CN202332977U - Glass base plate encapsulation equipment - Google Patents
Glass base plate encapsulation equipment Download PDFInfo
- Publication number
- CN202332977U CN202332977U CN 201120425509 CN201120425509U CN202332977U CN 202332977 U CN202332977 U CN 202332977U CN 201120425509 CN201120425509 CN 201120425509 CN 201120425509 U CN201120425509 U CN 201120425509U CN 202332977 U CN202332977 U CN 202332977U
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- Prior art keywords
- laser
- workbench
- base plate
- generating device
- bit platform
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 238000005538 encapsulation Methods 0.000 title claims abstract description 53
- 239000011521 glass Substances 0.000 title claims abstract description 39
- 239000000758 substrate Substances 0.000 claims description 102
- 229910002114 biscuit porcelain Inorganic materials 0.000 claims description 31
- 239000003292 glue Substances 0.000 claims description 9
- 238000004806 packaging method and process Methods 0.000 claims description 5
- 239000004579 marble Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 239000007888 film coating Substances 0.000 abstract 3
- 238000009501 film coating Methods 0.000 abstract 3
- 239000000843 powder Substances 0.000 abstract 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 8
- 239000001301 oxygen Substances 0.000 description 8
- 229910052760 oxygen Inorganic materials 0.000 description 8
- 239000000203 mixture Substances 0.000 description 7
- 239000010410 layer Substances 0.000 description 6
- 230000006378 damage Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000011261 inert gas Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- -1 steam Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000002346 layers by function Substances 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
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- Joining Of Glass To Other Materials (AREA)
Abstract
The utility model discloses glass base plate encapsulation equipment. A base plate back cover is encapsulated on a film coating base plate, an inner encapsulation powder layer is coated at the outer frame edge part of a display module of the base plate back cover, the base plate back cover is covered on the film coating base plate for forming a base plate to be encapsulated, and the glass base plate encapsulation equipment comprises a work platform, a laser generator and an aligning platform, wherein a cross beam is arranged above the work platform, a support element is connected between the cross beam and the work platform, the aligning platform is glidingly arranged on the work platform, the laser generator is glidingly arranged on the cross beam so that a laser head of the laser generator is right against the aligning platform, an aligning lens is arranged in a position of the cross beam near the laser generator, the aligning lens is opposite to the aligning platform, the aligning platform positions the base plate to be encapsulated through the aligning lens, the laser head scans the inner encapsulation powder layer arranged on the positioned base plate to be encapsulated, and further, the encapsulation base plate in an integral structure is formed, so the base plate back cover can be encapsulated on the film coating base plate in atmosphere, and the production cost is reduced.
Description
Technical field
The utility model relates to the encapsulation field of the substrate in a kind of Organic Light Emitting Diode, relates in particular to a kind of substrate bonnet in the Organic Light Emitting Diode to be encapsulated in the glass substrate sealed in unit on the coated basal plate.
Background technology
Along with improving constantly and natural resources in short supply day by day of constant development of economy, science and technology, impel enterprise to strengthen the investment R&D intensity, and OLED is exactly a kind of in many energy-conserving products so that can develop the energy-conserving product that makes new advances.
(English full name is Organic Light-Emitting Diode to OLED; The Chinese full name is an Organic Light Emitting Diode) because characteristics such as frivolous, power savings; Therefore on the display screen of digital product, obtained extensive use, and had bigger market potential, all focused on the flat-panel monitor to the application of OLED in the world at present; Because OLED be unique on using can and the TFT-LCD technology of mentioning in the same breath; OLED is that unique Display Technique of making large scale, high brightness, the soft screen of high-resolution can be made the thickness the same with paper in present all Display Techniques.And make in the flow process at OLED, can relate to numerous technologies such as plated film, encapsulation, transmission and cleaning of glass substrate.Wherein, In order to prevent that composition such as steam, oxygen in the atmosphere is to each organic function layer on the coated glass substrate and the destruction of electrode; So need on coated basal plate, to post drier; And drier is fixed on the coated basal plate through ultraviolet ray, simultaneously, also posting the substrate bonnet that is covered with a printing opacity on the coated basal plate of drier; And substrate bonnet and coated basal plate are glued through epoxy resin, seal each organic function layer, electrode and drier on the coated basal plate to accomplish the encapsulation purpose of substrate bonnet coated basal plate.
Yet; At the substrate bonnet coated basal plate is carried out in the encapsulation process, need on coated basal plate, post drier, and drier is fixed on the coated basal plate by ultraviolet ray; Also need make the substrate bonnet stick on the coated basal plate that posts drier by epoxy resin; And need prevent that in the space of atmospheric sealing between substrate bonnet and coated basal plate therefore, it is to carry out at the glove box that is filled with inert gas (like nitrogen or argon gas etc.) that existing substrate bonnet encapsulates coated basal plate; Thereby increased the difficulty of substrate bonnet, correspondingly increased manufacturing cost the coated basal plate encapsulation.
Therefore, be badly in need of wanting a kind of substrate bonnet that reduces to the glass substrate sealed in unit of coated basal plate encapsulation difficulty to reduce cost.
The utility model content
The purpose of the utility model is to provide a kind of substrate bonnet that reduces to the glass substrate sealed in unit of coated basal plate encapsulation difficulty to reduce cost.
For realizing above-mentioned purpose; The utility model provides a kind of glass substrate sealed in unit; Be adapted to the substrate bonnet in the Organic Light Emitting Diode is encapsulated on the coated basal plate, encapsulation bisque in the housing edge of the demonstration module of this substrate bonnet scribbles, the substrate bonnet of encapsulation bisque carries out the periphery encapsulation and forms substrate to be packaged through outer package glue and coated basal plate in scribbling; Wherein, the glass substrate sealed in unit of the utility model comprises that workbench, generating device of laser reach bit platform.The top along continuous straight runs of said workbench is provided with and the isolated crossbeam of said workbench; Be connected with a strutting piece between said crossbeam and the said workbench; Said bit platform is slidably is arranged on the said workbench; Said generating device of laser be make said generating device of laser on the said crossbeam of being installed in of slip laser head over against said to bit platform; The position of the said generating device of laser of vicinity of said crossbeam is provided with the contraposition camera lens; Said contraposition camera lens is with said corresponding to bit platform, said bit platform positioned the substrate to be packaged on the bit platform being carried on this through said contraposition camera lens, and the interior encapsulation bisque on the substrate to be packaged of the laser head of said generating device of laser after to the location scans encapsulation and then is integrally formed the base plate for packaging of structure.
Preferably, said contraposition camera lens is paired setting, and said generating device of laser makes contraposition more convenient between said contraposition camera lens, and is quicker.
Preferably; Said glass substrate sealed in unit also comprises driver; Said driver orders about said generating device of laser and on said crossbeam, moves; Make generating device of laser to scan the interior encapsulation bisque on the substrate bonnet automatically, raise the efficiency on the one hand, improve the quality of scanning on the other hand.Particularly; Said glass substrate sealed in unit also comprises moving guide rail; Said moving guide rail is provided with respectively between said generating device of laser and the said crossbeam; And between said crossbeam and the said strutting piece, said moving guide rail makes said generating device of laser on said crossbeam, do moving of X axle, Y axle and Z axle, so that generating device of laser can scan the interior encapsulation bisque on the substrate bonnet more accurately.
Preferably; Said bit platform is provided with X shaft-type governor and Y shaft-type governor; Said X shaft-type governor orders about that said the X axle moves adjusting in said workbench upper edge to bit platform; Said Y shaft-type governor orders about said to bit platform moving adjusting of y-axis shift in said workbench upper edge, is convenient to operating personnel to being carried on the accurate contraposition of the substrate to be packaged on the bit platform in X axle and Y direction.Particularly; Said bit platform also is provided with angle demodulator; Said angle demodulator order about said to bit platform around the Z of said workbench axle rotation, be convenient to operating personnel to being carried on to the accurate location of the substrate to be packaged on the bit platform around the Z of the workbench axle anglec of rotation.
Preferably; Said crossbeam is parallel setting with said workbench, and said workbench is marble, and this marble can improve the resistance to shock of workbench; And be out of shape little; So improved the package quality of the glass substrate sealed in unit of the utility model, this crossbeam is parallel with workbench, make generating device of laser can on crossbeam, do more reliably, move more accurately.
Preferably; Each of said substrate bonnet shows that the housing edge of module all scribbles said interior encapsulation bisque; Should in encapsulation bisque can prevent more reliably that compositions such as steam, oxygen in the atmosphere from proceeding to through the outer package glue between substrate bonnet and the coated basal plate and show the module place; And then damage the demonstration module, therefore, interior encapsulation bisque makes each demonstration module to work more reliably.Particularly, said in the encapsulation bisque be glass frit layer, this glass frit layer more can stop the entering of compositions such as steam in the atmosphere, oxygen, thereby can protect the demonstration module further.
Compared with prior art; Because encapsulation bisque in the housing edge of the demonstration module of substrate bonnet scribbles; The substrate bonnet of encapsulation bisque carries out the periphery encapsulation and forms substrate to be packaged through outer package glue and coated basal plate in scribbling; Go to damage each functional layer on the coated basal plate in the space that this substrate to be packaged can stop compositions such as the steam in the atmosphere, oxygen entering substrate bonnet and coated basal plate to surround; For substrate to be packaged can encapsulate the good condition of creating under atmosphere, simultaneously, bit platform is slidably is arranged on the workbench; Generating device of laser is being installed in of slip make generating device of laser on the crossbeam laser head over against to bit platform; The position of the contiguous generating device of laser of crossbeam is provided with the contraposition camera lens, and the contraposition camera lens makes bit platform is positioned the substrate to be packaged on the bit platform being carried on this through the contraposition camera lens with corresponding to bit platform; And the laser head of generating device of laser scans encapsulation to the interior encapsulation bisque on the substrate to be packaged after locating; Encapsulate the bisque fusing in making and stick on coated basal plate and the substrate bonnet of sealing, and then be integrally formed the base plate for packaging of structure, thereby realize that the substrate bonnet is in the purpose that is packaged under the atmosphere on the coated basal plate.Therefore; The utility model glass substrate sealed in unit can reduce the encapsulation difficulty of coated basal plate; Reduced production cost accordingly; Overcome " must carry out being full of under the environment of inert gas when existing substrate bonnet is encapsulated on the coated basal plate, and under this environment because of a glue, paste operations such as drying sheet and UV immobilization could accomplish encapsulate the cost that brings too high " problem.
Description of drawings
Fig. 1 is the structural representation of the utility model glass substrate sealed in unit.
Fig. 2 is the structural representation of another angle of glass substrate sealed in unit shown in Figure 1.
Fig. 3 is the generating device of laser of the utility model glass substrate sealed in unit and the structural representation that substrate to be packaged is assembled together.
Fig. 4 is the enlarged drawing of A part among Fig. 3.
Fig. 5 is the structural representation to bit platform of the utility model glass substrate sealed in unit.
Embodiment
Technology contents, structural feature in order to specify the utility model are described further below in conjunction with execution mode and conjunction with figs..
See also Fig. 1 to Fig. 4; The glass substrate sealed in unit of the utility model is used for the substrate bonnet 210 of Organic Light Emitting Diode is encapsulated in coated basal plate 220; This substrate bonnet 210 has light transmission; And encapsulation bisque 240 in the housing edge of the demonstration module 230 of substrate bonnet 210 scribbles, the substrate bonnet 210 of encapsulation bisque 240 carries out the periphery encapsulation and forms substrate 200a to be packaged through outer package glue 250 (like epoxy resin) and coated basal plate 220 in scribbling, and makes substrate bonnet 210 and coated basal plate 220 form the seal cavity of a periphery earlier; When making substrate 200a to be packaged in atmosphere; Can stop the materials such as steam and oxygen in the atmosphere to get in the substrate 200a to be packaged, wherein, the glass substrate sealed in unit of the utility model comprises workbench 10, generating device of laser 20 and to bit platform 30.The top along continuous straight runs of said workbench 10 is provided with and said workbench 10 isolated crossbeams 11; This crossbeam 11 is parallel setting with workbench 10 so that generating device of laser 20 can be done more reliably on crossbeam 11, move more accurately; And be connected with a strutting piece 12 between crossbeam 11 and the said workbench 10; Said bit platform 30 is slidably is arranged on the said workbench 10; Said generating device of laser 20 be make said generating device of laser 20 on the said crossbeam 11 of being installed in of slip laser head 21 over against said to bit platform 30; The position of the said generating device of laser 20 of the vicinity of said crossbeam 11 is provided with contraposition camera lens 40; Said contraposition camera lens 40 is with said corresponding to bit platform 30; Saidly bit platform 30 is carried on this through 40 pairs on said contraposition camera lens the substrate 200a to be packaged on the bit platform 30 is positioned, the interior encapsulation bisque 240 on the substrate 200a to be packaged behind 21 pairs of location of the laser head of said generating device of laser 20 scans encapsulation and then is integrally formed the base plate for packaging of structure.Wherein, quicker for making the contraposition of contraposition camera lens 40 more convenient, so contraposition camera lens 40 is paired setting, generating device of laser 20 is between contraposition camera lens 40; In order to improve the resistance to shock of workbench 10, and make that the distortion of workbench 10 is little, so workbench 10 is chosen as marble; For with the circuit pattern photoetching on coated basal plate 220, so between generating device of laser 20 and substrate bonnet 210, be provided with mask plate 260.Particularly, as follows:
Than the superior; The glass substrate sealed in unit of the utility model also comprises the driver (not shown); This driver orders about said generating device of laser 20 and on said crossbeam 11, moves; Make generating device of laser 20 to scan the interior encapsulation bisque 240 on the substrate bonnet 210 automatically, raise the efficiency on the one hand, improve the quality of scanning on the other hand.Simultaneously; The glass substrate sealed in unit of the utility model also comprises moving guide rail 50; This moving guide rail 50 is provided with respectively between generating device of laser 20 and the crossbeam 11; And between crossbeam 11 and the strutting piece 12; Moving guide rail 50 makes generating device of laser 20 on crossbeam 11, do moving of X axle (promptly being the direction of horizontal arrow indication among Fig. 2), Y axle (promptly being the direction of vertical arrow indication among Fig. 2) and Z axle, so that generating device of laser 20 can scan the interior encapsulation bisque 240 on the substrate bonnet 210 more accurately.Wherein, above-mentioned driver is to the drive principle of generating device of laser 20, and driver is to the annexation of generating device of laser 20, be well known to those of ordinary skill in the art, so repeat no more at this.
Simultaneously; Each of above-mentioned substrate bonnet 210 shows that the housing edge of module 230 all scribbles said interior encapsulation bisque 240; Should in encapsulation bisque 240 can prevent more reliably that compositions such as steam, oxygen in the atmosphere from proceeding to through the outer package glue 250 between substrate bonnet 210 and the coated basal plate 220 and show module 230 places; And then damage demonstration module 230, therefore, interior encapsulation bisque 240 makes each demonstration module 230 to work more reliably.Particularly, said in encapsulation bisque 240 be glass frit layer, this glass frit layer more can stop the entering of compositions such as steam in the atmosphere, oxygen, thereby can protect demonstration module 230 further.
Please combine Fig. 5; Bit platform 30 is provided with X shaft-type governor 31 and Y shaft-type governor 32; Said X shaft-type governor 31 orders about said bit platform 30 is moved at said workbench 10 upper edge X axles (promptly being the direction of horizontal arrow indication among Fig. 5) through the first conflict platform 13 on the conflict workbench 10 and regulates; Said Y shaft-type governor 32 orders about through the second conflict platform 14 on the conflict workbench 10 and said bit platform 30 is moved and regulates at said workbench 10 upper edge Y axles (promptly be among Fig. 5 vertically the direction of arrow indication), makes operating personnel to being carried on the accurate contraposition in X axle and Y direction to the substrate 200a to be packaged on the bit platform 30 like this.Wherein, For ease of operating personnel to being carried on the accurate location around the Z of workbench 10 axle (promptly being among Fig. 5) anglec of rotation to the direction of the arrow indication in the bit platform 30 to the substrate 200a to be packaged on the bit platform 30; So above-mentioned also is provided with angle demodulator 33 to bit platform 30, this angle demodulator 33 orders about bit platform 30 is rotated around the Z of workbench 10 axle.Noticeable, the structure of above-mentioned X shaft-type governor 31, Y shaft-type governor 32 and angle demodulator 33, and their operation principle be well known to those of ordinary skill in the art, so repeat no more at this.
Because encapsulation bisque 240 in the housing edge of the demonstration module 230 of substrate bonnet 210 scribbles; The substrate bonnet 210 of encapsulation bisque 240 carries out the periphery encapsulation and forms substrate 200a to be packaged through outer package glue 250 and coated basal plate 220 in scribbling; Go to damage each functional layer on the coated basal plate 220 in the space that this substrate 200a to be packaged has stoped compositions such as the steam in the atmosphere, oxygen entering substrate bonnet 210 and coated basal plate 220 to surround; For substrate 200a to be packaged can encapsulate the good condition of creating under atmosphere; Simultaneously; Bit platform 30 is slidably is arranged on the workbench 10; Generating device of laser 20 is being installed in of slip make generating device of laser 20 on the crossbeam 11 laser head 21 over against to bit platform 30; The position of the contiguous generating device of laser 20 of crossbeam 11 is provided with contraposition camera lens 40, and contraposition camera lens 40 makes that with corresponding to bit platform 30 bit platform 30 is carried on this through 40 pairs on contraposition camera lens to be positioned the substrate 200a to be packaged on the bit platform 30; And the interior encapsulation bisque 240 on the substrate 200a to be packaged behind 21 pairs of location of the laser head of generating device of laser 20 scans encapsulation; Encapsulate bisque 240 fusings in making and sticking on coated basal plate 220 and the substrate bonnet 210 of sealing, and then be integrally formed the base plate for packaging of structure, thereby realize that substrate bonnet 210 is in the purpose that is packaged under the atmosphere on the coated basal plate 220.Therefore; The utility model glass substrate sealed in unit can reduce the encapsulation difficulty of coated basal plate; Reduced production cost accordingly; Overcome " must carry out being full of under the environment of inert gas when existing substrate bonnet is encapsulated on the coated basal plate, and under this environment because of a glue, paste operations such as drying sheet and UV immobilization could accomplish encapsulate the cost that brings too high " problem.
The above disclosed preferred embodiments that is merely the utility model can not limit the interest field of the utility model certainly with this, so according to the equivalent variations that the utility model claim is done, still belong to the scope that the utility model is contained.
Claims (9)
1. glass substrate sealed in unit; Be adapted to the substrate bonnet in the Organic Light Emitting Diode is encapsulated on the coated basal plate; It is characterized in that; Encapsulation bisque in the housing edge of the demonstration module of this substrate bonnet scribbles; The substrate bonnet of encapsulation bisque carries out the periphery encapsulation and forms substrate to be packaged through outer package glue and coated basal plate in scribbling; Said glass substrate sealed in unit comprises that workbench, generating device of laser reach bit platform, and the top along continuous straight runs of said workbench is provided with and the isolated crossbeam of said workbench, is connected with a strutting piece between said crossbeam and the said workbench; Said bit platform is slidably is arranged on the said workbench; Said generating device of laser be make said generating device of laser on the said crossbeam of being installed in of slip laser head over against said to bit platform, the position of the said generating device of laser of vicinity of said crossbeam is provided with the contraposition camera lens, said contraposition camera lens is with said corresponding to bit platform; Said bit platform is positioned the substrate to be packaged on the bit platform being carried on this through said contraposition camera lens, the interior encapsulation bisque on the substrate to be packaged of the laser head of said generating device of laser after to the location scans and then is integrally formed the base plate for packaging of structure.
2. glass substrate sealed in unit according to claim 1 is characterized in that, said contraposition camera lens is paired setting, and said generating device of laser is between said contraposition camera lens.
3. glass substrate sealed in unit according to claim 1 and 2 is characterized in that, also comprises driver, and said driver orders about said generating device of laser and on said crossbeam, moves.
4. glass substrate sealed in unit according to claim 3; It is characterized in that; Also comprise moving guide rail; Said moving guide rail is provided with respectively between said generating device of laser and the said crossbeam, and between said crossbeam and the said strutting piece, said moving guide rail makes said generating device of laser on said crossbeam, do moving of X axle, Y axle and Z axle.
5. glass substrate sealed in unit according to claim 1; It is characterized in that; Said bit platform is provided with X shaft-type governor and Y shaft-type governor; Said X shaft-type governor orders about that said the X axle moves adjusting in said workbench upper edge to bit platform, and said Y shaft-type governor orders about that said y-axis shift is moving in said workbench upper edge regulates to bit platform.
6. glass substrate sealed in unit according to claim 5 is characterized in that, said bit platform also is provided with angle demodulator, and said angle demodulator orders about and said bit platform rotated around the Z of said workbench axle.
7. glass substrate sealed in unit according to claim 1 is characterized in that, said crossbeam is parallel setting with said workbench, and said workbench is a marble.
8. glass substrate sealed in unit according to claim 1 is characterized in that, each of said substrate bonnet shows that the housing edge of module all scribbles said interior encapsulation bisque.
9. according to claim 1 or 8 described glass substrate sealed in units, it is characterized in that said interior encapsulation bisque is a glass frit layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120425509 CN202332977U (en) | 2011-10-31 | 2011-10-31 | Glass base plate encapsulation equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120425509 CN202332977U (en) | 2011-10-31 | 2011-10-31 | Glass base plate encapsulation equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202332977U true CN202332977U (en) | 2012-07-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201120425509 Expired - Fee Related CN202332977U (en) | 2011-10-31 | 2011-10-31 | Glass base plate encapsulation equipment |
Country Status (1)
| Country | Link |
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| CN (1) | CN202332977U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102403463A (en) * | 2011-10-31 | 2012-04-04 | 东莞宏威数码机械有限公司 | Base plate packaging device and base plate packaging method |
| CN104439726A (en) * | 2014-11-19 | 2015-03-25 | 苏州德龙激光股份有限公司 | Laser real-time deviation correction device and deviation correction method thereof |
| CN107799667A (en) * | 2016-08-30 | 2018-03-13 | 上海微电子装备（集团）股份有限公司 | Frit sealed in unit and its method for packing |
-
2011
- 2011-10-31 CN CN 201120425509 patent/CN202332977U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102403463A (en) * | 2011-10-31 | 2012-04-04 | 东莞宏威数码机械有限公司 | Base plate packaging device and base plate packaging method |
| CN104439726A (en) * | 2014-11-19 | 2015-03-25 | 苏州德龙激光股份有限公司 | Laser real-time deviation correction device and deviation correction method thereof |
| CN104439726B (en) * | 2014-11-19 | 2017-01-25 | 苏州德龙激光股份有限公司 | Laser real-time deviation correction device and deviation correction method thereof |
| CN107799667A (en) * | 2016-08-30 | 2018-03-13 | 上海微电子装备（集团）股份有限公司 | Frit sealed in unit and its method for packing |
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