CN202394027U - A reinforcement structure used for protecting a wafer level camera module and device having the wafer level camera module - Google Patents
A reinforcement structure used for protecting a wafer level camera module and device having the wafer level camera module Download PDFInfo
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- CN202394027U CN202394027U CN2011202026883U CN201120202688U CN202394027U CN 202394027 U CN202394027 U CN 202394027U CN 2011202026883 U CN2011202026883 U CN 2011202026883U CN 201120202688 U CN201120202688 U CN 201120202688U CN 202394027 U CN202394027 U CN 202394027U
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- sheet shaped
- shaped piece
- camera module
- reinforced structure
- sidepiece
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/02—Bodies
Abstract
The utility model relates to a reinforcement structure used for protecting a wafer level camera module and device having the wafer level camera module. In one embodiment, the reinforcement structure includes a top sheet piece and a side sheet piece. The top sheet piece is arranged on the top face of the camera module and includes a first opening allowing light beams to pass for reaching the camera module. The side sheet piece is coupled to the top sheet piece, thereby fastening the reinforcement structure to a PCB (Printed Circuit Board). The side sheet piece also includes a second opening. Bonding agent can be applied through the second opening to bond the reinforcement structure to the camera module.
Description
The cross reference of related application
The right that No. the 61/358th, 819, the U.S. Provisional Application case that the application advocates to submit on June 25th, 2010, this case is incorporated into the mode of quoting hereby.
Technical field
The utility model relates generally to the wafer scale camera module, and clearly speech but not exclusively, relate to the reinforcement of wafer scale camera module.
Background technology
Digital camera is widely used in the various application.Recently, the digital camera size decreases is to be assemblied in the emerging application emerging application such as mobile phone, safety and automobile camera, medical devices etc.Digital camera comprises the image sensor that forms image in order to the lens that form image and in order to capture and convert thereof into electric signal.
The camera module that is used for many application need have low manufacturing cost and less level and vertical footprint area.These camera modules can use the wafer scale technology to make and assemble to produce the wafer scale camera module.Have in the optical module and on silicon, glass or plastic substrate, make on many (if not all) assembly.Can optical crystal chip and image sensor wafer (for example, complementary metal oxide semiconductor (CMOS) (CMOS) image sensor wafer) be installed to together, and the gained wafer stack is cut into indivedual camera modules.The camera of being accomplished (comprising optical device) can use available semiconductor technology on wafer scale, to make and encapsulation.
The wafer scale camera module generally includes sensor package, has an image sensor (for example, CMOS image sensor) in this encapsulation.The lens cube is placed on the top of this sensor package, and this lens cube is immobilizated in lens or combination of lenses in this cube.On the other hand, but but one or more lens of assembling type casing fixing and also fixing image sensor.
The utility model content
The purpose of the utility model is to the wafer scale camera module protection to be provided.
According to aspect of the utility model; A kind of reinforced structure that is used to protect the wafer scale camera module is provided; This reinforced structure comprises: the top sheet shaped piece; It waits to be placed on the end face of camera module, and wherein the top sheet shaped piece comprises and is used to allow light to pass to arrive first opening of camera module; The sidepiece sheet shaped piece, it is attached to the top sheet shaped piece so that reinforced structure is fastened to printed circuit board (PCB); And second opening in the sidepiece sheet shaped piece, the permission of second open construction one-tenth is executed via second opening and is joined adhesive agent so that reinforced structure is adhered to camera module.
Preferably, above-mentioned second opening is the slit in the sidepiece sheet shaped piece.Perhaps, second opening is the slit that reaches in the sidepiece sheet shaped piece in the sheet shaped piece of top.
Preferably, top sheet shaped piece and sidepiece sheet shaped piece comprise metal.
Preferably, the thickness of top sheet shaped piece equals the thickness of sidepiece sheet shaped piece.
Preferably, the top sheet shaped piece is a quadrilateral top sheet shaped piece, and wherein the sidepiece sheet shaped piece is one of a plurality of sidepiece sheet shaped pieces, and sheet shaped piece vertically extends and be attached to the respective side portion of quadrilateral top sheet shaped piece to each sidepiece sheet shaped piece from the top.
Preferably, contiguous sidepiece sheet shaped piece is spaced apart at the lateral margin place of reinforced structure.A plurality of sidepiece sheet shaped pieces comprise: two towards each other long sidepiece sheet shaped piece; And two towards each other short sidepiece sheet shaped piece, and wherein the distance between two long sidepiece sheet shaped pieces is greater than the distance between two short sidepiece sheet shaped pieces.The root edge of sidepiece sheet shaped piece comprises a plurality of legs that are used for the sidepiece sheet shaped piece is soldered to printed circuit board (PCB).
According to another aspect of the present invention; A kind of reinforced structure that is used to protect the wafer scale camera module is provided; This reinforced structure comprises: overhead, and it waits to be placed on the end face of wafer scale camera module to be used for protection and to strengthen camera module and be used to allow light to pass through to arrive camera module; Side member, it is attached to overhead and is used for protection and strengthens camera module and be used for reinforced structure is fastened to printed circuit board (PCB); And the adhesive agent member, be used for allowing executing and join adhesive agent so that reinforced structure is adhered to camera module via side member.
Preferably, overhead and side member comprise metal.
Preferably, side member is one of a plurality of side member that are used for protecting the sidepiece of camera module, and each side member is vertically extended from overhead.
Preferably, the adjacent side portion member is spaced apart.Side member can comprise the weld assembly that is used for side member is soldered to printed circuit board (PCB).
According to a further aspect of the invention, a kind of device with the reinforced structure that is used to protect the wafer scale camera module, it comprises: the wafer scale camera module, it has lens cube and complementary metal oxide semiconductor (CMOS) sensor package; And reinforced structure, being used to protect camera module, reinforced structure comprises: the rectangular top sheet shaped piece, it is placed on the end face of camera module, and wherein the top sheet shaped piece comprises and is used to allow light to pass to arrive the opening of camera module; Four sidepiece sheet shaped pieces; It vertically extends from rectangle top sheet shape spare; Each sidepiece sheet shaped piece is attached to the sidepiece out of the ordinary of rectangular top sheet shaped piece; Wherein contiguous sidepiece sheet shaped piece is spaced apart at the lateral margin place of reinforced structure, and wherein top sheet shaped piece and four each self-contained metals of sidepiece sheet shaped piece; Leg, it is included in two the root edge in the sidepiece sheet shaped piece at least, to be used for that at least two sidepiece sheet shaped pieces are soldered to printed circuit board (PCB); Adhesive agent, it is placed between two sidepiece sheet shaped pieces and the camera module to be used for that reinforced structure is adhered to camera module at least; And the vertical slot at least two sidepiece sheet shaped pieces each, vertical slot is configured to join adhesive agent to allow to execute via vertical slot.
Preferably, in said apparatus, four sidepiece sheet shaped pieces comprise: two towards each other long sidepiece sheet shaped piece, and they are on two opposed sidepieces of rectangular top sheet shaped piece; And two towards each other short sidepiece sheet shaped piece; They are on other two opposed sidepieces of rectangular top sheet shaped piece; Wherein the distance between two long sidepiece sheet shaped pieces is greater than the distance between two short sidepiece sheet shaped pieces, makes two long sidepiece sheet shaped pieces conform to sensor package and two short sidepiece sheet shaped pieces conform to the lens cube.
Preferably, the rectangular top sheet shaped piece is placed on the end face of camera module, does not have adhesive agent therebetween.
Description of drawings
Fig. 1 is the stereographic map with wafer scale camera module of lens cube and sensor package.
Fig. 2 is the stereographic map that is used for the prior art metal housing of EMI protection.
Fig. 3 is the side cross-sectional view that is mounted to the prior art metal housing of camera module.
Fig. 4 is the skeleton view according to the reinforced structure of one of the utility model embodiment.
Fig. 5 is the skeleton view that is placed in the reinforced structure on the wafer scale camera module according to one of the utility model embodiment.
Fig. 6 is the side cross-sectional view according to the reinforced structure that is glued to camera module of one of the utility model embodiment.
Fig. 7 is being placed on the wafer scale camera module and being mounted to the skeleton view of the reinforced structure of printed circuit board (PCB) (PCB) according to one of the utility model embodiment.
Fig. 8 is the skeleton view according to the reinforced structure of the short sidepiece sheet shaped piece of having of one of the utility model embodiment.
Fig. 9 is the skeleton view that is placed in the reinforced structure with short sidepiece sheet shaped piece on the wafer scale camera module according to one of the utility model embodiment.
Figure 10 is being placed on the wafer scale camera module and being mounted to the skeleton view of the reinforced structure of the short sidepiece sheet shaped piece of having of PCB according to one of the utility model embodiment.
Figure 11 is the process flow diagram of explanation according to the program on the camera module that reinforced structure is installed on of one of the utility model embodiment.
Figure 12 is the sectional view that is used for reinforced structure is mounted to the device of camera module according to one of the utility model embodiment.
Embodiment
Below use description to strengthen the embodiment of the system and method for wafer scale camera module.In the following description, state that numerous details are to provide the thorough to these embodiment.Yet, have the knack of correlation technique person and will recognize, technology described herein one of can be in not having these details or many persons' situation under put into practice or wait to put into practice with other method, assembly, material.In other cases, detail or describe well known structures, material or operation not with some aspect of avoiding confusion.
Spreading all over this instructions means the reference of " embodiment " and combines special characteristic, structure or characteristic that this embodiment described to be included among at least one embodiment of the utility model.Therefore, the appearance at this instructions full text phrase " in one embodiment " everywhere may not all refer to same embodiment.In addition, can be with any suitable method combination special characteristic, structure or characteristic in one or more embodiment.
Fig. 1 is the skeleton view with wafer scale camera module 100 of lens cube 104 and sensor package 102.Lens cube 104 is shown as in Fig. 1 on the top that is placed in sensor package 102.In one example, the thickness 107 of sensor package 102 can be less than the thickness 105 of lens cube 104, and the xsect 103 of sensor package 102 can be greater than the xsect 101 of lens cube 104, and is as shown in fig. 1.In another embodiment, the xsect of sensor package 102 and lens cube 104 can be basic identical.In addition, other size and combination of shapes are possible.In some cases, under the situation of no extra reinforcement, camera module 100 is subject to the mechanical stress that caused by impact, bump, shearing and fellow thereof.For example, bump can cause camera module 100 spallations, or the assembly of camera module inside (such as, lens and image sensor (not icon)) dislocation becomes.
Fig. 2 is the skeleton view that is used for the prior art metal housing of EMI protection.Such as among Fig. 2 displaying, camera module 100 by outer cover 200 seal with the protection camera module 100 exempt from electromagnetic interference (EMI).For the protection that exempts from EMI is provided, outer cover 200 is made of metal, and except being used to make the opening that light passes, and outer cover 200 imperforations make penetrable this outer cover of non-electromagnetic field.
Fig. 3 is the side cross-sectional view that is mounted to the prior art metal housing 200 of camera module 100.Such as among Fig. 3 displaying, outer cover 200 hides camera modules 100, is mainly used in the EMI protection.Outer cover 200 is mounted to camera module by following operation: (1) is dispensed in glue 302 on the end face of lens cube 104, and (2) are placed in outer cover 200 on the camera module 100 surface engagement by the surface, and (3) are solidified glue 302.By this prior art processes, fail to make the space 304 between outer cover 200 and lens cube 104 and the sensor package 102 suitably and fully to fill out with glue.Therefore, outer cover 200 does not firmly combine with camera module 100.Even what is worse, the glue 302 on the top of lens cube 104 possibly have the thickness of variation, thereby causes the variation in the space between root edge and the pedestal (such as, printed circuit board (PCB) (PCB)) of outer cover 200.Therefore, outer cover 200 maybe and inappropriate and firmly be fixed to PCB.
Therefore, the embodiment of the utility model comprises the reinforced structure of the structural intergrity that is used to increase the wafer scale camera module.In certain embodiments, utilize a reinforced structure, this reinforced structure comprises that in the sidepiece sheet shaped piece opening joins adhesive agent so that this reinforced structure is adhered on the sidepiece of camera module to allow to execute via this opening.In another embodiment, this reinforced structure is glued to this camera module, no any glue on the end face of camera module wherein, with the bottom of reducing reinforced structure and the variation at the interval between the PCB, such as preceding text argumentation.In other embodiments, in reinforced structure, comprise short sidepiece sheet shaped piece, these short sidepiece sheet shaped pieces are configured to conform to provide the cubical direct organization support of lens with the lens cube.These and other embodiment is described hereinafter in more detail.
Fig. 4 is the skeleton view according to the reinforced structure 400 of one of the utility model embodiment.The illustrated instance of reinforced structure 400 has quadrilateral top sheet shaped piece 402 (that is, four sidepieces), in order to protection and strengthen camera module (for example, camera module 100).In one embodiment, top sheet shaped piece 402 is the rectangular top sheet shaped piece.As shown in Figure 4, top sheet shaped piece 402 has central opening 404, passes to arrive camera module 100 (being showed among Fig. 1) in order to allow incident light.Top sheet shaped piece 402 can have other opening, and such as opening 406, these openings can serve as the assembling that is used for reinforced structure 400 and camera module 100 and/or be used for the directed leading mark of camera module when camera module is mounted to PCB.
As shown in the figure, reinforced structure 400 further comprises four sidepiece sheet shaped pieces 408, and wherein each sidepiece sheet shaped piece 408 is attached to the sidepiece out of the ordinary of top sheet shaped piece 402.In one embodiment, sheet shaped piece 402 basically vertically extends each sidepiece sheet shaped piece 408 from the top.Sidepiece sheet shaped piece 408 is used for protection and reinforcement camera module (for example, camera module 100) and is used for reinforced structure 400 is fastened to PCB.In one example, sidepiece sheet shaped piece 408 comprises the leg 412 that is used for sidepiece sheet shaped piece 408 is soldered to PCB.In illustrated embodiment, adjacent side portion sheet shaped piece 408 is spaced apart at each lateral margin 413 place of reinforced structure 400, makes sidepiece sheet shaped piece 408 be connected to top sheet shaped piece 402 and is not connected to each other.
Each sidepiece sheet shaped piece 408 further specifies to comprising opening 410, and opening 410 is configured to allow execute via this opening joins adhesive agent so that reinforced structure 400 is adhered to camera module 100.According to the teaching among this paper, though being illustrated as each sidepiece sheet shaped piece 408, Fig. 4 comprises single opening 410, each sidepiece sheet shaped piece 408 can comprise the opening 410 of any number, comprises one or more.Each opening 410 can be configured to the slit (that is, narrow opening) in sidepiece sheet shaped piece 408.Such as among the embodiment of Fig. 4 displaying, opening 410 is the slit in sidepiece sheet shaped piece 408 and the top sheet shaped piece 402.That is opening 410 can extend to execute to join the path and/or provide glue better inspected to carry out the later stage with the high angle that glue is provided on the top of reinforced structure 400 executes the inspection of aglycon amount.
The opening 410 of reinforced structure 400 has reduced the general assembly (TW) of structure, and enough reinforcements are provided simultaneously.In addition, opening be to execute between reinforced structure and the camera module join that the glue aspect facilitates, effectiveness and efficient.Reinforced structure 400 (comprising top sheet shaped piece 402 and sidepiece sheet shaped piece 408) can be processed by metal or other material.
Fig. 5 is the skeleton view that is placed in the reinforced structure 400 on the wafer scale camera module 100 according to one of the utility model embodiment.After reinforced structure 400 is placed on the camera module 100, will be dispensed on the camera module 100 such as the adhesive agent of glue 502 via opening 410.Glue 502 will be filled the space between sidepiece sheet shaped piece 408 and the camera module 100.After solidified glue 502 suitably, reinforced structure assembly 400 firmly combines with camera module 100.Should be appreciated that at least one sidepiece sheet shaped piece 408 of reinforced structure 400 is glued to camera module 100.
Fig. 6 is the side cross-sectional view according to the reinforced structure that is glued to camera module 100 400 of one of the utility model embodiment.Such as among Fig. 6 displaying, execute via opening 410 and to join glue 502 so that reinforced structure 400 is adhered to camera module 100.In detail, with glue 502 be dispensed on the end face of sensor package 102, between lens cube 104 and the sidepiece sheet shaped piece 408.
As before mentioned about Fig. 2 and Fig. 3, art methods is placed in glue 302 on the end face (for example, end face 416) of camera module 100 usually.Yet glue 302 possibly have the thickness of variation, and this will cause the root edge of outer cover 200 and the variation in the space between the PCB.Therefore, in the embodiment of the utility model, reinforced structure 400 can be placed on the end face 416 of camera module 100, does not have adhesive agent therebetween.That is, via opening 410 reinforced structure 400 is glued to camera module 100, wherein there is gap 605 between end face 416 and the top sheet shaped piece 402, and do not have glue in its intermediate gap 605.
Fig. 6 explanation is according to the various others of the reinforced structure 400 of the embodiment of the utility model.For example, top sheet shaped piece 402 can comprise the thickness 603 of the thickness 601 that is substantially equal to sidepiece sheet shaped piece 408.
Fig. 7 is being placed on the wafer scale camera module 100 and being mounted to the skeleton view of the reinforced structure 400 of printed circuit board (PCB) (PCB) 702 according to one of the utility model embodiment.Fig. 7 is illustrated in reinforced structure 400 and is mounted to after the camera module 100, and the leg 412 of reinforced structure 400 is soldered to the pad 704 on the PCB 702.In some embodiments, sidepiece sheet shaped piece 408 can have continuous bottom but not leg (for example, no leg).In such cases, the root edge of sidepiece sheet shaped piece 408 is soldered to the pad on the PCB 702.In addition, according to the teaching among this paper, comprise two legs 412 though all figure are illustrated as each sidepiece sheet shaped piece 408, each sidepiece sheet shaped piece 408 can comprise any number leg 412, comprises one or more.PCB 702 is also installed and be soldered to wafer scale camera module 100.Should be appreciated that at least one sidepiece sheet shaped piece is soldered to PCB 702.
Fig. 8 is the skeleton view according to the reinforced structure 800 of long sidepiece sheet shaped piece 808 of having of one of the utility model embodiment and short sidepiece sheet shaped piece 814.The illustrated instance of reinforced structure 800 has quadrilateral top sheet shaped piece 802 (that is, four sidepieces) with protection and strengthen camera module (for example, camera module 100).In one embodiment, top sheet shaped piece 802 is the rectangular top sheet shaped piece.As shown in Figure 8, top sheet shaped piece 802 has central opening 804 and passes to arrive camera module 100 (being showed among Fig. 1) to allow incident light.Top sheet shaped piece 802 can have other opening, and such as opening 806, these openings can serve as assembling that is used for reinforced structure 800 and camera module 100 and/or the leading mark that is used for camera module is mounted to PCB.
Such as displaying, reinforced structure 800 further comprises two long sidepiece sheet shaped pieces 808 and two short sidepiece sheet shaped pieces 814, wherein each sidepiece sheet shaped piece is attached to the sidepiece out of the ordinary of top sheet shaped piece 802.In one embodiment, sheet shaped piece 802 basically vertically extends each sidepiece sheet shaped piece 808 and 814 from the top.Sidepiece sheet shaped piece 808 and 814 is used for protection and strengthens camera module (for example, camera module 100).Yet, short sidepiece sheet shaped piece 814 make opening below and be not configured to extend to PCB always.In one embodiment, a pair of short sidepiece sheet shaped piece 814 is configured to conform to the lens cube 104 of sensor package 100 providing the direct organization to lens cube 104 to support, and long sidepiece sheet shaped piece 808 is configured to conform to sensor package 102.Therefore, two on two of top sheet shaped piece 802 opposed sidepieces towards the distance 801 between the long sidepiece sheet shaped piece 808 each other can greater than at two on other two opposed sidepieces of top sheet shaped piece 802 towards the distance 803 between the short sidepiece sheet shaped piece 814 each other.But the size 101 of the distance 803 matched lenses cubes 104 between two short sidepiece sheet shaped pieces 814, but and the size 103 of distance 801 matched sensors encapsulation 102.
Long sidepiece sheet shaped piece 808 is further used for reinforced structure 800 is fastened to PCB.In one example, long sidepiece sheet shaped piece 808 comprises the leg 812 that is used for long sidepiece sheet shaped piece 808 is soldered to PCB.In illustrated embodiment, the adjacent side portion sheet shaped piece is spaced apart at each lateral margin place of reinforced structure 800, makes sidepiece sheet shaped piece 808 and 814 be connected to top sheet shaped piece 802 and is not connected to each other.Long sidepiece sheet shaped piece 808 can have two legs 812.Reinforced structure 800 can be processed by metal or other material.
Each long sidepiece sheet shaped piece 808 further specifies to comprising opening 810, and opening 810 is configured to join adhesive agent so that reinforced structure 800 is adhered to camera module 100 to allow to execute via this opening.According to the teaching among this paper, though being illustrated as each long sidepiece sheet shaped piece 808, Fig. 8 comprises single opening 810, each long sidepiece sheet shaped piece 808 can comprise any number opening 810, comprises one or more.Each opening 810 can be configured to be arranged in the slit (that is, narrow opening) of long sidepiece sheet shaped piece 808.Such as among the embodiment of Fig. 8 displaying, opening 810 is the slit in long sidepiece sheet shaped piece 808 and the top sheet shaped piece 802.That is opening 810 can extend to execute to join the path and/or provide glue better inspected to carry out the later stage with the high angle that glue is provided on the top of reinforced structure 800 executes the inspection of aglycon amount.
Fig. 9 is the skeleton view that is placed in the reinforced structure with short sidepiece sheet shaped piece 814 800 on the wafer scale camera module 100 according to one of the utility model embodiment.After reinforced structure 800 is placed on the camera module 100, will be dispensed on the camera module 100 such as the adhesive agent of glue 902 via the opening 810 of long sidepiece sheet shaped piece 808.Glue 902 will be filled the space between long sidepiece sheet shaped piece 808 and the camera module 100.After solidified glue 902 suitably, reinforced structure assembly 800 firmly combines with camera module 100.Should be appreciated that at least one long sidepiece sheet shaped piece 808 of reinforced structure 800 is glued to camera module 100.
Figure 10 is being placed on the wafer scale camera module and being mounted to the skeleton view of the reinforced structure of the short sidepiece sheet shaped piece of having of PCB according to one of the utility model embodiment.Figure 10 is illustrated in reinforced structure 800 and is mounted to after the camera module 100, and the leg 812 of long sidepiece sheet shaped piece 808 is soldered to the pad 1004 on the PCB 1002.In some embodiments, long sidepiece sheet shaped piece 808 can have continuous bottom but not leg (for example, no leg).In such cases, the root edge of long sidepiece sheet shaped piece 808 is soldered to the pad on the PCB 1002.In addition, according to the teaching among this paper, comprise two legs 812 though all figure are illustrated as each long sidepiece sheet shaped piece 808, each long sidepiece sheet shaped piece 808 can comprise the leg 812 of any number, comprises one or more.PCB 1002 is also installed and be soldered to wafer scale camera module 100.Should be appreciated that at least one long sidepiece sheet shaped piece 808 is soldered to PCB 1002.
Figure 11 and Figure 12 explanation are according to the program 1100 and the device that are used for reinforced structure 1206 is mounted to wafer scale camera module 1208 of one of the utility model embodiment.To come description program 1100 referring to Figure 11 and Figure 12.
In step 1101, the chassis (base tray) 1202 with cavity 1204 is provided.Each cavity 1204 is configured to size and the shape-consistent with reinforced structure 1206 and camera module 1208.In step 1102, camera module 1208 is placed on the chassis 1202 in the cavity 1204.In step 1103, reinforced structure 1206 is placed on the chassis 1202 on camera module 1208.In step 1104, the top sheet shaped piece 1210 with power F1 is applied to reinforced structure 1206 makes reinforced structure 1206 contact with chassis 1202.For example, the mechanical compression device 1214 that has by pad 1216 will be positioned on the top sheet shaped piece 1210 of reinforced structure 1206 by pad 1216.Should be appreciated that, at least onely power F1 is provided by pad.In step 1105, execute via the opening 1220 of the sidepiece sheet shaped piece 1222 of reinforced structure 1206 and to join glue 1218.In step 1106; The air pressure that is produced by the airflow 1224 of opening 1234 through mechanical compression device 1214 and the central opening 1226 through top sheet shaped piece 1210 is applied to the end face 1212 of camera module 1208 with power F2,1202 to come firmly fixing camera module 1208 and to prevent that camera module 1208 from moving against the chassis.Send air 1224 by air delivery configuration 1228.Apply power F1 and F2 and also keep, at least until glue 1218 is solidified to be enough to that reinforced structure 1206 is fastened to camera module 1208.
In step 1107, suitably solidified glue 1218.In step 1108, remove mechanical compression device 1214 and air delivery configuration 1228.It is 1228 capable of being combined in single equipment that mechanical compression device 1214 and air delivery dispose.In step 1109,1202 structures (it is the reinforced structure 1206 that is mounted to camera module 1208) that remove through combining from the chassis.
The some or all of order that appear in the program 1100 in the program area block should not be regarded as restriction.On the contrary, benefit from as one of the utility model that those who familiarize themselves with the technology will understand, the various order that some in the processing procedure block can be undeclared are carried out.
The above description of the illustrated embodiment of the utility model (be included in summary described within hold) is not intended to be detailed or the utility model is limited to the precise forms that is disclosed.As have the knack of correlation technique person and will recognize, though describe the specific embodiment and the instance of the utility model in this article for illustration purposes, various modifications are possible in the category of the utility model.
Can carry out these modifications to the utility model according to above detailed description.The term that in following claim, is used should not be understood that specific embodiment that the utility model is limited in this instructions to be disclosed.On the contrary, the category of the utility model will confirm that by following claim following claim will be understood according to the parameter that claim is explained fully.
Claims (17)
1. a reinforced structure that is used to protect the wafer scale camera module is characterized in that, said reinforced structure comprises:
The top sheet shaped piece, it waits to be placed on the end face of said camera module, and wherein said top sheet shaped piece comprises and is used to allow light to pass to arrive first opening of said camera module;
The sidepiece sheet shaped piece, it is attached to said top sheet shaped piece so that said reinforced structure is fastened to printed circuit board (PCB); And
Second opening in the said sidepiece sheet shaped piece, the permission of said second open construction one-tenth is executed via second opening and is joined adhesive agent so that said reinforced structure is adhered to said camera module.
2. reinforced structure as claimed in claim 1 is characterized in that, said second opening is the slit in the said sidepiece sheet shaped piece.
3. reinforced structure as claimed in claim 1 is characterized in that, said second opening is the slit that reaches in the said sidepiece sheet shaped piece in the sheet shaped piece of said top.
4. reinforced structure as claimed in claim 1 is characterized in that, said top sheet shaped piece and said sidepiece sheet shaped piece comprise metal.
5. reinforced structure as claimed in claim 1 is characterized in that, the thickness of said top sheet shaped piece equals the thickness of said sidepiece sheet shaped piece.
6. reinforced structure as claimed in claim 1; It is characterized in that; Said top sheet shaped piece is a quadrilateral top sheet shaped piece; And wherein said sidepiece sheet shaped piece is one of a plurality of sidepiece sheet shaped pieces, and sheet shaped piece vertically extends and be attached to the respective side portion of said quadrilateral top sheet shaped piece to each sidepiece sheet shaped piece from said top.
7. reinforced structure as claimed in claim 6 is characterized in that, contiguous sidepiece sheet shaped piece is spaced apart at the lateral margin place of said reinforced structure.
8. reinforced structure as claimed in claim 6 is characterized in that, said a plurality of sidepiece sheet shaped pieces comprise:
Two towards each other long sidepiece sheet shaped piece; And
Two towards each other short sidepiece sheet shaped piece, and the distance between wherein said two long sidepiece sheet shaped pieces is greater than the distance between said two short sidepiece sheet shaped pieces.
9. reinforced structure as claimed in claim 1 is characterized in that, the root edge of said sidepiece sheet shaped piece comprises a plurality of legs that are used for said sidepiece sheet shaped piece is soldered to said printed circuit board (PCB).
10. a reinforced structure that is used to protect the wafer scale camera module is characterized in that, said reinforced structure comprises:
Overhead, it waits to be placed on the end face of said wafer scale camera module to be used for protection and to strengthen said camera module and be used to allow light to pass through to arrive said camera module;
Side member, it is attached to said overhead and is used for protection and strengthens said camera module and be used for said reinforced structure is fastened to printed circuit board (PCB); And
The adhesive agent member is used for allowing executing via said side member and joins adhesive agent so that said reinforced structure is adhered to said camera module.
11. the reinforced structure like claim 10 is characterized in that, said overhead and said side member comprise metal.
12. the reinforced structure like claim 10 is characterized in that, said side member is one of a plurality of side member that are used for protecting the sidepiece of said camera module, and each side member is vertically extended from said overhead.
13. the reinforced structure like claim 10 is characterized in that, the adjacent side portion member is spaced apart.
14. the reinforced structure like claim 10 is characterized in that, said side member comprises the weld assembly that is used for said side member is soldered to said printed circuit board (PCB).
15. one kind has wafer scale camera module and the device that is used to protect the wafer scale camera module, it comprises:
Said wafer scale camera module, it has lens cube and complementary metal oxide semiconductor (CMOS) sensor package; And
Said reinforced structure is used to protect said camera module, it is characterized in that, said reinforced structure comprises:
The rectangular top sheet shaped piece, it is placed on the end face of said camera module, and wherein said top sheet shaped piece comprises and is used to allow light to pass to arrive the opening of said camera module;
Four sidepiece sheet shaped pieces; It vertically extends from said rectangular top sheet shaped piece; Each sidepiece sheet shaped piece is attached to the sidepiece out of the ordinary of said rectangular top sheet shaped piece; Wherein contiguous sidepiece sheet shaped piece is spaced apart at the lateral margin place of said reinforced structure, and wherein said top sheet shaped piece and said each self-contained metal of four sidepiece sheet shaped pieces;
Leg, it is included in two the root edge in the said sidepiece sheet shaped piece at least, to be used for that said at least two sidepiece sheet shaped pieces are soldered to printed circuit board (PCB);
Adhesive agent, it is placed between said two sidepiece sheet shaped pieces and the said camera module to be used for that said reinforced structure is adhered to said camera module at least; And
Vertical slot in said at least two sidepiece sheet shaped pieces each, said vertical slot are configured to join said adhesive agent to allow to execute via said vertical slot.
16. the device like claim 15 is characterized in that, said four sidepiece sheet shaped pieces comprise:
Two towards each other long sidepiece sheet shaped piece, and they are on two opposed sidepieces of said rectangular top sheet shaped piece; And
Two towards each other short sidepiece sheet shaped piece; They are on other two opposed sidepieces of said rectangular top sheet shaped piece; Distance between wherein said two long sidepiece sheet shaped pieces is greater than the distance between said two short sidepiece sheet shaped pieces, makes said two long sidepiece sheet shaped pieces conform to said sensor package and said two short sidepiece sheet shaped pieces conform to said lens cube.
17. the device like claim 15 is characterized in that, said rectangular top sheet shaped piece is placed on the said end face of said camera module, does not have adhesive agent therebetween.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US35881910P | 2010-06-25 | 2010-06-25 | |
| US61/358,819 | 2010-06-25 | ||
| US13/099,905 US8665364B2 (en) | 2010-06-25 | 2011-05-03 | Reinforcement structure for wafer-level camera module |
| US13/099,905 | 2011-05-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202394027U true CN202394027U (en) | 2012-08-22 |
Family
ID=45352216
Family Applications (2)
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| CN2011202026883U Expired - Lifetime CN202394027U (en) | 2010-06-25 | 2011-06-07 | A reinforcement structure used for protecting a wafer level camera module and device having the wafer level camera module |
| CN201110165204.7A Active CN102298247B (en) | 2010-06-25 | 2011-06-07 | Reinforcement structure for wafer-level camera module |
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| CN201110165204.7A Active CN102298247B (en) | 2010-06-25 | 2011-06-07 | Reinforcement structure for wafer-level camera module |
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| US (1) | US8665364B2 (en) |
| CN (2) | CN202394027U (en) |
| TW (1) | TWI450580B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102298247A (en) * | 2010-06-25 | 2011-12-28 | 美商豪威科技股份有限公司 | Reinforcement structure for wafer-level camera module |
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-
2011
- 2011-05-03 US US13/099,905 patent/US8665364B2/en active Active
- 2011-05-27 TW TW100118721A patent/TWI450580B/en active
- 2011-06-07 CN CN2011202026883U patent/CN202394027U/en not_active Expired - Lifetime
- 2011-06-07 CN CN201110165204.7A patent/CN102298247B/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102298247A (en) * | 2010-06-25 | 2011-12-28 | 美商豪威科技股份有限公司 | Reinforcement structure for wafer-level camera module |
| US8665364B2 (en) | 2010-06-25 | 2014-03-04 | Omnivision Technologies, Inc. | Reinforcement structure for wafer-level camera module |
| CN102298247B (en) * | 2010-06-25 | 2015-01-07 | 美商豪威科技股份有限公司 | Reinforcement structure for wafer-level camera module |
Also Published As
| Publication number | Publication date |
|---|---|
| US8665364B2 (en) | 2014-03-04 |
| TW201208357A (en) | 2012-02-16 |
| TWI450580B (en) | 2014-08-21 |
| US20110317065A1 (en) | 2011-12-29 |
| CN102298247B (en) | 2015-01-07 |
| CN102298247A (en) | 2011-12-28 |
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Granted publication date: 20120822 Effective date of abandoning: 20150107 |
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| AV01 | Patent right actively abandoned |
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