CN202362110U - Air inlet temperature pressure transducer - Google Patents
Air inlet temperature pressure transducer Download PDFInfo
- Publication number
- CN202362110U CN202362110U CN2011204598181U CN201120459818U CN202362110U CN 202362110 U CN202362110 U CN 202362110U CN 2011204598181 U CN2011204598181 U CN 2011204598181U CN 201120459818 U CN201120459818 U CN 201120459818U CN 202362110 U CN202362110 U CN 202362110U
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- CN
- China
- Prior art keywords
- pcb board
- assembly
- board assembly
- plastic casing
- cofferdam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
Disclosed is an air inlet temperature pressure transducer, comprising a plastic housing assembly, a PCB assembly arranged in the core space of the plastic housing assembly, and an upper cover that covers the PCB assembly and is used for packaging the PCB assembly, wherein the lower portion of the PCB assembly is fixedly provided with a cofferdam; the lower portion of the PCB assembly inside the cofferdam is fixedly provided with a pressure chip; a thermistor is installed upon the PCB assembly; the plastic housing assembly is formed by a mold insert and a pin via injection molding through a plastic die; the core space of the plastic housing assembly is provided with a platform, where the PCB assembly is installed; the joint of the plastic housing assembly and the cofferdam as well as the joint of the plastic housing assembly and the upper cover are respectively provided with an embedding groove; and the embedding grooves are respectively filled with casting glue. As the embedding grooves are respectively filled with the epoxy casting glue, the sealing performance is improved and the measuring precision of the pressure chip is raised.
Description
Technical field
The utility model relates to a kind of automobile and uses sensor, particularly relates to the temperature and pressure sensor of a kind of motor car engine with admission line.
Background technology
At present, the intake air temperature pressure transducer owing to for electronic control unit (ECU) intake air temperature and pressure signal are provided, comes the distributive value of calculation engine again according to the signal of other sensor in vehicle.So the measurement result of intake air temperature pressure transducer will directly influence the operating mode of engine.Intake air temperature pressure transducer on the motor car engine generally adopts metal shell to encapsulate, and its weak point is that metal shell cost height, work flow length, outward appearance cracky, manufacturability are poor.
For addressing the above problem; Someone has proposed a kind of terminal shell intake air temperature pressure transducer that adopts plastics matter, but also there is weak point in this sensor, and it is thick and heavy mainly to show as the terminal shell; That reduces the terminal shell fills the mould flowability; And material used when making is more, and complex structure, Shooting Technique property are poor, and the air pressure of terminal shell and mating surface generation can reduce the installation property and the security of intake air temperature sensor during installation.
Summary of the invention
The utility model provides a kind of simple in structure, good corrosion resistance, cost is low, thermistor vibration resistance ability is strong, the simple intake air temperature pressure transducer of production technology.
A kind of intake air temperature pressure transducer; Comprise the plastic casing assembly, the pcb board assembly in the inner chamber of this plastic casing assembly is set and covers the loam cake that on the pcb board assembly, the pcb board assembly is encapsulated; Below said pcb board assembly, be installed with a cofferdam, below being positioned at the pcb board assembly in said cofferdam, be fixed with pressure chip, on said pcb board assembly, thermistor is installed; Form the spy mouth in the bottom of said plastic casing assembly; Be formed with O type circle in the hull outside of visiting mouthful top groove is installed, in this O type circle is installed groove, O type circle is installed, said plastic casing assembly passes through the mould of plastics injection mo(u)lding by mold insert, contact pin; In the inner chamber of said plastic casing assembly, be provided with a platform; Said pcb board assembly is installed in this platform, is respectively arranged with the embedding groove in the junction in said plastic casing assembly and cofferdam and the junction of plastic casing assembly and loam cake, in described embedding groove, is perfused with epoxy pouring sealant respectively.
Said thermistor is a NTC type band line thermistor, and its metal lead wire is weldingly fixed on the pcb board assembly after passing the pcb board bending.
Said pressure chip is weldingly fixed on the pcb board assembly.In addition, in said cofferdam and the formed space of pcb board assembly, be marked with quantitative protection glue.
The intake air temperature pressure transducer of the utility model; Owing to be respectively arranged with the embedding groove in the junction in plastic casing assembly and cofferdam and the junction of plastic casing assembly and loam cake; In the embedding groove, be perfused with epoxy pouring sealant respectively; Thereby improved sealing property, thereby improved the measuring accuracy of pressure chip.
Description of drawings
Fig. 1 is the structural representation of the intake air temperature pressure transducer of the utility model;
Fig. 2 is the assembling synoptic diagram of pcb board assembly in the intake air temperature pressure transducer of Fig. 1;
Fig. 3 is the total front view of plastic casing;
Fig. 4 is the part sectioned view of mold insert structure in the displayed map 3.
Embodiment
As shown in Figure 1, the intake air temperature pressure transducer of the utility model comprises: plastic casing assembly 1, loam cake 2, pcb board assembly 4, cofferdam 6, pressure chip 7, O type circle 8 and thermistor 10.
Like Fig. 1, Fig. 3 and shown in Figure 4; Plastic casing assembly 1 passes through the mould of plastics injection mo(u)lding by mold insert 15, contact pin 14; Inner chamber at plastic casing assembly (hereinafter to be referred as shell) 1 is provided with mounting platform 11, and the pcb board assembly is arranged on this platform 11, is provided with the 1st embedding groove 3 in the junction of shell and loam cake 2; Be provided with the 2nd embedding groove 3 in the junction in shell and cofferdam 6; Form in the bottom of shell 1 in addition and visit mouth 12, be formed with O type circle in the hull outside of visiting mouthful 12 tops groove 13 is installed, O type circle 8 is installed in this O type circle and installs in the groove 13.
Thermistor 10 is a kind of NTC thermistors, and its two lead-in wires pass to weld after the pcb board bending and are fixed on the pcb board assembly 4.Pressure chip 7 is welded on the pcb board assembly 4.After pcb board assembly 4, pressure chip 7, thermistor 10, cofferdam 6 install, the quantitative protection glue of perfusion in the space that surrounds with pcb board assembly 4 in cofferdam 6.Described assembling encapsulation all is arranged in the plastic casing assembly, with loam cake 2 encapsulation, uses the epoxy pouring sealant embedding at embedding groove 5 places then above the pcb board assembly.
Referring to Fig. 2 the installation process of the intake air temperature pressure transducer of the utility model is described.
As shown in the figure; Earlier thermistor 10 is passed bending behind the pcb board assembly; Then thermistor 10 is weldingly fixed on the pcb board assembly; On pcb board, weld and fix pressure chip 7, cofferdam 6 is bonded on the pcb board 4, annotate an amount of protection glue 11 in the space that surrounds with pcb board to cofferdam 6 at last and also solidify with glue.In embedding groove 3, inject an amount of bonding glue then, again the pcb board assembly is fixed in the said plastic casing assembly, to the perfusion of pcb board upper surface an amount of protection glue and curing; After the protection adhesive curing, install loam cake and seal with epoxy pouring sealant.
Claims (4)
1. intake air temperature pressure transducer; Comprise the plastic casing assembly, the pcb board assembly in the inner chamber of this plastic casing assembly is set and covers the loam cake that on the pcb board assembly, the pcb board assembly is encapsulated; Below said pcb board assembly, be installed with a cofferdam, below being positioned at the pcb board assembly in said cofferdam, be fixed with pressure chip, on said pcb board assembly, thermistor is installed; Form the spy mouth in the bottom of said plastic casing assembly; Be formed with O type circle in the hull outside of visiting mouthful top groove is installed, in this O type circle is installed groove, O type circle is installed, it is characterized in that: said plastic casing assembly passes through the mould of plastics injection mo(u)lding by mold insert, contact pin; In the inner chamber of said plastic casing assembly, be provided with a platform; Said pcb board assembly is installed in this platform, is respectively arranged with the embedding groove in the junction in said plastic casing assembly and cofferdam and the junction of plastic casing assembly and loam cake, in described embedding groove, is perfused with epoxy pouring sealant respectively.
2. intake air temperature pressure transducer as claimed in claim 1 is characterized in that: said thermistor is a NTC type band line thermistor, and its metal lead wire is weldingly fixed on the pcb board assembly after passing the pcb board bending.
3. intake air temperature pressure transducer as claimed in claim 1 is characterized in that: said pressure chip is weldingly fixed on the pcb board assembly.
4. intake air temperature pressure transducer as claimed in claim 1 is characterized in that: in said cofferdam and the formed space of pcb board assembly, be marked with protection glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204598181U CN202362110U (en) | 2011-11-18 | 2011-11-18 | Air inlet temperature pressure transducer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204598181U CN202362110U (en) | 2011-11-18 | 2011-11-18 | Air inlet temperature pressure transducer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202362110U true CN202362110U (en) | 2012-08-01 |
Family
ID=46573289
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011204598181U Expired - Fee Related CN202362110U (en) | 2011-11-18 | 2011-11-18 | Air inlet temperature pressure transducer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202362110U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105181229A (en) * | 2015-09-24 | 2015-12-23 | 浙江比华丽电子科技有限公司 | Novel pressure transducer for solar water heater |
| CN105628092A (en) * | 2015-12-18 | 2016-06-01 | 安徽华东光电技术研究所 | Temperature and pressure sensor module and preparation method thereof |
| CN106595758A (en) * | 2016-12-02 | 2017-04-26 | 天水华天传感器有限公司 | Temperature and pressure integrated transmitter and manufacture method thereof |
| KR101766144B1 (en) * | 2016-05-31 | 2017-08-08 | 현대자동차주식회사 | A pressure sensor having a temperature sensor |
| CN107449518A (en) * | 2017-08-30 | 2017-12-08 | 东风汽车电子有限公司 | A kind of commercial car environment temperature sensor |
| CN107478197A (en) * | 2017-08-07 | 2017-12-15 | 中铁二院工程集团有限责任公司 | High-precision integral type hydrostatic level |
-
2011
- 2011-11-18 CN CN2011204598181U patent/CN202362110U/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105181229A (en) * | 2015-09-24 | 2015-12-23 | 浙江比华丽电子科技有限公司 | Novel pressure transducer for solar water heater |
| CN105628092A (en) * | 2015-12-18 | 2016-06-01 | 安徽华东光电技术研究所 | Temperature and pressure sensor module and preparation method thereof |
| CN105628092B (en) * | 2015-12-18 | 2018-05-15 | 安徽华东光电技术研究所 | Temperature and pressure sensor module and preparation method thereof |
| KR101766144B1 (en) * | 2016-05-31 | 2017-08-08 | 현대자동차주식회사 | A pressure sensor having a temperature sensor |
| US10184855B2 (en) | 2016-05-31 | 2019-01-22 | Hyundai Motor Company | Pressure sensing device having temperature sensor |
| CN106595758A (en) * | 2016-12-02 | 2017-04-26 | 天水华天传感器有限公司 | Temperature and pressure integrated transmitter and manufacture method thereof |
| CN106595758B (en) * | 2016-12-02 | 2019-09-20 | 天水华天传感器有限公司 | A kind of temperature, pressure one transmitter and preparation method thereof |
| CN107478197A (en) * | 2017-08-07 | 2017-12-15 | 中铁二院工程集团有限责任公司 | High-precision integral type hydrostatic level |
| CN107449518A (en) * | 2017-08-30 | 2017-12-08 | 东风汽车电子有限公司 | A kind of commercial car environment temperature sensor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120801 Termination date: 20141118 |
|
| EXPY | Termination of patent right or utility model |