CN202382256U - Oxygen synthesizing and heating device for purifying waste gas in semiconductor manufacturing process - Google Patents
Oxygen synthesizing and heating device for purifying waste gas in semiconductor manufacturing process Download PDFInfo
- Publication number
- CN202382256U CN202382256U CN2011204321785U CN201120432178U CN202382256U CN 202382256 U CN202382256 U CN 202382256U CN 2011204321785 U CN2011204321785 U CN 2011204321785U CN 201120432178 U CN201120432178 U CN 201120432178U CN 202382256 U CN202382256 U CN 202382256U
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- China
- Prior art keywords
- waste gas
- treatment trough
- air
- heat pipe
- semiconductor
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000002912 waste gas Substances 0.000 title claims abstract description 107
- 238000010438 heat treatment Methods 0.000 title claims abstract description 23
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 title claims abstract description 22
- 239000001301 oxygen Substances 0.000 title claims abstract description 22
- 229910052760 oxygen Inorganic materials 0.000 title claims abstract description 22
- 239000004065 semiconductor Substances 0.000 title claims abstract description 21
- 238000004519 manufacturing process Methods 0.000 title claims description 20
- 230000002194 synthesizing effect Effects 0.000 title 1
- 238000000746 purification Methods 0.000 claims abstract description 7
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 6
- 239000007943 implant Substances 0.000 claims description 4
- 239000011148 porous material Substances 0.000 claims description 4
- 239000007789 gas Substances 0.000 abstract description 20
- 239000000126 substance Substances 0.000 abstract description 12
- 238000000034 method Methods 0.000 abstract description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 22
- 229910052757 nitrogen Inorganic materials 0.000 description 11
- 239000000843 powder Substances 0.000 description 11
- 230000009286 beneficial effect Effects 0.000 description 6
- 210000002421 cell wall Anatomy 0.000 description 6
- 241000196324 Embryophyta Species 0.000 description 4
- 241000628997 Flos Species 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- YZCKVEUIGOORGS-UHFFFAOYSA-N Hydrogen atom Chemical compound [H] YZCKVEUIGOORGS-UHFFFAOYSA-N 0.000 description 1
- 241000233855 Orchidaceae Species 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000000567 combustion gas Substances 0.000 description 1
- 230000000875 corresponding effect Effects 0.000 description 1
- 238000005202 decontamination Methods 0.000 description 1
- 230000003467 diminishing effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000009191 jumping Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
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- Treating Waste Gases (AREA)
Abstract
The utility model provides a purify oxygen heating device that closes of semiconductor processing procedure waste gas, locate the headstock at treatment trough top including the cover, be equipped with exhaust gas conduit and heat pipe on the headstock, this exhaust gas conduit extends to and forms a exhaust emission port down in this treatment trough, this heat pipe is implanted and is formed a tub portion that extends formation along this exhaust emission port direction in this treatment trough, and this tub portion one end forms a hot air discharge port, this hot air discharge port is less than this exhaust emission port specific distance, in order to supply hot air entering treatment trough, and increase the contact time of the heat source that waste gas and this heat pipe produced, with the harmful substance in the purification waste gas.
Description
Technical field
The utility model relates to the cleaning equipment of manufacture of semiconductor waste gas, particularly a kind of purify manufacture of semiconductor waste gas close the oxygen heating plant.
Background technology
Knownly produce in the process semi-conductive; Can produce many have toxicity, corrosivity and flammable processing procedure waste gas; Cause public hazards for fear of this exhaust emission environment, must be earlier with the harmful substance in this waste gas filter removal after, could be with harmless toxic emission to ambient atmosphere.
Traditional manufacture of semiconductor treatment of waste gas mode comprises a kind of mode of flame purifying exhaust air and the mode of another kind of hot-air purifying exhaust air.Wherein,, must supply with combustion gas entering exhaust-gas treatment groove and light the formation thermal-flame, the harmful substance in the waste gas burnt the effect that mistake obtains purifying exhaust air through this thermal-flame with the mode of the clean waste gasization of flame; With the mode of hot-air purifying exhaust air, be to get in the exhaust-gas treatment groove from the extraneous high-temperature hot air of supplying with, make with harmful exhaust and mixes, and harmful substance is burnt mistake and obtained the effect of purifying exhaust air.
To the mode of above-mentioned supply hot-air with purifying exhaust air; Present stage disclosed correlation technique; Be that a hot-air supply pipe is mounted on this exhaust-gas treatment cell wall; And not to be the heat-supplying mode identical with the exhaust gas entrance direction, hot-air is imported in the exhaust-gas treatment groove, make and mix with harmful exhaust and harmful substance is burnt mistake.But; Owing to getting into manufacture of semiconductor waste gas in the exhaust-gas treatment groove is to drive via waste gas pump (DRY PUMP) to have a specific charged air pressure; The hot-air that causes the waste gas in this treatment trough to infeed with this different directions takes place to mix the back and to purify action time of harmful substance very limited, and even purification efficiency is affected relatively.
Moreover; Owing to purify the used equipment of manufacture of semiconductor waste gas; Be to close oxygen headstock (OXYGENATED HEAD) by one to be combined on this exhaust-gas treatment groove and to form; An above-mentioned waste gas duct and a dry air conduit and a nitrogen conduit normally are located at this and close on the oxygen headstock, get in the treatment trough so that guide this waste gas, dry air and nitrogen, accept the purified treatment of the flame or the hot-air of high temperature.Yet; In decontamination process, can pile up powder (POWDER) at the floss hole place of conduits such as said waste gas, dry air and nitrogen unavoidably, because these a plurality of floss holes are that the position is in treatment trough; Cleaning is difficult for; Powder accumulate over a long period following, be prone to these a plurality of gas purging interruption-forming vapour locks, and influence service life of treatment trough.
In addition; Tradition is located at the waste gas duct that closes on the oxygen headstock, is subject to the group of closing on the oxygen headstock and establishes area, and the pore internal diameter of this waste gas duct is had by airintake direction toward the diminishing situation of discharge directions; Make that the bore of the Waste gas outlet that the exhaust-gas treatment groove is interior is less; Thus, certainly will in the waste gas supply line, form back pressure, and then increase the load that waste gas is given the waste gas pump of gas end; The floss hole place that adds this waste gas duct pushes away the accumulated powder end easily, and even causes the load of waste gas pump excessive and have the jumping machine of generation (working as machine) to cause the problem that decommissions.
Summary of the invention
The purpose of the utility model is intended to improve following point:
1. hot-air gets into the The limited time that contacts with waste gas in the exhaust-gas treatment groove and influences the efficient of harmful substance in the purifying exhaust air.
2. it is not quick detachable to be arranged at the waste gas duct, dry air conduit and the nitrogen conduit that close on the oxygen headstock, causes being difficult to removing the powder that the floss hole of said conduit is piled up, and influences the service life of waste gas treatment equipment.
3. the bore of the Waste gas outlet of waste gas duct is less or inconsistent, causes supplying waste gas and gets into easy living back pressure in the treatment trough process, and influence the normal operation of waste gas pump.
For realizing above-mentioned purpose and deal with problems, the utility model provide a kind of purify manufacture of semiconductor waste gas close the oxygen heating plant, its technological means comprises:
One treatment trough;
One headstock covers at this treatment trough top, and this headstock is provided with more than one waste gas duct and more than one heat pipe; Wherein:
This waste gas duct extends to formation one Waste gas outlet down in this treatment trough; This heat pipe is implanted and is formed one in this treatment trough along pipe portion that this Waste gas outlet direction extends to form; And should form at least one exhaust of hot air mouth by pipe portion one end, this exhaust of hot air mouth is lower than this Waste gas outlet one specific range.
According to above-mentioned technological means, can increase the time of contact of the thermal source of interior waste gas of exhaust-gas treatment groove and the generation of this heat pipe, and then promote the efficient of harmful substance in the hot-air purifying exhaust air.
Technological means of the utility model and corresponding effect thereof also comprise:
Said headstock comprises the stroma that a female seat and is incorporated on female seat; Wherein, this waste gas duct comprises the outer catheter of being located on this stroma, and one is located on this mother's seat and extends to the inner catheter that forms this Waste gas outlet in this treatment trough.So, will help in case of necessity the stroma on female seat is unloaded, and make outer catheter on the stroma simultaneously by removal, and inner catheter is appeared, remove the powder of piling up on this Waste gas outlet and be beneficial to, to keep the service life of waste gas treatment equipment.
Said headstock comprises the stroma that a female seat and is incorporated on female seat; Wherein, this heat pipe is to be located on this stroma, and passes this mother's seat and implant that formation should pipe portion in this treatment trough.So; To help in case of necessity the stroma on female seat being unloaded, and the heat pipe on the stroma can be removed in treatment trough simultaneously, and manifest the exhaust of hot air mouth of heat pipe; And then be beneficial to the powder of piling up on this exhaust of hot air mouth of removing, with the air feed smoothness of maintaining heat air.
Wherein also comprise the air conduit of being located on this stroma, it has an air discharge ports and is connected with treatment trough.This mother's seat bottom has a fence, and this fence bottom has some passages, and in fence, forms an air chamber, and this air chamber is connected with air discharge ports, and air chamber is connected with treatment trough via passage.
The quantity that is provided with of said waste gas duct and heat pipe is even number, and is to adopt interval mode and correspondence is arranged on this headstock.So, help disposing simultaneously on the headstock a plurality of waste gas ducts and heat pipe.
Pore diameter in the said waste gas duct is all identical.So, can avoid supplying waste gas and get in the treatment trough process and produce back pressure, and keep the function of waste gas pump normal operation.
Said heat pipe is loaded with the electrothermal tube of heating wire in being.So, can rely on this heat pipe and, and infeed in the exhaust-gas treatment groove usefulness, set up hot-air outward and produce equipment and avoid waste gas treatment equipment as harmful substance in the purifying exhaust air with the normal temperature air generation hot-air of directly heating.
Understand above-mentioned technological means of the utility model and usefulness thereof for abundant, and implement the utility model according to this, see also the explanation of embodiment content and conjunction with figs. as follows:
Description of drawings
Fig. 1 is the stereogram of the utility model;
Fig. 2 is the three-dimensional exploded view of configuration shown in Figure 1;
Fig. 3 is the vertical view of configuration shown in Figure 1;
Fig. 4 is the cut-away view of A-A section among Fig. 3;
Fig. 5 is the cut-away view of B-B section among Fig. 3;
Fig. 6 is that cut-away view is amplified in the part of heat pipe shown in Figure 1.
Description of reference numerals: treatment trough 10; Cell wall 11; Sub-flange 12; Headstock 20; Mother law blue 21; Interlocking hole 22; Stroma 23; Female seat 24; Fence 25; Passage 26; Air chamber 27; Waste gas duct 30; Waste gas outlet 31; Outer catheter 32; Inner catheter 33; Heat pipe 40; Lock-joining part 41; Pipe portion 42; Exhaust of hot air mouth 43; Heating wire 44; Interior pipe 45; Outer tube 46; Specific range h; Air conduit 50; Air discharge ports 51; Nitrogen conduit 60.
The specific embodiment
Please merge and consult Fig. 1 to shown in Figure 5; Wherein, Fig. 1 discloses the stereogram of the utility model, and Fig. 2 discloses the three-dimensional exploded view of configuration shown in Figure 1, and Fig. 3 discloses the vertical view of configuration shown in Figure 1, and Fig. 4 discloses the cut-away view of A-A section among Fig. 3, and Fig. 5 discloses the cut-away view of B-B section among Fig. 3.By above-mentioned description of drawings the utility model provide a kind of purify manufacture of semiconductor waste gas close the oxygen heating plant, comprise a treatment trough 10 and a headstock 20; Wherein:
This treatment trough 10 is tubular type body, on its cell wall 11 waterwall can be set on demand, hoards to prevent that powder is stained with to cover, and cell wall 11 tops have a sub-flange (FLANGE) 12, establish this in order to group and close oxygen headstock 20.In the practical implementation of the utility model; On the cell wall 11 of treatment trough 10, do not install the required element of any heat exhaust gases; But in fact; Cell wall 11 internal layers of this treatment trough 10 are also configurable to have electric heater, the waste gas in the treatment trough 10 is heated, but do not influence the enforcement of stating heat-pipe elements after the utility model configuration.
These headstock 20 essence are to close oxygen headstock (OXYGENATED HEAD); The pedestal outer rim has a mother law blue 21; In order to the sub-flange 11 of the above-mentioned treatment trough of correspondence headstock 20 is covered at this treatment trough 10 tops; Can supply between this son, the mother law orchid locking some bolts, making can firm combining between headstock 20 and the treatment trough 10.And utilize 20 groups of this headstocks to establish more than one waste gas duct 30 and more than one heat pipe 40; Wherein:
These waste gas duct 30 1 ends are the feed ends that are connected in manufacture of semiconductor waste gas, and the other end is to be fixed on this headstock 20.This waste gas duct 30 can be made into the bending body according to the demand on the assembled configuration environment, and makes these waste gas duct 30 inside have identical caliber according to the requirement on the unobstructed property of air guide.It is to pass this headstock 20 and extend in this treatment trough 10 that this waste gas duct 30 is fixed in end on the headstock 20, and then forms down a Waste gas outlet 31.In addition, can dispose the nitrogen conduit 60 of difference shape on the tube wall that waste gas duct 30 exposes, so that importing nitrogen and waste gas are mixed together the back and infeed in the treatment trough 10.
These heat pipe 40 essence are the straight tube-like element of a supply hot-air; Has a lock-joining part 41 on the outer wall of heat pipe 40; And on the position of desire assembling heat pipe 40 on this headstock 20, also be formed with an interlocking hole 22; Thus with lock-joining part 41 spiral shell groups on interlocking hole 22, so that on this headstock 20 heat pipe 40 is set.This heat pipe 40 and the pipe portion 42 with an equivalent length can implant in this treatment trough 10; Specifically should pipe portion 42 extend to form along these Waste gas outlet 31 directions; And should form at least one exhaust of hot air mouth 43 by pipe portion 42 1 ends; This exhaust of hot air mouth 43 can be a plurality of holes in fact, and is to be distributed in around the tube wall of pipe portion 42 nearly bottoms, moreover this air discharge ports 43 is lower than this Waste gas outlet 31 1 specific range h.
Be realized that by above-mentioned explanation: the degree of depth that this heat pipe 40 is implanted exhaust-gas treatment groove 10 relatively is deeper than this Waste gas outlet 31; Particularly make this pipe portion 42 all be lower than Waste gas outlet 31 with exhaust of hot air mouth 43; Wherein between this exhaust of hot air mouth 43 and this Waste gas outlet 31 even the potential difference of possessing this specific range h, and owing to this heat pipe 42 is to extend to form along these Waste gas outlet 31 directions, therefore when manufacture of semiconductor waste gas is written in the treatment trough 10 via Waste gas outlet 31; The waste gas that in specific range h scope, flows; Can contact with the pipe portion 42 of heat pipe 40 earlier, in other words, can by the heat radiation that the pipe portion of heat pipe 40 42 produces; Just can be earlier and specific range h scope in the waste gas that flows carry out heat exchange; Produce the effect of the first road heat exhaust gases, carry out heat exchange along catadromous waste gas of specific range h and the hot-air gushed out with Waste gas outlet 31 immediately subsequently, produce the effect of the second road heat exhaust gases.Implement so repeatedly, just can increase the time of contact of the thermal source that waste gas and this heat pipe 40 in the exhaust-gas treatment groove 10 produce, and then the efficient of harmful substance in the lifting hot-air purifying exhaust air.
In further practical implementation, the utility model also comprises following implementation detail:
Said headstock 20 can be to be mutually combined by female seat 24 and one stroma 23 to form (as shown in Figure 2), this son, female seat 23, can dispose between 24 and is beneficial to bolt or other the equivalent module modes that dismounting and assembling are used, and stroma 23 can be incorporated on female 24.
Based on the embodiment of above-mentioned son, female seat 23,24, comprise an outer catheter 32 and an inner catheter 33 and be able to said waste gas duct 30 is implemented as, and this outer catheter 32 is fixedly arranged on this stroma 23, and this inner catheter 33 is fixedly arranged on this mother's seat 24.Wherein, above-mentioned nitrogen conduit 60 is to be located on the outer catheter 32; This inner catheter 33 is to be seated in the treatment trough 10, and extends to form this Waste gas outlet 31.So configuration; To help in case of necessity the stroma 23 on female seat 24 is unloaded, and make outer catheter 32 on the stroma 23 simultaneously by removal, and inner catheter 33 is appeared; Remove the powder of piling up on this Waste gas outlet 31 and be beneficial to, to keep the service life of waste gas treatment equipment.
Embodiment based on above-mentioned son, female seat 23,24 also is beneficial to said heat pipe 40 is located on this stroma 23, and passes this mother's seat 24 and implant the exhaust of hot air mouths 43 that form these pipe portions and pipe portion one end in this treatment trough 10.So configuration can be taken out this heat pipe 40 when also helping to unload hypostroma 23 simultaneously from treatment trough 10, and manifests the exhaust of hot air mouth of heat pipe, and then is beneficial to the powder of removing accumulation on this exhaust of hot air mouth 43, with the air feed smoothness of maintaining heat air.
The utility model is also contained at least one air conduit 50 is set on this stroma 23, and (CLEAN DRY AIR CDA) gets in this treatment trough 10 so that guide the dry air that cleans; Therefore, also can unload this air conduit 50 simultaneously when unloading hypostroma 23, be prone to give birth to the powder of piling up on its air discharge ports 51 to remove above-mentioned.Based on configuration like this; A fence 25 also can be set up in female seat 24 bottoms of the utility model; And fence 25 bottoms are laid with some passages 26; Make to form an air chamber 27 in the fence 25, and air chamber 27 is connected with this air discharge ports 51, and this air chamber 27 is connected with treatment trough 10 via passage 26; In view of the above; This air conduit 50 can be earlier with after temporarily hoarding in the dry air importing air chamber 27 that cleans; Again via the passage 26 of this laying with more evenly and the mode of disperseing the dry air of the cleaning in the air chamber 27 is imported in the treatment trough 10; Produce hydrogen ion (H+) so that in treatment trough 10, together accept the heating of hot-air, the required of harmful substance in the purifying exhaust air is provided.
In addition; The quantity that is provided with of above-mentioned waste gas duct 30, heat pipe 40, air conduit 50 and nitrogen conduit 60 all can be a plurality of; But because the caliber of waste gas duct 30 is much larger than heat pipe 40, air conduit 50 and nitrogen conduit 60; In order on the set and limited area of headstock 20, waste gas duct 30, heat pipe 40 and air conduit 50 to be set, the quantity that is provided with that limits this waste gas duct 30 and heat pipe 40 especially may be embodied as even number, and adopts the space mode and correspondence is arranged on this headstock 20; And then help disposing simultaneously on the headstock 20 a plurality of waste gas duct 30, heat pipe 40, air conduit 50 and nitrogen conduit 60, to promote the waste gas purification amount ability of treatment trough 10.
Because the pore diameter of said waste gas duct 30 (comprising outer catheter 32 and inner catheter 33) is all identical, therefore can avoids supplying waste gas and get in treatment trough 10 processes and produce back pressure, to keep the function of being located at waste gas pump (announcement) normal operation.
Other sees also Fig. 6; Disclose the part of heat pipe shown in Figure 1 and amplify cut-away view; Explain that said heat pipe 40 is loaded with the electrothermal tube of heating wire 44 in can be in fact; Heating wire 44 circle is around in one between the pipe 45 and outer tube 46, and in the external world infeeded to pressure pipe 45 interior air moment heat into hot-air so that hot-air is infeeded in the treatment trough 10; Perhaps, said heat pipe 40 also is embodied as the hot-air supply pipe that does not contain heating wire, and only the extraneous hot-air of pressing supply of giving of specific responsibility guiding gets in the treatment trough 10, as the usefulness of harmful substance in the purifying exhaust air.
The above is merely the preferred embodiment of the utility model, and not in order to restriction the utility model, interior any modification of making of all spirit at the utility model and principle, replacement, improvement etc. all should be included within the scope that the utility model protects.
Claims (9)
- One kind purify manufacture of semiconductor waste gas close the oxygen heating plant, it is characterized in that, comprising:One treatment trough;One headstock covers at this treatment trough top, and this headstock is provided with more than one waste gas duct and more than one heat pipe; Wherein:This waste gas duct extends to formation one Waste gas outlet down in this treatment trough; This heat pipe is implanted and is formed one in this treatment trough along pipe portion that this Waste gas outlet direction extends to form; And should form at least one exhaust of hot air mouth by pipe portion one end, this exhaust of hot air mouth is lower than this Waste gas outlet.
- 2. what purify manufacture of semiconductor waste gas according to claim 1 closes the oxygen heating plant, it is characterized in that, this headstock comprises the stroma that a female seat and is incorporated on female seat.
- As the said purification manufacture of semiconductor of claim 2 waste gas close the oxygen heating plant, it is characterized in that this waste gas duct comprises the outer catheter of being located on this stroma, and one is located on this mother's seat and extends to the inner catheter that forms this Waste gas outlet in this treatment trough.
- As the said purification manufacture of semiconductor of claim 2 waste gas close the oxygen heating plant, it is characterized in that this heat pipe is to be located on this stroma, and pass this mother's seat and implant that formation should pipe portion in this treatment trough.
- As the said purification manufacture of semiconductor of claim 2 waste gas close the oxygen heating plant, it is characterized in that also comprise the air conduit of being located on this stroma, it has an air discharge ports and is connected with treatment trough.
- 6. close the oxygen heating plant like the said purification manufacture of semiconductor of claim 5 waste gas; It is characterized in that; This mother's seat bottom has a fence, and this fence bottom has some passages, and in fence, forms an air chamber; This air chamber is connected with air discharge ports, and air chamber is connected with treatment trough via passage.
- 7. what purify manufacture of semiconductor waste gas according to claim 1 closes the oxygen heating plant, it is characterized in that the quantity that is provided with of this waste gas duct and heat pipe is even number, and is to adopt interval mode and correspondence is arranged on this headstock.
- 8. what purify manufacture of semiconductor waste gas according to claim 1 closes the oxygen heating plant, it is characterized in that, the pore diameter in this waste gas duct is all identical.
- 9. what purify manufacture of semiconductor waste gas according to claim 1 closes the oxygen heating plant, it is characterized in that, this heat pipe is loaded with the electrothermal tube of heating wire in being.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100218744U TWM423583U (en) | 2011-10-06 | 2011-10-06 | Oxygenation and heat supply apparatus for purifying waste gas from semiconductor process |
| TW100218744 | 2011-10-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202382256U true CN202382256U (en) | 2012-08-15 |
Family
ID=46460801
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011204321785U Expired - Fee Related CN202382256U (en) | 2011-10-06 | 2011-11-03 | Oxygen synthesizing and heating device for purifying waste gas in semiconductor manufacturing process |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN202382256U (en) |
| TW (1) | TWM423583U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107626173A (en) * | 2016-07-18 | 2018-01-26 | 东服企业股份有限公司 | Method and device for capturing product after sintering reaction of waste gas in semiconductor manufacturing process |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101285937B1 (en) * | 2011-11-09 | 2013-07-12 | 엠에이티플러스 주식회사 | Flameless Catalyst Thermal Oxydizer |
-
2011
- 2011-10-06 TW TW100218744U patent/TWM423583U/en not_active IP Right Cessation
- 2011-11-03 CN CN2011204321785U patent/CN202382256U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107626173A (en) * | 2016-07-18 | 2018-01-26 | 东服企业股份有限公司 | Method and device for capturing product after sintering reaction of waste gas in semiconductor manufacturing process |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM423583U (en) | 2012-03-01 |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120815 Termination date: 20201103 |
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| CF01 | Termination of patent right due to non-payment of annual fee |