CN202332804U - Assembly fixture of high-voltage diode - Google Patents
Assembly fixture of high-voltage diode Download PDFInfo
- Publication number
- CN202332804U CN202332804U CN2011204521052U CN201120452105U CN202332804U CN 202332804 U CN202332804 U CN 202332804U CN 2011204521052 U CN2011204521052 U CN 2011204521052U CN 201120452105 U CN201120452105 U CN 201120452105U CN 202332804 U CN202332804 U CN 202332804U
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- China
- Prior art keywords
- substrate
- cover plate
- chip
- gap
- voltage diode
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
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Abstract
The utility model relates to an assembly fixture of a high-voltage diode, particularly relates to a special assembly fixture of a high-voltage diode chip. the assembly fixture of the high-voltage diode, provided by the utility model, is capable of finishing chips in batch and is convenient to operate. The assembly fixture comprises a chip suction cup and a conversion plate, wherein the conversion plate comprises a substrate and a cover plate; the cover plate is fixedly connected onto the top surface of the substrate, which serves as the working surface; the area of the cover plate is less than that of the top surface of the substrate, so that an exposed working surface part is reserved on the top surface of the substrate; a clearance exists between the cover plate and the substrate; the opening of the clearance faces the exposed working surface part; and the height of the clearance is less than width and length of a chip. The assembly fixture disclosed by the utility model is good in operability, convenient for assembling and cleaning, small in volume, light in weight and easy for continuous production.
Description
Technical field
The utility model relates to a kind of special-purpose assembled fixture of high-voltage diode chip.
Background technology
Current, the high-voltage diode assembled fixture adopts general sucker design, and is anodal with the colour code chip; Artificial upset on the chip sucker makes chip polarity consistent, then will be on the chip sucker self-contained good chip; Left-hand thread makes plurality of chips go into groove to welding groove top regularly.Adjust during with 8 hours dutys, everyone class only can accomplish 20000 chip identification, and man efficiency is low.And because chip size less (1-5mm) makes labor intensity of operating personnel very big, the work mistake that causes because of sense of fatigue appears very easily.
The utility model content
The utility model provides a kind of and can put chip in order by mass to above problem, and easy to operate high-voltage diode assembled fixture.
The technical scheme of the utility model is: comprise the chip sucker; Also has change-over panel; Said change-over panel comprises substrate and cover plate; Said cover plate is fixedly connected on the end face of said substrate as working face, and said cover plate area makes the end face of said substrate leave the working face part that exposes less than said substrate top surface area; Leave the gap between said cover plate and the substrate, the opening in said gap is towards the said working face part that exposes; The height in said gap makes said chip can in said gap, not overturn less than the width and the length of said chip;
Said chip sucker has the shape of coincideing with the said working face part face profile that exposes; Said chip sucker is provided with surface of subsidence towards the surface of the said working face part that exposes; Offer the plurality of chips groove on the said surface of subsidence, the opening of said surface of subsidence is towards the opening in said gap.
Said chip sucker comprises top board and base plate, has negative pressure cavity between said top board and base plate, and said surface of subsidence is located on the said top board, and the deflection of said surface of subsidence equals the height in said gap.
The working face that exposes on the said substrate partly offers window, and said window is sealed by the transparent observing plate.
Said cover plate is a transparent cover plate.
Said cover plate is provided with box stall towards the middle part, surface of said substrate, makes said separated be at least two bins.
The utility model is provided with one and can places a large amount of chips according to the shape of chip, and can guarantee the chip storehouse (being the gap of this case) that chip can not overturn.The opening of chip sucker docks with clearance opening, can the unordered but polarity of plurality of chips as one man be transported in the chip sucker, utilizes the suction of chip groove on the chip sucker, with the chip absorption that gets at random, withdraws from the chip of unnecessary not low water then.Being about to unordered chip is placed on the chip sucker in an orderly manner.According to 8 hours duty meters, class can accomplish the work of 120000/people high-voltage diode chip finish, was normally to assemble 6 times of process efficiency; Effectively control chip polarity the time, improved man efficiency greatly.Adopt the Combination Design of aluminium alloy pedestal and antistatic polymethyl methacrylate in addition, the distortion that produces when avoiding tool to use for a long time, thus its design and machining accuracy are stablized.Through visual perspective window, can the immediate observation assembling process, eliminate the vision blind area of assembling process, reduce the chip loss; The tool of the utility model has good operability, is convenient to assembling, cleaning, and volume is little, and is in light weight, is easy to realize continuous production operation.
Description of drawings
Fig. 1 is the structural representation of the utility model change-over panel,
Fig. 2 is an A-A cutaway view among Fig. 1,
Fig. 3 is the structural representation of the utility model chips sucker,
Fig. 4 is a B-B cutaway view among Fig. 3,
Fig. 5 is a K place partial enlarged drawing among Fig. 4;
1 is substrate among the figure, the 11st, and working face, the 2nd, cover plate, the 20th, the opening in gap, the 21st, box stall; The 22nd, gap, the 3rd, access panel, the 31st, the working face part that exposes, the 32nd, access panel, the 4th, alignment pin; The 5th, chip sucker, the 50th, surface of subsidence, the 51st, chip groove, the 52nd, the opening of surface of subsidence; The 53rd, base plate, the 54th, top board, the 55th, negative pressure cavity, the 56th, dowel hole.
Embodiment
The utility model shown in Fig. 1-5; Comprise chip sucker 5; Also have change-over panel, said change-over panel comprises substrate 1 and cover plate 2, and said cover plate 2 is fixedly connected on the end face of said substrate 1 as working face 11; Said cover plate 2 areas make the end face of said substrate 1 leave the working face part 31 that exposes less than said substrate 1 top surface area; Leave gap 22 between said cover plate 2 and the substrate 1, the opening 20 in said gap is towards said working face part 31 parts that expose; The height in said gap 22 makes said chip 6 can in said gap 22, not overturn less than the width and the length of said chip 6;
Said chip sucker 5 has the shape of coincideing with said working face part 31 face profiles that expose; Said chip sucker 5 is provided with surface of subsidence 50 towards the surface of the said working face part 31 that exposes; Offer plurality of chips groove 51 on the said surface of subsidence 50, the opening 52 of said surface of subsidence is towards the opening 20 in said gap.Be connected on the substrate 14 last times of alignment pin at chip sucker 5 through the dowel hole on it 56, two openings can dock, thereby make gap 22 and surface of subsidence 50 be interconnected, and chip 6 can the betweens motion.
Said chip sucker 5 comprises top board 54 and base plate 53, and 53 of said top board 54 and base plates have negative pressure cavity 55, and said surface of subsidence 50 is located on the said top board 54, and the deflection of said surface of subsidence 50 equals the height in said gap 22.
The working face part 31 that exposes on the said substrate 1 offers window, and said window is by 32 sealings of transparent observing plate.
Said cover plate 2 is a transparent cover plate.
Said cover plate 2 is provided with box stall 21 towards the middle part, surface of said substrate 1, makes said gap 22 be divided at least two bins.
Claims (5)
1. high-voltage diode assembled fixture; Comprise the chip sucker, it is characterized in that to also have change-over panel; Said change-over panel comprises substrate and cover plate; Said cover plate is fixedly connected on the end face of said substrate as working face, and said cover plate area makes the end face of said substrate leave the working face part that exposes less than said substrate top surface area; Leave the gap between said cover plate and the substrate, the opening in said gap is towards the said working face part that exposes; The height in said gap makes said chip can in said gap, not overturn less than the width and the length of said chip;
Said chip sucker has the shape of coincideing with the said working face part face profile that exposes; Said chip sucker is provided with surface of subsidence towards the surface of the said working face part that exposes; Offer the plurality of chips groove on the said surface of subsidence, the opening of said surface of subsidence is towards the opening in said gap.
2. high-voltage diode assembled fixture according to claim 1; It is characterized in that said chip sucker comprises top board and base plate, has negative pressure cavity between said top board and base plate; Said surface of subsidence is located on the said top board, and the deflection of said surface of subsidence equals the height in said gap.
3. high-voltage diode assembled fixture according to claim 1 is characterized in that the working face that exposes on the said substrate partly offers window, and said window is sealed by the transparent observing plate.
4. high-voltage diode assembled fixture according to claim 1 is characterized in that, said cover plate is a transparent cover plate.
5. according to arbitrary described high-voltage diode assembled fixture among the claim 1-4, it is characterized in that said cover plate is provided with box stall towards the middle part, surface of said substrate, makes said separated be at least two bins.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204521052U CN202332804U (en) | 2011-11-16 | 2011-11-16 | Assembly fixture of high-voltage diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204521052U CN202332804U (en) | 2011-11-16 | 2011-11-16 | Assembly fixture of high-voltage diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202332804U true CN202332804U (en) | 2012-07-11 |
Family
ID=46444774
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011204521052U Withdrawn - After Issue CN202332804U (en) | 2011-11-16 | 2011-11-16 | Assembly fixture of high-voltage diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202332804U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102427048A (en) * | 2011-11-16 | 2012-04-25 | 扬州扬杰电子科技股份有限公司 | High voltage diode assembly tool and operation method thereof |
-
2011
- 2011-11-16 CN CN2011204521052U patent/CN202332804U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102427048A (en) * | 2011-11-16 | 2012-04-25 | 扬州扬杰电子科技股份有限公司 | High voltage diode assembly tool and operation method thereof |
| CN102427048B (en) * | 2011-11-16 | 2013-05-01 | 扬州扬杰电子科技股份有限公司 | High voltage diode assembly tool and operation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20120711 Effective date of abandoning: 20130501 |
|
| RGAV | Abandon patent right to avoid regrant |