B (en) | A kind of modifier treatment production line of probing geology steel tube | |
| CN103725840B (en) | Vacuum furnace | |
| CN209288279U (en) | A kind of plasma preparation nano material preheating diversion pipe | |
| CN209416037U (en) | A kind of high temperature melting furnace being moved easily | |
| CN109468449B (en) | Heat treatment furnace with speed-controlled cooling function | |
| CN206736302U (en) | A kind of crosswind circulation internal heat type tunnel purity nitrogen protection annealing furnace | |
| CN103740909A (en) | Monitoring and operating three-chamber vacuum furnace |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20120926 Effective date of abandoning: 20140723 |
|
| RGAV | Abandon patent right to avoid regrant |