CN202446972U - Semiconductor refrigerating and drying device - Google Patents
Semiconductor refrigerating and drying device Download PDFInfo
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- CN202446972U CN202446972U CN 201220022633 CN201220022633U CN202446972U CN 202446972 U CN202446972 U CN 202446972U CN 201220022633 CN201220022633 CN 201220022633 CN 201220022633 U CN201220022633 U CN 201220022633U CN 202446972 U CN202446972 U CN 202446972U
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Abstract
The utility model discloses a semiconductor refrigerating and drying device, which comprises a top cover, a shell, a bottom cover, a semiconductor refrigerator and radiating fins, wherein each of the top cover and the bottom cover is provided with a ventilating pipe; the semiconductor refrigerator is arranged below the bottom cover; a cold core shaft is arranged on the bottom cover, and the bottom of the cold core shaft is connected with the semiconductor refrigerator; a plurality of radiating cold core discs are sleeved on the cold core shaft, and each radiating cold core disc is provided with vents; a sealing device is arranged between the two adjacent radiating cold core discs, a sealing device is also arranged between the radiating cold core disc and the top cover, and a sealing device is also arranged between the cold core disc and the bottom cover; and the vents in the two adjacent radiating cold core discs are staggered. According to the device, the radiating cold core discs and sealing rings are superposed, and the vents in the two adjacent radiating cold core discs are staggered in 180 degrees, so that compressed air flows in an S-shaped mode along the vents among the radiating cold core discs, the contact area between the compressed air and the radiating fins is enlarged, the flow path of the compressed air is prolonged, and the refrigerating and drying effect is improved.
Description
Technical field
The utility model relates to a kind of air cooling device, relates in particular to a kind of semiconductor refrigerating drying device.
Background technology
As everyone knows; The host machine part of medical breathing machine is to realize the key of respirator treatment function; And the required air source of the gas of main frame must be to meet certain standard, and for example temperature, the dew point to air all is that strict requirement is arranged, so the medical breathing machine oxygen supply equipment is most important.At present; Lung ventilator generally all is to adopt compressor to carry out air feed; But the compressed air temperature of from compressor, coming out high (generally about 80 ℃), and humidity is higher has surpassed the standard of the required air source of the gas of main frame; So generally can between compressor and main frame, be provided with drier, compressed air is lowered the temperature and dehumidification treatments.
At present, the compressed air of medical air compressor mainly carries out drying through two kinds of devices:
A kind of is molecular sieve drying device (like the PB840 compressor, the Drager compressor).Molecular sieve is artificial synthetic crystal type aluminium silicate salt, adsorbs or repel the molecule of different material according to the size in its crystals hole, thereby is called " molecular sieve " visually.Molecular diameter can get into molecular sieve crystal less than the material of molecular sieve crystal hole diameter, thereby can be adsorbed, otherwise is ostracised.Because the diameter of water in air vapour molecule is less than molecular sieve crystal hole diameter; Therefore it is inner that steam is adsorbed to the molecular sieve hole; And molecular diameter then directly flows through from molecular sieve than big oxygen and the nitrogen of getting of molecular sieve crystal hole diameter, thereby has realized the purpose of dry air.But therefore the price of mole sieve drier higher (generally about 3000 yuan) on the market adopts the medical air compressor cost of mole sieve drier higher.And, can reach medical air compressor and filter the molecular sieve drying device that requires, volume is bigger, is not easy to be installed in the air compressor, inconvenient installation, and be unfavorable for integrated.
Another kind is the semiconductor refrigerating drying device.CN200995115Y discloses a kind of compressed-air drier like the Chinese patent document, and it becomes refrigeration device through semi-conducting material manufacturing, and through the refrigeration drying principles, makes compressed air lower the temperature, fall wet.
Wherein, the dry principle of refrigeration is: because under the situation that water vapour content is constant in compressed air, temperature and relative humidity are inversely proportional to; Along with compressed air gets into refrigerator, himself temperature constantly reduces the corresponding continuous rising of its relative humidity; When compressed-air actuated temperature drops to below the room temperature 5 ℃; Water vapour amount in the compressed air has arrived saturated under corresponding relative humidity, and redundant moisture is separated out from compressed air, and then dried compressed-air actuated temperature is elevated to room temperature; This moment in the nearly step of compressed-air actuated relative humidity diminishes, thereby reaches the purpose with compressed air drying.
And semi-conducting material manufacturing becomes refrigeration device, and it follows paltie effect, is connected into galvanic couple with two different conductors that is:; And connect dc source; When the overcurrent of galvanic couple upper reaches, energy transfer phenomenon can take place, a joint release heat turns cold; Another joint absorbs the heat heating, has so just realized the effect of end refrigeration.
Disclose in a kind of compressed-air drier at Chinese patent document CN200995115Y, it is dispersed the heat that produces after switching on through semiconductor cooler through fin, and cold being transmitted on the cold core that will produce, thereby forms refrigeration device; Spirality air flue through forming between cold core outer wall and the urceolus then freezes and dry to the compressed air of flowing through, realized to compressed-air actuated cooling, fall wet.The part but it also comes with some shortcomings: at first; Its air flue adopts spirality, and is arranged between cold core and the urceolus, and this makes that the contact-making surface of compressed air and cold core is limited; And can not realize effective heat exchange with the centre of cold core, cooling-down effect is unsatisfactory; Secondly, air flue is arranged between cold core and the urceolus, is unfavorable for sealing, sealing effectiveness is relatively poor.
The utility model content
The purpose of the utility model is to provide a kind of semiconductor refrigerating drying device, and the contact area that it has strengthened compressed air and fin has prolonged compressed-air actuated flow process, the refrigeration drying effect better, have simultaneously simple in structure, advantage of good sealing effect.
The purpose of the utility model is to realize through following technical scheme:
A kind of semiconductor refrigerating drying device comprises top cover, shell, bottom, semiconductor cooler and fin, and said top cover, shell and bottom seal successively to install and form an integral body; Be provided with breather pipe on said top cover and the bottom; Said bottom is arranged with semiconductor cooler, and said semiconductor cooler bottom links to each other with fin, and said bottom is provided with the cold core axle; And cold core axle bottom links to each other with semiconductor cooler; Be with some heat radiation cold core disks on the said cold core axle, and all have passage on the heat radiation cold core disk, between the said adjacent two heat radiation cold core disks, be provided with sealing device between heat radiation cold core disk and the bottom; And the passage on the adjacent two heat radiation cold core disks is and is staggeredly arranged, and is provided with sealing device between said heat radiation cold core disk and the shell.
Preferably, said top cover and bottom are circle, and shell is a cylinder.
Preferably, said cold core axle is a cylinder.
Preferably, becoming 180 ° between the passage on the said adjacent two heat radiation cold core disks is staggeredly arranged.
Further; Sealing device between the said adjacent two heat radiation cold core disks, between heat radiation cold core disk and the bottom adopts sealing ring; And place, said sealing ring outer is provided with taper seat, and install through the taper seat and the body seal of sealing ring said heat radiation cold core disk outer.
Further, said top cover and bottom all cooperate installation through screw thread with shell, and the screw thread place scribbles fluid sealant.
Further, said some heat radiation cold core disks and some sealing rings alternately laminate placement, and it is fastening to pass through screw and compression plate and cold core axle.
Preferably, said cold core axle all adopts thermal conductivity copper or aluminium preferably with heat radiation cold core disk.
The beneficial effect of the utility model does; Said semiconductor refrigerating drying device, it adopts some heat radiation cold core disks to be socketed on the cold core axle, and through sealing ring with being separated out certain distance between the adjacent two heat radiation cold core disks; Compressed air circulates through passage then; And with cold core axle and heat radiation cold core disk joint, increased the heat radiation contact area, improved the refrigeration drying effect; Become 180 ° between the passage on the adjacent two heat radiation cold core disks and be staggeredly arranged, make compressed air flow, prolonged compressed-air actuated flow process, further improved the refrigeration drying effect along the S-type mode of passage; The place is provided with taper seat through the sealing ring outer; And through feasible cold core disk outer and the body seal of dispelling the heat of the taper seat of sealing ring; Top cover and bottom all cooperate installation through screw thread with shell simultaneously; And the screw thread place scribbles fluid sealant, makes semiconductor cooling device form the integral body of a sealing, good sealing effect; Adopt same sealing ring simultaneously adjacent two heat radiation cold core disks to be sealed with heat radiation cold core disk and shell, it is simple in structure, and is easy for installation; Adopt some heat radiation cold core disks and some sealing rings alternately to laminate placement, and it is fastening to pass through screw and compression plate and cold core axle, makes heat radiation cold core disk and sealing ring compress earlier and form an integral body, be convenient to install; The cold core axle all adopts thermal conductivity copper or aluminium preferably with heat radiation cold core disk, and good heat conduction effect is beneficial to compressed-air actuated heat radiation more.
Description of drawings
According to accompanying drawing and embodiment the utility model is done further explain below.
Fig. 1 is the said semiconductor refrigerating drying device of a utility model explosive view;
Fig. 2 is the decomposition texture sketch map of the said semiconductor refrigerating drying device of the utility model;
Fig. 3 is the front view of heat radiation cold core disk in the said semiconductor refrigerating drying device of the utility model;
Fig. 4 is the cutaway view of sealing ring in the said semiconductor refrigerating drying device of the utility model;
Fig. 5 is the mounting structure sketch map of heat radiation cold core disk and sealing ring in the said semiconductor refrigerating drying device of the utility model.
Among the figure:
1, top cover, 2, shell, 3, bottom, 4, semiconductor cooler, 5, fin, 6, breather pipe, 7, the cold core axle, 8, heat radiation cold core disk, 9, passage, 10, sealing ring, 11, taper seat, 12, screw, 13, compression plate.
The specific embodiment
Shown in Fig. 1-5; In the preferred embodiment of the utility model, said semiconductor refrigerating drying device comprises top cover 1, shell 2, bottom 3, semiconductor cooler 4 and fin 5; Be provided with breather pipe 6 on top cover 1 and the bottom 2; Top cover 1, shell 2 and bottom 3 seal successively and install to form an integral body, and top cover 1 is circle with bottom 3, and shell 2 is a cylinder.
Be arranged with semiconductor cooler 4 at bottom 3; Semiconductor cooler 4 bottoms link to each other with fin 5, and bottom 3 is provided with columniform cold core axle 7, and cold core axle 7 bottoms link to each other with semiconductor cooler 4; Be with some heat radiation cold core disks 8 on the cold core axle 7; All have passage 9 on the heat radiation cold core disk 8, between the adjacent two heat radiation cold core disks 8, be placed with sealing ring 10 between heat radiation cold core disk 8 and the bottom 3, and heat radiation cold core disk 8 and sealing ring 10 alternately laminate place after; And cooperate fastening with cold core axle 7 through screw 12 and compression plate 13; Need guarantee that simultaneously becoming 180 ° between the passage 9 on the adjacent two heat radiation cold core disks 8 is staggeredly arranged, place, sealing ring 10 outers is provided with taper seat 11, and install with shell 2 sealings through the taper seat 11 of sealing ring 10 heat radiation cold core disk 8 outers.
Preferably, said top cover 1 all cooperates installation through screw thread with shell 2 with bottom 3, and the screw thread place scribbles fluid sealant.
Preferably, said cold core axle 7 all adopts thermal conductivity copper or aluminium preferably with heat radiation cold core disk 8.
During work:
After semiconductor cooler 4 energisings; The heat of its generation exhales through fin 5, and produced simultaneously cold passing on the cold core axle 7 is transmitted on the heat radiation cold core disk 8 by cold core axle 7 again; Make cold core axle 7 and heat radiation cold core and heat radiation cold core disk 8 temperature reduce; Then compressed air is got in the shell 2 through the breather pipe on the top cover 16, and, successively flow through the passage 9 on the heat radiation cold core disk 8 and sealing ring 10 and adjacent two heat radiation cold core disks 8 formation spaces; And S-type mode flows; Cooled to reasonable temperature when compressed air flow to bottom 3 places, simultaneously also condensation has gone out the most of moisture in the compressed air, through the breather pipe on the bottom 36 it is sent in the air cleaner then.
Said semiconductor refrigerating drying device, the contact area that it has strengthened compressed air and fin has prolonged compressed-air actuated flow process, the refrigeration drying effect better, have simultaneously simple in structure, advantage of good sealing effect.Although the utility model is illustrated with reference to accompanying drawing and preferred embodiment, obviously, for a person skilled in the art, under the prerequisite of spirit that does not deviate from the utility model and scope, can make various changes and variation to the utility model.The various changes of the utility model, the content that changes by appending claims and equivalent thereof contain.
Claims (8)
1. semiconductor refrigerating drying device; Comprise top cover (1), shell (2), bottom (3), semiconductor cooler (4) and fin (5); Said top cover (1), shell (2) and bottom (3) seal successively to install and form an integral body, are provided with breather pipe (6) on said top cover (1) and the bottom (3), and said bottom (3) is arranged with semiconductor cooler (4); Said semiconductor cooler (4) bottom links to each other with fin (5); It is characterized in that: said bottom (3) is provided with cold core axle (7), and cold core axle (7) bottom links to each other with semiconductor cooler (4), is with some heat radiation cold core disks (8) on the said cold core axle (7); And all have passage (9) on the heat radiation cold core disk (8); Between said adjacent two heat radiations cold core disks (8), be provided with sealing device between heat radiation cold core disk (8) and the bottom (3), and adjacent two dispel the heat passages (9) on the cold core disks (8) are and are staggeredly arranged, and are provided with sealing device between said heat radiation cold core disk (8) and the shell (2).
2. semiconductor refrigerating drying device according to claim 1 is characterized in that: said top cover (1) and bottom (3) are circle, and shell (2) is a cylinder.
3. semiconductor refrigerating drying device according to claim 1 is characterized in that: said cold core axle (7) is a cylinder.
4. semiconductor refrigerating drying device according to claim 1 is characterized in that: become 180 ° between the passage (9) on the said adjacent two heat radiation cold core disks (8) and be staggeredly arranged.
5. semiconductor refrigerating drying device according to claim 1; It is characterized in that: the sealing device employing sealing ring (10) between said adjacent two heat radiations cold core disks (8), between heat radiation cold core disk (8) and the bottom (3); And place, said sealing ring (10) outer is provided with taper seat (11), and install with shell (2) sealing through the taper seat (11) of sealing ring (10) said heat radiation cold core disk (8) outer.
6. according to claim 1 or 2 each described semiconductor refrigerating drying devices, it is characterized in that: said top cover (1) and bottom (3) all cooperate installation through screw thread with shell, and the screw thread place scribbles fluid sealant.
7. according to claim 1 or 4 or 5 each described semiconductor refrigerating drying devices, it is characterized in that: said some heat radiation cold core disks (8) alternately laminate placement with some sealing rings (10), and fastening with cold core axle (7) through screw (12) and compression plate (13).
8. according to claim 1 or 3 or 4 or 5 each described semiconductor refrigerating drying devices, it is characterized in that: said cold core axle (7) and heat radiation cold core disk (8) all adopt thermal conductivity copper or aluminium preferably.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220022633 CN202446972U (en) | 2012-01-17 | 2012-01-17 | Semiconductor refrigerating and drying device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220022633 CN202446972U (en) | 2012-01-17 | 2012-01-17 | Semiconductor refrigerating and drying device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202446972U true CN202446972U (en) | 2012-09-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220022633 Expired - Fee Related CN202446972U (en) | 2012-01-17 | 2012-01-17 | Semiconductor refrigerating and drying device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202446972U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105688614A (en) * | 2016-03-17 | 2016-06-22 | 张剑明 | Air dryer |
| CN109312937A (en) * | 2015-07-28 | 2019-02-05 | 西门子移动有限责任公司 | For installation into the Peltier air dehumidifier in container |
-
2012
- 2012-01-17 CN CN 201220022633 patent/CN202446972U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109312937A (en) * | 2015-07-28 | 2019-02-05 | 西门子移动有限责任公司 | For installation into the Peltier air dehumidifier in container |
| US10730364B2 (en) | 2015-07-28 | 2020-08-04 | Siemens Mobility GmbH | Peltier effect air dehumidifier for installation in a container |
| CN109312937B (en) * | 2015-07-28 | 2021-08-27 | 西门子交通有限责任公司 | Peltier air dehumidifying device for installation in a container |
| CN105688614A (en) * | 2016-03-17 | 2016-06-22 | 张剑明 | Air dryer |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120926 Termination date: 20160117 |
|
| EXPY | Termination of patent right or utility model |