CN202363277U - Ceramic capacitor frame - Google Patents
Ceramic capacitor frame Download PDFInfo
- Publication number
- CN202363277U CN202363277U CN 201120455542 CN201120455542U CN202363277U CN 202363277 U CN202363277 U CN 202363277U CN 201120455542 CN201120455542 CN 201120455542 CN 201120455542 U CN201120455542 U CN 201120455542U CN 202363277 U CN202363277 U CN 202363277U
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- Prior art keywords
- welding
- pins
- ceramic capacitor
- frame
- pin
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Abstract
The utility model relates to the field of ceramic capacitors, in particular to a ceramic capacitor frame, which comprises a plurality of frame units. Each frame unit comprises two welding plates which are arranged in opposite and used for welding capacitor chips, a pin is respectively led out from the two welding plates, and a first connection rib is connected between the root portions of the two pins. A second connection rib is respectively arranged between the root portions of welding plates of two adjacent frame units. Compared with the prior art, due to the fact that the first connection ribs are arranged between the root portions of the pins in the same frame unit, the second connection ribs are arranged between the root portions of the welding plates in adjacent frame units, and the first connection ribs and the second connection ribs separate areas of the welding plates and areas of the pins. When mould pressing is conducted after the capacitor chips are assembled between the welding plates for welding, mould pressing overlapping can be avoided, and effect of mould pressing overlapping on welding of the pins can be avoided.
Description
Technical field
The utility model relates to the ceramic capacitor field, is meant the ceramic capacitor framework especially.
Background technology
Ceramic capacitor is widely used at military project, civil area; Its manufacture process is to adopt a lead frame; Be provided with pin and welding rib in the lead frame, with chips welding on the welding rib, then with Chip Packaging, make ceramic capacitor after cutting muscle and removing the lead frame waste material.Ceramic capacitor of the prior art causes mold pressing overlap when epoxy resin mould press seal cartridge chip owing to leave certain clearance between pin and the welding rib, influences the pin solderability, and has increased the operation of reprocessing, wasting manpower and material resources.
The utility model content
The main purpose of the utility model is to overcome the shortcoming of prior art, and the ceramic capacitor of avoiding mold pressing overlap framework is provided.
The utility model adopts following technical scheme:
The ceramic capacitor framework includes some frame units, and each frame unit includes and is used to weld the welded plate that two of capacitor chip is oppositely arranged, and respectively draws a pin on this two welded plate, is provided with first between this two pins root and connects muscle; Be provided with second between the root of the welded plate of two adjacent frame units and connect muscle.
Two welded plates of each frame unit laterally arrange, and the two pins of each frame unit laterally arranges.
The pin of all frame units all is fixedly connected on a plate.
Can know by above-mentioned description the utility model; Compared with prior art; The ceramic capacitor framework of the utility model connects muscle owing between the pin root of same frame unit, be provided with first; Be provided with second between the root of the welded plate of adjacent frame unit and connect muscle, first connects muscle and second connects muscle and separates welded plate region and pin region, capacitor chip is being packed into when carrying out mold pressing after welding between the welded plate; Avoided the situation of mold pressing overlap to take place, avoided influencing the solderability of pin because of the mold pressing overlap.
Description of drawings
Fig. 1 is the structural representation of the utility model embodiment.
Embodiment
Below the utility model is done further to describe through embodiment.
With reference to Fig. 1; The ceramic capacitor framework of the utility model; Include some frame units 100; Each frame unit 100 includes to be used to weld on welded plate 11,12, two welded plates 11,12 that two of capacitor chip is oppositely arranged respectively draws a pin 21,22, is provided with first between two pins 21,22 roots and connects muscle 31; Be provided with second between the root of the welded plate of two adjacent frame units 100 and connect muscle 32.Two welded plates 11,12 of each frame unit laterally arrange, and the two pins 21,22 of each frame unit laterally arranges.The pin of all frame units 100 all is fixedly connected on a plate 40.
With reference to Fig. 1, the ceramic capacitor framework of the utility model in use, at first with capacitor chip be folded in two be oppositely arranged welded plate 11, between 12; And with capacitor chip be welded on welded plate 11, between 12; Carry out the epoxy resin mold pressing then, separate welded plate region and pin region because first company's muscle 31 and second connects muscle 32, during mold pressing; Avoided the situation of mold pressing overlap to take place, avoided influencing the solderability of pin because of the mold pressing overlap.
An above-mentioned embodiment that is merely the utility model, but the design concept of the utility model is not limited thereto allly utilizes this design that the utility model is carried out the change of unsubstantiality, all should belong to the behavior of invading the utility model protection range.
Claims (3)
1. ceramic capacitor framework; Include some frame units; It is characterized in that: each frame unit includes and is used to weld the welded plate that two of capacitor chip is oppositely arranged, and respectively draws a pin on this two welded plate, is provided with first between this two pins root and connects muscle; Be provided with second between the root of the welded plate of two adjacent frame units and connect muscle.
2. ceramic capacitor framework as claimed in claim 1 is characterized in that: two welded plates of each frame unit laterally arrange, and the two pins of each frame unit laterally arranges.
3. ceramic capacitor framework as claimed in claim 1 is characterized in that: the pin of all frame units all is fixedly connected on a plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120455542 CN202363277U (en) | 2011-11-17 | 2011-11-17 | Ceramic capacitor frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120455542 CN202363277U (en) | 2011-11-17 | 2011-11-17 | Ceramic capacitor frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202363277U true CN202363277U (en) | 2012-08-01 |
Family
ID=46574443
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201120455542 Expired - Lifetime CN202363277U (en) | 2011-11-17 | 2011-11-17 | Ceramic capacitor frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202363277U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111403175A (en) * | 2020-03-11 | 2020-07-10 | 福建火炬电子科技股份有限公司 | Detachable pulse power capacitor and assembly method |
-
2011
- 2011-11-17 CN CN 201120455542 patent/CN202363277U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111403175A (en) * | 2020-03-11 | 2020-07-10 | 福建火炬电子科技股份有限公司 | Detachable pulse power capacitor and assembly method |
| CN111403175B (en) * | 2020-03-11 | 2023-10-20 | 福建火炬电子科技股份有限公司 | Detachable pulse power capacitor and assembly method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120801 |