CN202423285U - LED (light-emitting diode) surface light source module - Google Patents
LED (light-emitting diode) surface light source module Download PDFInfo
- Publication number
- CN202423285U CN202423285U CN2011205253821U CN201120525382U CN202423285U CN 202423285 U CN202423285 U CN 202423285U CN 2011205253821 U CN2011205253821 U CN 2011205253821U CN 201120525382 U CN201120525382 U CN 201120525382U CN 202423285 U CN202423285 U CN 202423285U
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- China
- Prior art keywords
- substrate
- circuit
- led
- embankment wall
- source module
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
- H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Led Device Packages (AREA)
Abstract
The utility model relates to an LED (light-emitting diode) surface light source module. The LED surface light source module forms a circuit layer and an anti-welding layer on a baseplate, wherein the anti-welding layer can partially cover the circuit layer and enable the circuit layer to be partially exposed for forming a plurality of electrical connection points so as to prevent welding material from forming an embankment wall, the plurality of the electrical connection points are positioned in the embankment wall, a plurality of LED crystals which are electrically connected with the plurality of the electrical connection points are arranged on the anti-welding layer in the embankment wall, the thickness of the embankment wall is not greater than the thickness of the LED crystals, light transmission glue is filled into the embankment wall, then the light transmission glue can coat the plurality of the LED crystals because surface tension is aggregated in the embankment wall and protrude from the embankment wall for forming a convex arc surface, and a light transmission glue layer is further formed after solidification; and then the using quantity of the light transmission glue can be reduced, and light emitted by the LED crystals can be further dispersed.
Description
Technical field
The utility model is about a kind of LED area source module.
Background technology
Because nowadays the fast development of LED has replaced conventional bulb gradually, become the light-emitting component of the light emitting source that the relevant equipment of most illuminations are used as; Because the directive property that the LED crystal emits beam is high; Therefore existing a kind of LED area source module, it is that the LED crystal is embedded in the printing opacity glue, makes the LED crystal light luminous back light source and is uniformly distributed in the printing opacity glue; Form uniform surface light source, be suitable as illuminating equipment.
See also Fig. 5 and Fig. 6, above-mentioned LED area source module includes:
One substrate 70 is formed with a circuit layer 71 and a welding resisting layer 72 on the surface thereof, and welding resisting layer 72 parts cover this circuit layer 71, and the partial circuit layer is exposed and forms a plurality of electric contacts 73;
One thick framework 80 is materials such as metal or rubber, and is pressed on the welding resisting layer 72 of this substrate 70, and should be located in the thick framework 80 by a plurality of electric contact 73 frames;
A plurality of LED crystal 90 are fixedly arranged in the thick framework 80 on these substrate 70 welding resisting layers 72, and are electrically connected with a plurality of electric contacts 73 of this substrate 70 respectively;
One printing opacity glue-line 100 is formed in this thick framework 80, and with these a plurality of LED crystal 90 of coating, and end face forms a cancave cambered surface.
Above-mentioned LED area source module forms before the printing opacity glue 100, must make a thick framework 80 earlier, should be pressed on substrate 70 welding resisting layers 72 by thick framework 80 again; Insert the printing opacity glue-line again; Like transparent adhesive tape or fluorescent glue, treat that the printing opacity gelling forms printing opacity glue-line 100 admittedly, and coat these a plurality of LED crystal 90.
In the manufacturing process of above-mentioned LED area source module; Because mostly existing thick framework is aluminium frame or glue frame; Aluminium frame of producing or glue frame thickness all can be thick more than the LED wafer thickness, so for avoiding thick framework that the LED crystal is caused shading, must make the thickness of printing opacity glue-line and thick frame thickness almost equal; Could reduce shading, waste material; And when filling out transparent adhesive tape usually, for inexcessive waste material, the thickness of printing opacity glue-line can be slightly less than thick frame thickness, thereby forms cancave cambered surface, produces the effect of optically focused on the contrary, is unfavorable for making light source evenly to disperse, and real is undesirable, needs improvement to some extent.
The utility model content
Because the technological deficiency of above-mentioned LED area source module consume material and formation spotlight effect, the main purpose of the utility model is to propose a kind of LED area source module, can reduce the consumption of printing opacity glue, and the light that can further let the LED crystal send disperses.
Desiring to reach the employed major technique means of above-mentioned purpose is that this LED area source module is included:
One substrate is formed with a circuit layer and a welding resisting layer on the surface thereof, this welding resisting layer partly covers this circuit layer, and the partial circuit layer is exposed and forms a plurality of electric contacts;
One embankment wall for anti-welding material is processed, and is formed on this welding resisting layer, and a plurality of electric contacts are positioned at this embankment wall;
A plurality of LED crystal are fixedly arranged on the welding resisting layer in this embankment wall, and are electrically connected with these a plurality of electric contacts respectively;
One printing opacity glue-line is formed in this embankment wall, and this printing opacity glue-line coats these a plurality of LED crystal;
This embankment wall thickness is not more than this LED crystal thickness, and this printing opacity bondline thickness is greater than this embankment wall thickness, forms a convex globoidal in the end face of this printing opacity glue-line and protrudes in this embankment wall.
In preferred embodiment, this embankment wall thickness is between between 0.5 to 1 times of this LED crystal thickness.
In preferred embodiment, this printing opacity glue-line includes a fluorescent glue portion and a transparent adhesive tape portion.
In preferred embodiment, this substrate is a metal substrate, and its surface formation one insulating barrier, and this circuit layer is formed on this insulating barrier.
In preferred embodiment, this circuit layer comprises a cathode circuit and a negative pole circuit, and this cathode circuit exposes in two ends of substrate and respectively forms a positive contact, and this negative pole circuit exposes in two ends of substrate and respectively forms a negative contacts.
The utility model is on welding resisting layer in case the wlding material forms this embankment wall; Make this carry the thickness that the wall thickness degree can be less than or equal to the LED crystal; Therefore; The end face in this printing opacity glue-line forms a convex globoidal greater than embankment wall thickness not need a large amount of printing opacity glue just can make the printing opacity bondline thickness, except that saving material usage, also can produce the effect of astigmatism.
Description of drawings
Fig. 1: the plan view from above that does not form embankment wall and printing opacity glue-line for the utility model LED area source module.
Fig. 2: for Fig. 1 forms the plan view from above behind embankment wall and the printing opacity glue-line.
Fig. 3: for the A-A of Fig. 2 to profile view.
Fig. 4: be the flow chart of the utility model processing procedure.
Fig. 5: be the plan view from above of existing LED area source module.
Fig. 6: for the B-B of Fig. 5 to profile view.
The component symbol explanation
10 ... Substrate 11 ... Circuit layer
111 ... Cathode circuit 112 ... The negative pole circuit
113 ... Positive contact 114 ... Negative contacts
12 ... Welding resisting layer 13 ... Electric contact
14 ... Insulating barrier 20 ... Embankment wall
30 ... LED crystal 40 ... The printing opacity glue-line
41 ... Transparent adhesive tape portion 42 ... Fluorescent glue portion
70 ... Substrate 71 ... Circuit layer
72 ... Welding resisting layer 73 ... Electric contact
90 ... LED crystal 80 ... Thick framework
100 ... The printing opacity glue-line
Embodiment
Seeing also Fig. 1 the utility model LED area source module includes:
One substrate 10 is formed with a circuit layer 11 and a welding resisting layer 12 on the surface thereof, this welding resisting layer 12 parts cover this circuit layer 11, and partial circuit layer 11 is exposed and forms a plurality of electric contacts 13; In this instance; This circuit layer 11 comprises a cathode circuit 111 and a negative pole circuit 112; And cathode circuit 111 is exposed in two ends of substrate 10 respectively form a positive contact 113, respectively form a negative contacts 114, supply to be connected to external power source and negative pole circuit 112 is exposed in two ends of substrate 10;
One embankment wall 20 is anti-welding material, and is formed at this welding resisting layer 12, makes these a plurality of electric contacts 13 be positioned at embankment wall;
A plurality of LED crystal 3s 0 are fixedly arranged on the welding resisting layer 12 in this embankment wall 20, and are electrically connected with these a plurality of electric contacts 13 respectively;
Please further consult Fig. 2 and Fig. 3 again; Embankment wall 20 on aforesaid substrate 10 further forms a printing opacity glue-line 40; And with printing opacity glue-line 40 these a plurality of LED crystal 3s 0 of coating; In present embodiment, this printing opacity glue-line 40 can transparent adhesive tape or fluorescent glue solidify the back and form, also can include a transparent adhesive tape portion 41 and a fluorescent glue portion 42.
The thickness of above-mentioned embankment wall 20 is not more than the thickness of LED crystal 30, and can be preferably between between 0.5～1 times of LED crystal 30 thickness, and these printing opacity glue-line 40 thickness are greater than embankment wall 20 thickness, and form a convex globoidal in end face, to disperse light source.
Please further consult Fig. 4, above-mentioned LED area source module group procedure comprises following steps:
Step S11 a: substrate 10 is provided; On this substrate 10, form a circuit layer 11, form a welding resisting layer 12 and cover this circuit layer 11, and welding resisting layer 12 exposes the partial circuit layer and forms a plurality of electric contacts 13; In present embodiment; This substrate 10 is a metal substrate, and forms an insulating barrier 14 prior to a surface, on this insulating barrier 14, forms this circuit layer 11 again; Step S21:, and make a plurality of electric contacts 13 be positioned at this embankment wall 20 in case the wlding material forms an embankment wall 20 on substrate 10 welding resisting layers 12;
Step S31: a plurality of LED crystal 3s 0 are set in the embankment wall 20 of this substrate 10, and should be electrically connected to this a plurality of electric contacts 13 respectively by a plurality of LED crystal 3s 0;
Step S41: in embankment wall 20, insert printing opacity glue, make the printing opacity gelling form a printing opacity glue-line 40 in the back admittedly,, in present embodiment, insert transparent adhesive tape and fluorescent glue and form this printing opacity glue-line 40, also can only fill out transparent adhesive tape or fluorescent glue to coat these a plurality of LED crystal 3s 0.
The utility model mainly on welding resisting layer 12 in case the wlding material forms embankment wall 20; Supply to form printing opacity glue-line 40; Because of the surface tension of printing opacity glue when the colloidal state is big, so when inserting in the embankment wall 20, printing opacity glue is concentrated in the embankment wall 20; Lay a plurality of LED crystal 3s 0 coating in district correspondence is positioned at crystal, just form this printing opacity glue-line 40 after the printing opacity gelling is solid; So, can save the use of thick framework, need not make thick framework and it is pressed on the step of substrate; And in case forming this, the wlding material carries wall 20 because of the utility model; On processing procedure, be easy to control the thickness that makes embankment wall 20 and be not more than LED crystal 30 thickness, can not cause shading, needn't insert a large amount of colloids LED crystal 30; Reduce the consumption of printing opacity glue, save material cost; And use a small amount of printing opacity glue just can make its thickness exceed embankment wall 20 thickness, and make printing opacity glue-line 40 form convex globoidal, further have astigmatic effect.
In sum, the utility model is save the making and the pressing step of thick framework on fabrication steps, simplifies processing procedure, and shortens processing procedure and expend time in; On cost of manufacture, then reduce the consumption of printing opacity glue, and further make the printing opacity glue-line form convex globoidal and have more the effect that lets light source disperse.
Claims (9)
1. a LED area source module is characterized in that, includes:
One substrate is formed with a circuit layer and a welding resisting layer on the surface thereof, this welding resisting layer partly covers this circuit layer, and the partial circuit layer is exposed and forms a plurality of electric contacts;
One embankment wall for anti-welding material is processed, and is formed on this welding resisting layer, and a plurality of electric contacts are positioned at this embankment wall;
A plurality of LED crystal are fixedly arranged on the welding resisting layer in this embankment wall, and are electrically connected with these a plurality of electric contacts respectively;
One printing opacity glue-line is formed in this embankment wall, and this printing opacity glue-line coats these a plurality of LED crystal;
This embankment wall thickness is not more than this LED crystal thickness, and this printing opacity bondline thickness is greater than this embankment wall thickness, forms a convex globoidal in the end face of this printing opacity glue-line and protrudes in this embankment wall.
2. LED area source module as claimed in claim 1 is characterized in that, this embankment wall thickness is between between 0.5 to 1 times of this LED crystal thickness.
3. according to claim 1 or claim 2 LED area source module is characterized in that this printing opacity glue-line includes a fluorescent glue portion and a transparent adhesive tape portion.
4. according to claim 1 or claim 2 LED area source module is characterized in that this substrate is a metal substrate, and its surface forms an insulating barrier, and this circuit layer is formed on this insulating barrier.
5. LED area source module as claimed in claim 3 is characterized in that this substrate is a metal substrate, and its surface formation one insulating barrier, and this circuit layer is formed on this insulating barrier.
6. according to claim 1 or claim 2 LED area source module; It is characterized in that; This circuit layer comprises a cathode circuit and a negative pole circuit, and this cathode circuit exposes in two ends of substrate and respectively forms a positive contact, and this negative pole circuit exposes in two ends of substrate and respectively forms a negative contacts.
7. LED area source module as claimed in claim 3; It is characterized in that; This circuit layer comprises a cathode circuit and a negative pole circuit, and this cathode circuit exposes in two ends of substrate and respectively forms a positive contact, and this negative pole circuit exposes in two ends of substrate and respectively forms a negative contacts.
8. LED area source module as claimed in claim 4; It is characterized in that; This circuit layer comprises a cathode circuit and a negative pole circuit, and this cathode circuit exposes in two ends of substrate and respectively forms a positive contact, and this negative pole circuit exposes in two ends of substrate and respectively forms a negative contacts.
9. LED area source module as claimed in claim 5; It is characterized in that; This circuit layer comprises a cathode circuit and a negative pole circuit, and this cathode circuit exposes in two ends of substrate and respectively forms a positive contact, and this negative pole circuit exposes in two ends of substrate and respectively forms a negative contacts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205253821U CN202423285U (en) | 2011-12-15 | 2011-12-15 | LED (light-emitting diode) surface light source module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205253821U CN202423285U (en) | 2011-12-15 | 2011-12-15 | LED (light-emitting diode) surface light source module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202423285U true CN202423285U (en) | 2012-09-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011205253821U Expired - Fee Related CN202423285U (en) | 2011-12-15 | 2011-12-15 | LED (light-emitting diode) surface light source module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202423285U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103794710A (en) * | 2012-11-02 | 2014-05-14 | 佳达光子实业股份有限公司 | LED area-light-source module and manufacturing method thereof |
-
2011
- 2011-12-15 CN CN2011205253821U patent/CN202423285U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103794710A (en) * | 2012-11-02 | 2014-05-14 | 佳达光子实业股份有限公司 | LED area-light-source module and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120905 Termination date: 20141215 |
|
| EXPY | Termination of patent right or utility model |