CN202308072U - Bimorph - Google Patents
Bimorph Download PDFInfo
- Publication number
- CN202308072U CN202308072U CN2011204250188U CN201120425018U CN202308072U CN 202308072 U CN202308072 U CN 202308072U CN 2011204250188 U CN2011204250188 U CN 2011204250188U CN 201120425018 U CN201120425018 U CN 201120425018U CN 202308072 U CN202308072 U CN 202308072U
- Authority
- CN
- China
- Prior art keywords
- fiber
- layer
- basic unit
- ceramic
- layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000835 fiber Substances 0.000 claims abstract description 76
- 239000000919 ceramic Substances 0.000 claims abstract description 37
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 33
- 239000011889 copper foil Substances 0.000 claims abstract description 25
- 229920005989 resin Polymers 0.000 claims abstract description 20
- 239000011347 resin Substances 0.000 claims abstract description 20
- 239000000758 substrate Substances 0.000 claims abstract description 10
- 238000009422 external insulation Methods 0.000 claims abstract description 8
- 229920006231 aramid fiber Polymers 0.000 claims abstract description 5
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229920000049 Carbon (fiber) Polymers 0.000 claims abstract description 4
- 229920000271 Kevlar® Polymers 0.000 claims abstract description 4
- 229910052796 boron Inorganic materials 0.000 claims abstract description 4
- 239000004917 carbon fiber Substances 0.000 claims abstract description 4
- 239000003365 glass fiber Substances 0.000 claims abstract description 4
- 239000004761 kevlar Substances 0.000 claims abstract description 4
- 239000000203 mixture Substances 0.000 claims description 6
- 238000000605 extraction Methods 0.000 claims description 3
- 235000019988 mead Nutrition 0.000 claims description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 3
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000013461 design Methods 0.000 abstract description 3
- 230000002035 prolonged effect Effects 0.000 abstract description 2
- 239000004760 aramid Substances 0.000 abstract 2
- 238000009413 insulation Methods 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 241000446313 Lamella Species 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000004922 lacquer Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 239000000976 ink Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003610 charcoal Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
- 238000009941 weaving Methods 0.000 description 1
Images
Landscapes
- Laminated Bodies (AREA)
Abstract
The utility model relates to a bimorph, which comprises upper and lower ceramic basic layers and a middle layer. The middle layer comprises a middle fiber basic layer (1). Each ceramic basic layer comprises a ceramic substrate (2) and an inner electrode layer (3) and an outer electrode layer (7). Except for conventional glass fibers and carbon fibers, the component of the middle fiber basic layer (1) can also be boron fibers, Aramid fibers and aramid fibers such as kevlar fibers. The thicknesses of the middle fiber basic layer (1) and the ceramic basic layers are equivalent. The middle fiber basic layer (1) and the ceramic basic layers are adhered by square copper foils (4), organic resin layers (5) and internal conducting fibers (6). The square copper foils (4) are embedded on the surfaces of the organic resin layers (5) at the end of the middle fiber basic layer (1) and are used as leading-out ends of the inner electrode layers (3) for leading out electrodes. The internal conducting fibers (6) are positioned between the ceramic basic layers and the middle fiber basic layer (1) and are embedded in the organic resin layers (5). Except for the upper and lower ceramic basic layers and the middle fiber basic layer, external conducting fiber layers (8) and external insulation layers (9) are coated outside the upper and lower surfaces of the outer electrode layers (7). The bimorph has a simple structure and a reasonable design, is convenient to manufacture, has good insulativity and high reliability and can be suitable for more working environments. The service life of the bimorph is prolonged.
Description
Technical field
The utility model is the bimorph that can be used for fields such as textile machine, Aero-Space, precision optical instrument, micromachine, laser communications, industrial flow control, vibration absorber, actuator.
Background technology
Bimorph is to utilize the inverse piezoelectric effect of piezoelectric ceramic piece in electric field directly to convert electrical energy into the inverting element of mechanical energy; The structure of bimorph, size, manufacture method are very big to its performance and reliability effect; Particularly the thickness in the thickness of ceramic substrate and intermediate layer coupling is very big to the influence of performance index such as exerting oneself of bimorph; Existing bimorph is between ceramic basic unit and intermediate layer; All adopt convex Copper Foil extraction electrode; Convex Copper Foil width dimensions is consistent with the width dimensions of intermediate layer median fiber, in making and use, two-sided convex Copper Foil is sticked together and cause short circuit, or close together causes defective insulation; And the fabrication and processing relative complex of convex Copper Foil, cost is higher; Simultaneously, there are a lot of bimorphs not have the external conductive fibrage, electrode is not had humidification; In addition; Twin lamella causes damage to electrode and external conductive fiber if no external insulation can make bimorph electrode and external conductive fiber expose in atmosphere, and humidity increases the insulating properties that will make bimorph and descends; Influence the performance of bimorph, thus reduction of service life.
Summary of the invention
The purpose of the utility model provides a kind of simple in structure, reasonable in design, easy to make, high reliability bimorph that insulating properties is splendid, and performance improves greatly, and can be suitable for the more work environment, has also prolonged the useful life of bimorph simultaneously.
The technical scheme of the utility model is: a kind of bimorph; Comprise external insulation, external conductive fibrage, ceramic basic unit and intermediate layer up and down; The intermediate layer comprises median fiber basic unit, and the median fiber composition can also be boron fibre, my Mead fiber and aramid fiber class such as kevlar fiber etc. except that conventional glass fiber, carbon fiber; Median fiber unidirectional array or be staggered, ceramic basic unit is made up of ceramic substrate and internal and external electrode layer thereof.Through square Copper Foil, organic resin layer, inner conductive fiber median fiber basic unit and ceramic basic unit are bonded together, ceramic basic unit is longer than by median fiber basic unit, and thickness is suitable, and width is consistent.
Organic resin layer is covered in the median fiber substrate surface, and square Copper Foil is embedded in the termination of median fiber laminar surface with organic resin, and as the exit extraction electrode of internal electrode, the size of square Copper Foil is less than the width of ceramic basic unit and median fiber basic unit.
The inner conductive fiber is between ceramic basic unit and median fiber basic unit; Be embedded among the organic resin layer; 2～4 of inner conductive fiber numbers, thickness and copper thickness are suitable, and length is less than the length difference of ceramic base electrode frame and square Copper Foil and inner electrode layer intersection.
Outside outer electrode layer, also cover and go up external conductive fibrage and external insulation, to improve the reliability of twin lamella.
The utlity model has following advantage:
The structure of the utility model has been given full play to the electrical property and the mechanical performance of potsherd, and the structure of electrode leads to client has improved the reliability of potsherd, has taken into account the needs of making simultaneously, and layer structure has also been considered the environmental suitability of bimorph.
After the utility model can realize that bimorph is processed; Pottery basic unit and combine closely in the intermediate layer, behind the bonding high conformity, electric capacity high conformity, fixed electrode exit; Free-ended power output is big and stable than the power output of other structures and production method; The bimorph leakage current is little, and moisture resistance is good, and work and can adapt to more environment in fault-free ground for a long time.
Description of drawings
Fig. 1: ceramic basic unit structural representation, wherein in electrode printed or sprayed the inner conductive fiber.
Fig. 2: bimorph median fiber basic unit covers organic resin and sticks the sketch map of square Copper Foil, and wherein the right represents does not cover no organic resin layer and exposes the median fiber layer segment.
Fig. 3: do not make the bimorph figure of insulation processing, wherein external electrode has covered the external conductive fibrage.
Fig. 4: each of bimorph layer structural representation, section is for to cut open along the inner conductive fiber.
Fig. 5: each of Fig. 4 layer structure division enlarged drawing, section is for to cut open along the inner conductive fiber.
Among the above-mentioned figure: 1. median fiber basic unit; 2. ceramic substrate; 3. inner electrode layer; 4. square Copper Foil; 5. organic resin layer; 6. inner conductive fiber; 7. outer electrode layer; 8. external conductive fibrage; 9. external insulation
Concrete execution mode
Pass through embodiment below, and combine accompanying drawing, do further bright specifically the technical scheme of the utility model.
The piezoelectricity merchant card comb that is applied to weaving loom is used bimorph, and its concrete structure that adopts is following:
Like Fig. 3, shown in Figure 4: ceramic basic unit is longer than by the median fiber basic unit 1 of bimorph, and thickness is suitable, and width is consistent.The ceramic basic unit that this example adopts and the thickness of median fiber layer 1 all are about 0.24mm, have considered the elasticity of median fiber layer 1 like this, have taken into account the performance of ceramic substrate 2 again, have improved exerting oneself of twin lamella, and the bimorph amplitude of fluctuation has also obtained taking into account.
As shown in Figure 1: inner conductive fiber 6 overlays on the inner electrode layer 3 of ceramic basic unit; Coverage mode can be printing or spraying etc.; The inner electrode layer 3 of pottery basic unit can be nickel, gold, copper, silver etc.; Inner conductive fiber 6 can cover 2～4 for electrically conductive ink, charcoal fiber, steel wire fibre, copper fiber, silver-colored fiber, nickel fiber etc.This example adopts 3 electrically conductive inks; Inner conductive fiber 6 length are less than the length difference of ceramic substrate inner electrode layer 3 with square Copper Foil 4 and inner electrode layer 3 intersection; So that square Copper Foil 4 does not overlap with inner conductive fiber 6 when bonding; Do not form the step space at square Copper Foil 4 places and cause ceramic substrate 2 fractures, the inner electrode layer 4 of simultaneously square Copper Foil 4 and exit can combine again closely.
As shown in Figure 2: two-sided covering organic resin layer 5 is on median fiber layer 1, and organic resin layer 5 coverage modes can adopt modes such as printing; The median fiber composition is except that conventional glass fiber, carbon fiber; Can also be boron fibre, my Mead fiber and aramid fiber class such as kevlar fiber etc., median fiber adopts unidirectional or the back encapsulating compound that is staggered forms, and the composition of glue can be for epoxy resin etc.; The utility model median fiber adopts longitudinal fiber to arrange; To improve the elasticity of bimorph, square Copper Foil 4 is placed on the middle position, end, to improve the insulating properties between the two-sided square Copper Foil 4; Its thickness is suitable with inner conductive fiber 6 thickness, so that do not damage ceramic basic unit when bonding.
Like Fig. 3, Fig. 4, shown in Figure 5: inner electrode layer 3 is covered with the ceramic basic unit double-sided adhesive of inner conductive fiber 6 on the median fiber layer 1 that covers organic resin layer 5; Inner conductive fiber 6 embeds in the organic resin layer 5; Square Copper Foil 4 is close to ceramic inner electrode layer 3, through warming and pressurizing, organic resin is solidified; Square like this Copper Foil 4 combines with inner electrode layer 3 closely, and ceramic basic unit and median fiber layer 1 are also bonding solid and reliable.The curing temperature of organic resin layer 5 is 80～210 ℃, and this example adopts the organic resin of hot setting, and curing temperature is 190 ℃～210 ℃.
Like Fig. 3, Fig. 4, shown in Figure 5, be covered with external conductive fibrage 8 on the outer electrode layer 7, composition and coverage mode are with inner conductive fiber 6; Be covered with external insulation 9 again outside the external conductive fibrage 8 and carry out insulation processing; External insulation 9 compositions can be organic silica gel, high-temperature insulation lacquer, three anti-lacquers etc.; Curing temperature is 80 ℃～210 ℃, and this example adopts the high-temperature insulation lacquer, and curing temperature is 180 ℃～210 ℃.After insulation was handled, bimorph can adapt to more environment, has improved the useful life of bimorph greatly.
The utility model adopts the structural design of optimizing, and manufacture craft is simple and feasible; The cantilever beam bimorph is at one end fixing, and power output is greatly enhanced and stable and consistent in the free end vibration processes, has also improved the insulation characterisitic of bimorph simultaneously; Reliability and environmental suitability have been strengthened; Through long-time burn-in test, merchant's card comb piece performance is still stable, reliable operation.
Claims (2)
1. a bimorph comprises ceramic basic unit and intermediate layer up and down, and the intermediate layer comprises median fiber basic unit (1); Median fiber unidirectional array or be staggered; Pottery basic unit comprises ceramic substrate (2), inner electrode layer (3) and outer electrode layer (7), and it is characterized in that: median fiber basic unit composition can also be aramid fiber class such as kevlar fiber except that conventional glass fiber, carbon fiber; Boron fibre; My Mead fiber etc., the intermediate layer is suitable with ceramic base layer thickness size, and both bond together through square Copper Foil (4), organic resin layer (5), inner conductive fiber (6); Square Copper Foil (4) is embedded on organic resin layer (5) surface of median fiber basic unit (1) termination; Exit extraction electrode as inner electrode layer (3); Inner conductive fiber (6) is between ceramic basic unit and median fiber basic unit (1); Be embedded among the organic resin layer (5), the size of square Copper Foil (4) is less than the width of ceramic basic unit and median fiber basic unit (1); Inner conductive fiber (6) thickness is suitable with square Copper Foil (4) thickness, the length that the difference of the length of the inner electrode layer (3) of ceramic substrate (2) and square Copper Foil (4) and interior electrode (3) intersection is a bit larger tham inner conductive fiber (6).
2. a kind of bimorph as claimed in claim 1 is characterized in that except that up and down ceramic basic unit and intermediate layer, outside the upper and lower surfaces of outer electrode layer (7), being coated with external conductive fibrage (8) and external insulation (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204250188U CN202308072U (en) | 2011-11-01 | 2011-11-01 | Bimorph |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204250188U CN202308072U (en) | 2011-11-01 | 2011-11-01 | Bimorph |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202308072U true CN202308072U (en) | 2012-07-04 |
Family
ID=46376906
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011204250188U Expired - Fee Related CN202308072U (en) | 2011-11-01 | 2011-11-01 | Bimorph |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202308072U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103906342A (en) * | 2012-12-28 | 2014-07-02 | 鸿富锦精密工业（深圳）有限公司 | Circuit board |
| CN104051607A (en) * | 2014-05-26 | 2014-09-17 | 江苏联能电子技术有限公司 | Piezoelectric ceramic fan driven by electric supply |
| TWI558276B (en) * | 2012-12-27 | 2016-11-11 | 鴻海精密工業股份有限公司 | Circuit board |
| CN108471257A (en) * | 2018-04-24 | 2018-08-31 | 哈尔滨工业大学 | A kind of piezoelectric vibration energy collection structure |
-
2011
- 2011-11-01 CN CN2011204250188U patent/CN202308072U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI558276B (en) * | 2012-12-27 | 2016-11-11 | 鴻海精密工業股份有限公司 | Circuit board |
| CN103906342A (en) * | 2012-12-28 | 2014-07-02 | 鸿富锦精密工业（深圳）有限公司 | Circuit board |
| CN104051607A (en) * | 2014-05-26 | 2014-09-17 | 江苏联能电子技术有限公司 | Piezoelectric ceramic fan driven by electric supply |
| CN108471257A (en) * | 2018-04-24 | 2018-08-31 | 哈尔滨工业大学 | A kind of piezoelectric vibration energy collection structure |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN202308072U (en) | Bimorph | |
| CN102891625B (en) | Magneto-electricity combined energy conversion device | |
| JP5954792B2 (en) | Bending transducer | |
| CN108180927B (en) | Full-flexible self-powered sensor and manufacturing method thereof | |
| CN100592543C (en) | Piezoelectric ceramic fibre containing metal core of partly painted electrode | |
| TW322640B (en) | ||
| JP5724120B1 (en) | Piezoelectric element unit and driving device | |
| US20080203851A1 (en) | Piezoelectric package with porous conductive layers | |
| KR101563092B1 (en) | Inductance element | |
| JP2009124791A (en) | Vibrator and vibration wave actuator | |
| Quintero et al. | Design optimization of vibration energy harvesters fabricated by lamination of thinned bulk-PZT on polymeric substrates | |
| Khan | A vibration‐based electromagnetic and piezoelectric hybrid energy harvester | |
| CN103916047B (en) | Piezoelectricity oscillating generating set | |
| CN110470880A (en) | A kind of current sensor probe, preparation method and the sensor including it | |
| CN202712272U (en) | Bimorph | |
| US20040012308A1 (en) | Piezo-electric bending transducer | |
| CN101572504B (en) | Myoid piezoelectric fiber composite material driver | |
| CN2899119Y (en) | Aluminum-based laminated high-voltage overloading electric driver | |
| EP1553629A3 (en) | Electrically conductive adhesive sheet, method of manufacturing the same, and electric power conversion equipment | |
| CN201638855U (en) | Novel twin lamella | |
| JP2015508576A (en) | Actuator module having a multilayer actuator arranged in a casing and a constant very small leakage current on the actuator surface | |
| CN203813693U (en) | Piezoelectric bimorph performer with multiple working modes | |
| JP5895985B2 (en) | Piezoelectric drive | |
| CN100426547C (en) | Acuminium-base laminated high-over load piezoelectric driver | |
| CN201408580Y (en) | High heat conduction single glass fiber copper flat wire |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120704 Termination date: 20151101 |
|
| EXPY | Termination of patent right or utility model |