CN202423213U - 等离子体约束装置 - Google Patents
等离子体约束装置 Download PDFInfo
- Publication number
- CN202423213U CN202423213U CN2011204702274U CN201120470227U CN202423213U CN 202423213 U CN202423213 U CN 202423213U CN 2011204702274 U CN2011204702274 U CN 2011204702274U CN 201120470227 U CN201120470227 U CN 201120470227U CN 202423213 U CN202423213 U CN 202423213U
- Authority
- CN
- China
- Prior art keywords
- plasma
- restraint device
- zone
- air guide
- distributed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Abstract
Description
Claims (12)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011204702274U CN202423213U (zh) | 2011-11-23 | 2011-11-23 | 等离子体约束装置 |
TW100225092U TWM438698U (en) | 2011-11-23 | 2011-12-30 | Plasma confinement apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011204702274U CN202423213U (zh) | 2011-11-23 | 2011-11-23 | 等离子体约束装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN202423213U true CN202423213U (zh) | 2012-09-05 |
Family
ID=46747948
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2011204702274U Expired - Lifetime CN202423213U (zh) | 2011-11-23 | 2011-11-23 | 等离子体约束装置 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN202423213U (zh) |
TW (1) | TWM438698U (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103839745A (zh) * | 2012-11-23 | 2014-06-04 | 中微半导体设备(上海)有限公司 | 一种摇摆式等离子体约束装置 |
CN105789015A (zh) * | 2014-12-26 | 2016-07-20 | 中微半导体设备(上海)有限公司 | 一种实现均匀排气的等离子体处理设备 |
CN114420524A (zh) * | 2020-10-28 | 2022-04-29 | 中微半导体设备(上海)股份有限公司 | 气流调节装置和方法及应用该装置的等离子体处理装置 |
CN114551199A (zh) * | 2020-11-19 | 2022-05-27 | 中微半导体设备(上海)股份有限公司 | 一种限制环及其制作方法、以及等离子体处理装置 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114566415A (zh) * | 2020-11-27 | 2022-05-31 | 中微半导体设备(上海)股份有限公司 | 等离子体处理装置 |
CN116614926A (zh) * | 2022-02-09 | 2023-08-18 | 中微半导体设备(上海)股份有限公司 | 等离子体约束系统及方法 |
-
2011
- 2011-11-23 CN CN2011204702274U patent/CN202423213U/zh not_active Expired - Lifetime
- 2011-12-30 TW TW100225092U patent/TWM438698U/zh not_active IP Right Cessation
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103839745A (zh) * | 2012-11-23 | 2014-06-04 | 中微半导体设备(上海)有限公司 | 一种摇摆式等离子体约束装置 |
CN103839745B (zh) * | 2012-11-23 | 2016-06-22 | 中微半导体设备(上海)有限公司 | 一种摇摆式等离子体约束装置 |
CN105789015A (zh) * | 2014-12-26 | 2016-07-20 | 中微半导体设备(上海)有限公司 | 一种实现均匀排气的等离子体处理设备 |
CN114420524A (zh) * | 2020-10-28 | 2022-04-29 | 中微半导体设备(上海)股份有限公司 | 气流调节装置和方法及应用该装置的等离子体处理装置 |
TWI807382B (zh) * | 2020-10-28 | 2023-07-01 | 大陸商中微半導體設備(上海)股份有限公司 | 氣流調節裝置和方法及應用其之電漿處理裝置 |
CN114420524B (zh) * | 2020-10-28 | 2023-10-31 | 中微半导体设备(上海)股份有限公司 | 气流调节装置和方法及应用该装置的等离子体处理装置 |
CN114551199A (zh) * | 2020-11-19 | 2022-05-27 | 中微半导体设备(上海)股份有限公司 | 一种限制环及其制作方法、以及等离子体处理装置 |
Also Published As
Publication number | Publication date |
---|---|
TWM438698U (en) | 2012-10-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN202423213U (zh) | 等离子体约束装置 | |
CN101552182B (zh) | 一种用于半导体制造工艺中的边缘环机构 | |
CN101207001B (zh) | 排气装置及包含该排气装置的反应腔室 | |
CN201514924U (zh) | 等离子体约束装置及利用该等离子体约束装置的等离子体处理装置 | |
CN1225005C (zh) | 用于控制等离子体体积的方法和设备 | |
TWI747103B (zh) | 電漿侷限系統及方法 | |
CN101315880B (zh) | 一种气体分配装置及采用该气体分配装置的等离子体处理设备 | |
CN102318043A (zh) | 电浆蚀刻装置 | |
CN103177925A (zh) | 一种用于等离子体处理装置的可调节约束环 | |
US20120231631A1 (en) | Plasma generating apparatus and plasma etching method using the same | |
CN101477944A (zh) | 等离子体处理装置及其使用的电极和电极制造方法 | |
CN102082063A (zh) | 一种用于中、低频等离子体加工设备的电极板和反应腔室 | |
CN100566847C (zh) | 进气喷嘴 | |
KR101232200B1 (ko) | 배플, 기판 처리 장치 및 그 처리 방법 | |
CN201153126Y (zh) | 刻蚀机载片盘的旋转机构 | |
CN103151235B (zh) | 一种提高刻蚀均匀性的装置 | |
CN210110932U (zh) | 一种适用于梯形液流电池或电堆的双极板 | |
CN103646841A (zh) | 一种等离子体刻蚀设备 | |
CN109119322B (zh) | 一种磁增强型等离子体源 | |
CN101355009B (zh) | 刻蚀装置 | |
CN104733275A (zh) | 等离子体工艺设备 | |
CN201704403U (zh) | 一种pecvd设备 | |
CN100378923C (zh) | 磁控等离子体处理装置 | |
TWI834306B (zh) | 電漿約束系統及方法、電漿處理裝置 | |
CN105461025A (zh) | 一种消除短路电流的高效三维电极反应装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Temperature adjustable plasma restriction device Effective date of registration: 20150202 Granted publication date: 20120905 Pledgee: China Development Bank Co Pledgor: Advanced Micro-Fabrication Equipment (Shanghai) Inc. Registration number: 2009310000663 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20170809 Granted publication date: 20120905 Pledgee: China Development Bank Co Pledgor: Advanced Micro-Fabrication Equipment (Shanghai) Inc. Registration number: 2009310000663 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
CP01 | Change in the name or title of a patent holder |
Address after: 201201 No. 188 Taihua Road, Jinqiao Export Processing Zone, Pudong New Area, Shanghai Patentee after: Medium and Micro Semiconductor Equipment (Shanghai) Co., Ltd. Address before: 201201 No. 188 Taihua Road, Jinqiao Export Processing Zone, Pudong New Area, Shanghai Patentee before: Advanced Micro-Fabrication Equipment (Shanghai) Inc. |
|
CP01 | Change in the name or title of a patent holder | ||
CX01 | Expiry of patent term |
Granted publication date: 20120905 |
|
CX01 | Expiry of patent term |