CN202282348U - LED package and LED display - Google Patents
LED package and LED display Download PDFInfo
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- CN202282348U CN202282348U CN2011201898860U CN201120189886U CN202282348U CN 202282348 U CN202282348 U CN 202282348U CN 2011201898860 U CN2011201898860 U CN 2011201898860U CN 201120189886 U CN201120189886 U CN 201120189886U CN 202282348 U CN202282348 U CN 202282348U
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Abstract
The utility model provides an LED (Light Emitting Diode) package and an LED display. The LED package comprises: a lead frame which comprises a plurality of conductive chip carriers; LEDs which are respectively arranged on each of the plurality of conductive chip carriers; a lens which at least partly covers the lead frame; and a plastic housing which at least partly wraps the lead frame, wherein the surface-mounted LED package has a contour height less than 1mm.
Description
Technical field
The utility model relates generally to surface mounted device, more specifically, relates to the plastic leaded chip carrier of holding the LED device, and relates to the light-emitting diode display that comprises this device.
Background technology
In recent years, light-emitting diode (LED) technology all increases significantly always, makes to have introduced the LED that increases brightness and color fidelity.Owing to these improved LED and improved image processing techniques, big specification, all-colour LED video display screen have become available, and generally use now.The light-emitting diode display of big specification generally comprises the assembly of independent LED panel, and wherein said LED panel provides by the distance between neighbor or " pel spacing " definite image resolution ratio.
Intention is used for having relatively big pel spacing from the outdoor display that farther distance is watched, and comprises the led array of separation (dispersing) usually.In the led array of separation, a string independent red LED, green LED and blue led of installing is actuated to just form the picture that presents full-color pixel to the beholder.On the other hand, indoor display screen requires short pel spacing (for example 3mm), and comprises that carrying is installed in the panel of red LED, green LED and blue led on the independent electronic packaging part (for example surface mounted device (SMD) packaging part).Each SMD limits a pixel usually.Less relatively SMD is connected to the driver printed circuit board (PCB) (PCB) of the output of each SMD of control.
Though indoor display and outdoor display are all visual in the scope of big off-axis angle, but the perception that color fidelity often still can occur along with the increasing at visual angle lacks.In addition, the material that the material of each LED packaging part and/or be used to is installed each LED can have reflection characteristic, owing to produced unnecessary light reflection and/or dazzle, this possibly further reduce color fidelity.
Well-knownly be, no matter whether it comprises integrated circuit or discrete component (for example diode or power transistor), and the electronic packing piece of SMD and many other types all distributes enough heats, so need thermal management.Too much heat also can cause the LED fault.Therefore designing one of factor that the LED system considered is effective thermal management.In the design of electronic packing piece, effectively one of target of thermal management be operating temperature with the operating temperature of LED and other active circuit element maintain one suitable low-level, be enough to prevent too early unit failure.The various cooling strategies that comprise conduction heat transfer are more commonly used.A kind ofly carry out conduction heat transfer and allow the lead-in wire of heat along device conducted so that distribute the conventional method of heat in the electronic packing piece.Yet the surface area that lead-in wire does not often have enough quality or exposure is to provide effective heat radiation.For example, mainly luminous high strength LED can produce great amount of heat in the visible light part of electromagnetic spectrum, uses this traditional technology to be difficult to these heats are dissipated.
The design object that adds with great visual angle, keeps low relatively operating temperature and reduce the size of SMD packaging part conditions each other to a certain extent.Expectation is developed a kind of SMD packaging part that solves all these design objects with lower cost.
The utility model content
The utility model provides a kind of light emission diode package member, comprising: lead frame comprises a plurality of conductive chip carriers; Be arranged in said a plurality of conductive chip carrier the light-emitting diode on each; Lens cover said lead frame at least in part; And plastic casing, it holds said lead frame at least in part, it is characterized in that, and the profile height except lens of the light emission diode package member of mounted on surface is less than 1mm.
Further; Light emission diode package member according to the utility model; The width of the light emission diode package member of said mounted on surface except lens is less than 2.6mm, and the length of the light emission diode package member of wherein said mounted on surface except lens is less than 2.6mm.
Further; Light emission diode package member according to the utility model; Each light-emitting diode has first electric terminal and second electric terminal; Said first electric terminal of each light-emitting diode is electrically coupled to corresponding conductive chip carrier, and said first electric terminal and said second electric terminal of each comprises negative electrode and anode respectively in wherein said a plurality of light-emitting diode, and wherein said second electric terminal of each light-emitting diode is electrically coupled to connection gasket corresponding in a plurality of conducting connecting parts.
Further, according to the light emission diode package member of the utility model, said plastic casing comprises the square or rectangular chamber with 0.5mm degree of depth.
Further, according to the light emission diode package member of the utility model, each in the said conductive chip carrier all supports single light-emitting diode, and said light-emitting diode independently sends ruddiness, green glow or blue light.
Light emission diode package member according to the utility model; Further comprise a plurality of conducting connecting parts with said a plurality of conductive chip carrier separating; Each conductive chip carrier has upper surface, lower surface and is positioned at the chip bearing pad on the upper surface; Each conducting connecting part has upper surface, lower surface and is positioned at the connection gasket on the upper surface, it is characterized in that, second electric terminal of each is electrically coupled to the connection gasket of corresponding conducting connecting part in said a plurality of light-emitting diodes through independent bonding wire.
Further, according to the light emission diode package member of the utility model, the lower surface of the lower surface of each said conducting connecting part and each said conductive chip carrier all has the pad area that 0.4mm takes advantage of 0.7mm.
Further, according to the light emission diode package member of the utility model, said plastic casing comprises thermoplastics.
Further, according to the light emission diode package member of the utility model, said plastic casing comprises a kind of in white polyphthalamide or the black polyphthalamide.
The invention also discloses a kind of light emitting diode indicator; It comprises the substrate that carries the surface mounted device array of arranging with the form of vertical row and horizontal line; In the said surface mounted device each all comprises: lead frame comprises a plurality of conductive chip carriers; Be arranged in said a plurality of conductive chip carrier the light-emitting diode on each, said a plurality of light-emitting diodes are configured to switch on so that produce FR color and limit a pixel of said display with the mode of combination; Lens cover said lead frame at least in part; And housing, it holds said lead frame at least in part.Said light emitting diode indicator also comprises signal processing and LED driving circuit; It is electrically connected optionally the array of surface mounted device is switched on; It is characterized in that, each pixel of said display have 2.8mm or more the Theravada with 2.8mm or littler size.
The utility model also provides a kind of light emission diode package member, and it comprises: lead frame comprises a plurality of conductive chip carriers; Be arranged in said a plurality of conductive chip carrier the light-emitting diode on each; Lens cover said lead frame at least in part; And the polymeric shells that holds said lead frame at least in part, said polymeric shells comprises: relative, have first first type surface and second first type surface of height distance therebetween; Relative, have a side surface of width distance therebetween; With relative, have the end face of length distance therebetween, it is characterized in that said height distance, said width distance and said length distance are all less than 2.6mm.
Further; Light emission diode package member according to the utility model is characterised in that; Said housing holds said lead frame at least in part and defines a chamber; Said chamber extends to the inside of said housing from the bottom surface of said first first type surface to said chamber, and the ratio of the area of the area of said chamber bottom surface and said first type surface is at least 35%.
Further, the light emission diode package member according to the utility model comprises red light emitting diodes wafer, green LED wafer and blue LED wafer.
Further; Light emission diode package member according to the utility model; It is characterized in that; Said housing holds said lead frame at least in part and defines a chamber, and said chamber extends to the inside of said housing from said first first type surface to the bottom surface of said chamber, and each conductive chip carrier has and extended the length of chamber bottom surface length more than at least 1/2.
Another embodiment discloses a kind of mounted on surface LED packaging part, and it comprises housing and the lead frame that is at least partly held by housing.Said housing comprises the first relative first type surface and second first type surface, opposite side surfaces, and opposing end faces.Said housing is limited with the chamber that extends to enclosure interior from first first type surface.Lead frame comprises a plurality of conductive chip carriers.On each chip bearing pad of each conductive chip carrier, have single led.Each LED has first electric terminal and second electric terminal.First electric terminal of each LED is electrically coupled to corresponding conductive chip carrier.Second electric terminal of each LED is electrically coupled to corresponding one connection gasket of a plurality of conducting connecting parts.The degree of depth of said chamber is less than 0.6mm.In certain embodiments, this degree of depth is less than about 0.55mm.In other embodiments, this degree of depth is less than about 0.5mm.In more another other embodiment, this degree of depth is less than about 0.45mm, and in other other embodiment, this degree of depth is less than about 0.4mm.In certain embodiments, the profile height is less than 1mm.In certain embodiments, this profile height is less than 0.95mm.In more another other embodiment, this profile height is less than about 0.90mm, and in other other embodiment, this profile height is less than about 0.85mm.
Another embodiment discloses a kind of light-emitting diode display, and it comprises the substrate that carries surface mounted device (SMD) array of arranging with the form of vertical row and horizontal line.Each SMD comprises housing and a plurality of LED, and is that said a plurality of LED are configured to switch on so that a pixel that produces basic gamut color and be configured to be used to limit said display with compound mode.Light-emitting diode display further comprises signal processing and led drive circuit, thereby said circuit is electrically connected selectively to the array of SMD energising display image on light-emitting diode display.Each pixel of display has about 2.8mm (or littler) and multiply by the size of about 2.8mm (or littler).
With previous disclosed comparing, the miniature mounted on surface LED packaging part of the utility model has bigger pin pad, lower operating temperature and lower manufacturing cost.
Description of drawings
Fig. 1 is the stereogram according to the surface mounted device of the embodiment of the utility model;
Fig. 2 is the vertical view of the embodiment shown in Fig. 1;
Fig. 3 is the perspective view according to the lead frame of an embodiment that can be used in the surface mounted device;
Fig. 4 is the face upwarding stereogram of embodiment shown in Figure 1;
Fig. 5 is the top view of lead frame shown in Figure 3;
Fig. 6 is the viewgraph of cross-section along Fig. 2 embodiment of hatching 6-6 intercepting;
Fig. 7 is the top view of an embodiment of surface mounted device; And
Fig. 8 is the front view according to the part of the LED display that comprises surface mounted device of the embodiment of the utility model.
Embodiment
The utility model preferred embodiment of the optimal desired pattern that has presented representative enforcement the utility model is below described.This explanation is not to carry out with restrictive meaning, and only is the purpose for the rule of describing the utility model, and the scope of the utility model is limited appended claims.
Now will through with reference to accompanying drawing (wherein showing the embodiment of the utility model) hereinafter the embodiment to the utility model describe fully.Yet the utility model can be through multiple different embodied, and should not be construed as and be confined to the listed embodiment of this paper.On the contrary, it is thorough and complete in order to make this utility model that these embodiment are provided, and has fully passed on the scope of the utility model to those skilled in the art.Middle in the whole text same reference numbers is represented similar elements.
To understand, first, second waits and describes various different elements though can use a technical term in this article, and these elements should be by these terms restrictions.These terms just are used for an element is distinguished with another element mutually.For example, under the situation that does not break away from the utility model scope, first element can be called as second element, and likewise, second element can be called as first element.When with in this article the time, term " and/or " comprise any He all combinations among one or more in the relevant listed project.
To understand, when element (such as layer, district or substrate) be called as be positioned at another element " on " or extend to another element " on ", it can be located immediately on another element or directly extend on another element, or also can have the insertion element.On the contrary, when element be called as " being located immediately at " another element " on " or " directly extending to " another element on the time, do not have the insertion element.It will also be understood that, " be connected " with another element or when " coupling ", it can directly connect or be coupled to another element maybe can exist the insertion element when an element is called as.On the contrary, when an element is called as " directly connection " or " directly coupling " to another element, there is not the insertion element.
Relational language (such as " following " or " more than " or " on " or D score or " level " or " vertical ") also can be used in this article an element shown in the description figure, layer or district with another element, layer or the relation between distinguishing.It should be understood that these term intentions also comprise the different azimuth except that the orientation shown in the figure of this device.
The term as used herein purpose only is in order to describe specific embodiment, and is not intention restriction the utility model.Such as in this article during use, only if context clearly indicates in addition, otherwise singulative " " also is intended to comprise plural form.What will be further understood that is; When using in this article; Term " comprises ", " by ... constitute ", " containing " and/or indicate " comprising " existence of said characteristic, integral body, step, operation, element and/or parts, but do not get rid of the existence or the interpolation of one or more further features, integral body, step, operation, element, parts and/or their group.
Unless otherwise prescribed, otherwise all terms that use among this paper (comprising technology and scientific terminology) all have the general equivalent of understanding of the utility model one skilled in the art.What will be further understood that is, term as used herein should be interpreted as to be had and the content of this specification and the meaning of the aggregatio mentium in the association area, only and if this paper clearly stipulate, otherwise will can not explain with idealized or too formal meaning.
In certain embodiments, the LED packaging part is provided with a plurality of LED, and each LED is electrically coupled to independently input and output.Like this, LED wafer (die) can independently be controlled and can more effectively operate.In certain embodiments, the LED packaging part comprises lead frame, has around the molded polymer of lead frame (for example plastics) housing.Polymeric shells comprises the first relative first type surface that has height distance therebetween and second first type surface, has an opposite side surfaces of width distance therebetween; And the opposing end faces that has length distance therebetween, wherein height distance, width distance and length distance are less than about 2.6mm.In certain embodiments, this distance is about 2.5mm or littler, and in other other embodiment, this distance is about 2.35mm or littler.In certain embodiments, housing holds lead frame at least in part and limits the chamber that extends to enclosure interior from first first type surface, and at least a portion of conductive chip carrier is exposed to the at of chamber.The ratio of the area of cavity bottom and the area of first type surface is at least about 35%.In certain embodiments, this ratio is greater than 40%.In other other embodiment, this ratio is greater than 50%.
In certain embodiments, light emission diode package member comprises a plurality of LED wafers, for example, and red LED wafer, green LED wafer and blue led wafer, and lead frame comprises the conductive chip carrier that is used for each LED.In certain embodiments, each conductive chip carrier has the length more than at least 1/2 of extending the chamber bottom lengths.Common installation pad will have the area of increase to improve heat radiation.
Fig. 1-4 show according to concrete exemplary embodiment, be used in mounted on surface LED packaging part 10 and parts thereof in the light-emitting diode display (such as indoor LED display and/or outdoor LED display).LED packaging part 10 comprises the plastic casing 12 that holds lead frame 14 at least in part.Lead frame 14 comprise first, second with the 3rd conductive chip carrier 142,143 and 144 and with first, second and the 3rd conducting connecting part 146,147 and 148 of conductive chip carrier separating, as shown in Figure 3.Chip carrier 142-144 has scope at the profile height of about 0.42mm to about 0.48mm.In other words, the profile height is the height of the lead frame of bending.For example, in Fig. 3, the profile height refers to the distance of 102 of upper surfaces of lower surface 82 and the chip carrier 142 of chip carrier 142.In certain embodiments, the profile height is less than about 1.0mm.In other other embodiment, the profile height is less than about 0.95mm.In more another other embodiment, the profile height is that about 0.85mm is to about 0.95mm.Before bending, the leadframe metal sheet can have the sheet thickness less than about 0.15mm.
First, second with the 3rd conductive chip carrier in each all have the upper surface that comprises connection gasket.For example, the first conductive chip carrier 144 has the upper surface 104 that comprises connection gasket 124.LED44 is arranged on the connection gasket 124 on the upper surface 104 of conductive chip carrier 144.LED 46 is arranged on the connection gasket 123 of upper surface 103.LED 48 is arranged on the connection gasket 122 of upper surface 102.Each LED has first electric terminal and second electric terminal.First electric terminal is restricted to anode.For example a LED 44 has the anode that is electrically coupled to the first conductive chip carrier 146.Among the second and the 3rd LED 46 and 48 each all has the anode that is electrically coupled to the second and the 3rd conductive chip carrier 147 and 148 respectively.
First, second with the 3rd conducting connecting part in each all have upper surface, lower surface and be positioned at the connection gasket on the upper surface.Each conductive chip carrier all has upper surface, lower surface and is positioned at the chip bearing pad on the upper surface, and each conducting connecting part all has upper surface, lower surface and is positioned at the connection gasket on the upper surface.For example, in Fig. 3, first conducting connecting part 146 has upper surface 104, lower surface 84 and is positioned at the connection gasket 126 on the upper surface 104.Second conducting connecting part 147 has upper surface 106, lower surface 86 and is positioned at the connection gasket 127 on the upper surface 106.The 3rd conducting connecting part 148 has upper surface 108, lower surface 88 and is positioned at the connection gasket 128 on the upper surface 108.The first conductive chip carrier 142 has upper surface 102, lower surface 82 and is positioned at the connection gasket 122 on the upper surface 102.The second conductive chip carrier 143 has upper surface 103, lower surface 83 and is positioned at the connection gasket 123 on the upper surface 103.The 3rd conductive chip carrier 144 has upper surface 104, lower surface 84 and is positioned at the connection gasket 124 on the upper surface 104.The lower surface of conductive chip carrier and connection gasket also can be called as the pin pad.
The first and second conductive chip carriers 142 and 143 are adjacent one another are, and the second and the 3rd conductive chip carrier 143 and 144 is adjacent one another are.Adjacent conductive chip carrier suppressed by vector gap is separated and is had asymmetrical upper surface profile with respect to the center line in the carrier gap.First and second conducting connecting parts 146 and 147 are adjacent one another are.The second and the 3rd conducting connecting part 147 and 148 is adjacent one another are.The adjacent conductive connector is separated by joint gap and has asymmetrical upper surface profile with respect to the center line in the joint gap.
Through embodiment and unrestriced mode, mounted on surface LED packaging part 10 can have the total length L of about 2.5mm, the overall width W of about 2.5mm and the height H of about 0.95mm.
Among the illustrative embodiment in Fig. 1 and Fig. 2, three LED 44,46,48 in the mounted on surface LED packaging part 10 preferably send redness, green and blue respectively, so when suitably switching on, these LED produce FR basically color with the mode of combination.Two or more among these LED also can send same color, comprise white.For example, LED 44 all can send red light with LED 46.Led chip can have square dimensions or rectangle size.For example, square LED chip can have less than about 0.11mm or at about 0.09mm to about 0.11mm scope or less than about 0.1mm or the profile height in 0.08 to 0.10mm scope.Square LED chip can have less than about 0.32mm or at the profile width of about 0.265mm to about 0.315mm scope.Square LED chip can have less than about 0.38mm or at the profile width of about 0.33mm to about 0.38mm scope.The rectangle led chip can have less than about 0.13mm or at the profile height of about 0.10mm to about 0.13mm scope.The rectangle led chip can have less than about 0.28mm or at the profile width of about 0.20mm to about 0.28mm scope.The rectangle led chip can have less than about 0.36mm or at the profile width of about 0.28mm to about 0.36mm scope.
In illustrative embodiment, red LED 44 is arranged on the first conductive chip carrier 142.Green LED 46 is arranged on the second conductive chip carrier 143 near the center of chamber 36.Blue led 48 is provided with on the 3rd conductive chip carrier 144.For the heat of the LED that dissipates, preferably increase the upper surface area of chip carrier upper surface, so that they can more effectively dispel the heat.For example, the upper surface area of each chip carrier is about 2 times of upper surface area of corresponding connector.
Led chip 44,46,48 extends at horizontal direction (promptly with side surface 28 direction vertical with 30) upper edge first axle 62.Lead-in wire 50,52,54,56 is parallel to each other and in the extension of the direction upper edge second axis 62a vertical with direction 62.The first axle and second axis cross one another near the center of second led chip 46.
In this embodiment; Flow through providing in pad, the mould, heat radiation and chip locate and design conducting connecting part; Therefore with existing public technology (the applicant's common unsettled U.S. Patent Application Serial Number 12/321 for example; 059, the disclosure of this patent is incorporated this paper by reference into) heat radiation compare, improved the heat radiation of red LED 44.With reference to Fig. 1-4, realized the heat radiation that strengthens through the more high surface area of each pin pad.For example each lower surface 86-88 of conducting connecting part 146-148 has increased more than 10%.The surface area of each lower surface 82-84 of conductive chip carrier also increases more than 10%.More specifically, lower surface 83 and 87 surface area have increased about 40%.
Simultaneously, evenly flow the profile 112 of upper surface 104,104 and 116 asymmetric with respect to the second axis 62a in each direction in order to ensure PPA fluid when forming housing 12.Likewise, the profile 116 of first and second conducting connecting parts 146 and 148 adjacent upper surface and 117 asymmetric with respect to the gap between connector 146 and 147.The profile 117 of the second and the 3rd conducting connecting part 147 and 148 adjacent upper surface and 118 asymmetric with respect to the gap between connector 147 and 148.Likewise, the profile phase of adjacent chips carrier is also asymmetric for the gap between the adjacent chips carrier (such as 122-123,123-124).
Conducting connecting part 146,147 and 148 comprises the electrical connection pad 126,127,128 of increase respectively, and these electrical connection pads are arranged in center 58, and upper surface 102-104 is adjacent to be separated with it but the parts of this center 58 and chip carrier carry.In the preferred form of mounted on surface LED packaging part 10; Lead-in wire 52,54,56 and 58 bendings to be extending to the outside of housing and to extend along its end face 32 and 34 separately, and then crooked so that the lower surface 82-84 of lead-in wire and lower surface 26 extensions of 86-88 along plastic casing 12.The lower surface 82-84 of lead-in wire and the basal surface with the thermal conducting body towards outer surface of 86-88 flush basically, so that be connected to bottom substrate.Use any lower surface 82-84 and the 86-88 in many known interconnection techniques (comprising welding) to be electrically connected or to be soldered to weldering trace or the pad on the substrate with lead-in wire.
In a preferred embodiment, weld pad is included on the bottom of end, so that when watch each independently to can't see scolder during SMD from the top.Advantageously, this helps to prevent dazzle and has improved contrast, when particularly watching by day.Shown in Fig. 1 and Fig. 6, chamber 36 extends to the enough degree of depth of enclosure interior to expose connection gasket 122-124 and 126-128.
The concrete size of the lead-in wire 52-54 that extends internally from the end face 32 and 34 of housing and the lower surface 82-84 of 56-58 and 86-88 can rely on following factor and decide: the expection of mounted on surface LED packaging part is implemented, LED to be adopted, the material of housing 12, the size of SMD and/or the combination of other this type of factor and/or these factors.In certain embodiments, lead-in wire 50-52 and 54-56 that can be through the gap 92 separating husk external between the pad be so that the link electrically insulated from one another.
A plurality of conductive chip carriers 142,143 and 144 and a plurality of conducting connecting part 146,147 and 148 can make by conducting metal or metal alloy (such as copper, copper alloy, other suitable low-resistivity resistant material or the combination of these materials).Because led chip is arranged on the conductive chip carrier 142-144, so the high surface area of upper surface 102-104 can help heat radiation.
Among the LED 44,46 and 48 each all can be through conduction and thermally-conductive interface 100 (such as scolder, adhesive, coating, film, sealant, paste, grease and/or other suitable material) and different connection gasket electric coupling independently.In a preferred embodiment, can use the weld pad that is positioned on LED 44,46 and 48 bottoms with LED 44,46 and 48 and connection gasket 122-124 electric coupling and fixing, can't see scolder from the top.Prevent that descried favourable part is scolder from the top, reduced reflection and better contrast is provided, when particularly watching by day.
In according to some manufacturing approach of the present disclosure, housing 12 is molded and/or be assemblied in around the connection gasket 122-124 before, LED 44,46 and 48 can be coupled to connection gasket 122-124.Perhaps, partly by after clad is in housing, LED can be coupled to connection gasket 122-124 at connector.The chamber 36 that extends in the housing can be constructed to make enough parts of connection gasket 122-124 and 124-128 to be exposed to receive LED and relevant bonding wire (wire bonds, wire bond).
Referring now to Fig. 6-7, wherein show some instances of each parts of the SMD packaging part that is used for LED10.And nonrestrictive, the relevant size of the embodiment with shown in Fig. 6-7 that describes below also can be applicable to the mounted on surface packaging part among Fig. 1-5 as an example.
In the exemplary embodiment of Fig. 6, the width of SMD packaging part 10 or length are less than about 2.6mm.Preferably, the width of SMD or length are that about 2.4mm is to about 2.6mm.More preferably, the width of SMD or length are about 2.5mm.The profile height of SMD packaging part 10 is less than about 1.0mm.Preferably, the scope of the profile height of SMD is that about 0.9mm is to about 1.0mm.More preferably, the profile height of SMD is about 0.95mm.Chamber 36 has scope and is the A/F of about 1.86mm to about 1.96mm in upper surface, and in lower surface, has the width of scope in about 1.59 to 1.69mm.Preferably, chamber 36 has the A/F of about 1.91mm in upper surface, and in lower surface the width of the about 1.64mm of tool.The scope of angle θ between two side surfaces of chamber is about 25.0 ° to about 35.00 °, is preferably about 30.0 °.The width of the chamber opening 36 in first first type surface 24 at about 1.4mm to the scope of about 1.55mm.The opening of the chamber 36 in first first type surface have greater than first first type surface, 24 gross areas about 55% and less than about 61% area of this gross area.Housing around chamber has about 0.3mm to the interior wall thickness of about 0.45mm scope.Especially, the wall thickness near first first type surface 24 of housing is thinner than the wall thickness near connection gasket 60 of housing.
In Fig. 7, these three LED 44,46 and 48 have pitch P1 and the P2 of about 0.3mm to about 0.4mm.Among the LED 44,46 and 48 each all can have the profile width of about 0.3mm to about 0.4mm.Among the LED 44,46 and 48 each all can have the profile length of about 0.3mm to about 0.4mm.In certain embodiments, pitch less than about 0.3mm and profile width less than about 0.3mm.Gap 92 can have about width of 0.13 to about 0.17mm.The ratio of the area of chamber bottom surface 36a and the area of first type surface 24 is at least 35%.In certain embodiments, this ratio is greater than 40%.In other other embodiment, this ratio is greater than 50%.
The exemplary part that shows LED display 300 of Fig. 8, for example indoor display screen, in general it comprises the driver PCB 302 that carries a lot of surface mounted devices 304 of arranging with the form of row and row, each SMD limits a pixel.Each pixel of display can have the size that about 2.8mm multiply by about 2.8mm.Can drive each led chip through the different electric voltage level.For example, can pass through 2.2V power drives red LED, and can be through power drives blue led and the green LED of about 3.1V.SMD 304 can comprise the device shown in above-described those and Fig. 1-7.Being connected weldering trace or pad that SMD device 304 is electrically connected on the PCB 302 respond so that the suitable signal of telecommunication is handled with the drive circuit (not shown).
As stated, each SMD carries the linear array 306 of the vertical orientation of red LED, green LED and blue led.This linear orientation that has been found that LED has improved color fidelity in bigger angular field of view.Also can provide through hole 308 to allow higher with shorter the contacting of ceramic SMD main body and PCB.Through hole 308 also allows to improve heat radiation.
As previously mentioned, be appreciated that the utility model embodiment provides miniature mounted on surface LED packaging part, it comprises partly a plurality of LED on the lead frame that is held by plastic casing.Lead frame comprises a plurality of conductive chip carriers and a plurality of conducting connecting part.The upper surface of every pair of adjacent chips carrier or adjacent connector has asymmetric profile with respect to the center line in the gap between adjacent chips carrier or the adjacent connector.With previous disclosed comparing, the miniature mounted on surface LED packaging part of the utility model has bigger pin pad, lower operating temperature and lower manufacturing cost.
Therefore, hope is seen aforementioned detailed description as illustrative rather than restrictive, and should be understood that it is spirit and the scope that is limited (comprising all equivalents) the utility model following claim.
Claims (14)
1. light emission diode package member comprises:
Lead frame comprises a plurality of conductive chip carriers;
Be arranged in said a plurality of conductive chip carrier the light-emitting diode on each;
Lens cover said lead frame at least in part; And
Plastic casing, it holds said lead frame at least in part,
It is characterized in that the profile height except lens of the light emission diode package member of mounted on surface is less than 1mm.
2. light emission diode package member according to claim 1; It is characterized in that; The width of the light emission diode package member of said mounted on surface except that lens is less than 2.6mm, and the length of the light emission diode package member of wherein said mounted on surface except that lens is less than 2.6mm.
3. light emission diode package member according to claim 1; It is characterized in that; Each light-emitting diode has first electric terminal and second electric terminal; Said first electric terminal of each light-emitting diode is electrically coupled to corresponding conductive chip carrier; And said first electric terminal of each and said second electric terminal comprise negative electrode and anode respectively in wherein said a plurality of light-emitting diode, and wherein said second electric terminal of each light-emitting diode is electrically coupled to connection gasket corresponding in a plurality of conducting connecting parts.
4. light emission diode package member according to claim 1 is characterized in that, said plastic casing comprises the square or rectangular chamber with 0.5mm degree of depth.
5. light emission diode package member according to claim 1 is characterized in that, each in the said conductive chip carrier all supports single light-emitting diode, and said light-emitting diode independently sends ruddiness, green glow or blue light.
6. light emission diode package member according to claim 1; Further comprise a plurality of conducting connecting parts with said a plurality of conductive chip carrier separating; Each conductive chip carrier has upper surface, lower surface and is positioned at the chip bearing pad on the upper surface; Each conducting connecting part has upper surface, lower surface and is positioned at the connection gasket on the upper surface, it is characterized in that, second electric terminal of each is electrically coupled to the connection gasket of corresponding conducting connecting part in said a plurality of light-emitting diodes through independent bonding wire.
7. light emission diode package member according to claim 6 is characterized in that, the lower surface of the lower surface of each said conducting connecting part and each said conductive chip carrier all has the pad area that 0.4mm takes advantage of 0.7mm.
8. light emission diode package member according to claim 1 is characterized in that said plastic casing comprises thermoplastics.
9. light emission diode package member according to claim 8 is characterized in that, said plastic casing comprises a kind of in white polyphthalamide or the black polyphthalamide.
10. light emitting diode indicator comprises:
Carry the substrate of the surface mounted device array of arranging with the form of vertical row and horizontal line, each in the said surface mounted device all comprises:
Lead frame comprises a plurality of conductive chip carriers;
Be arranged in said a plurality of conductive chip carrier the light-emitting diode on each, said a plurality of light-emitting diodes are configured to switch on so that produce FR color and limit a pixel of said display with the mode of combination;
Lens cover said lead frame at least in part; With
Housing, it holds said lead frame at least in part,
And
Signal processing and LED driving circuit, it is electrically connected with optionally the array energising of surface mounted device,
It is characterized in that, each pixel of said display have 2.8mm or more the Theravada with 2.8mm or littler size.
11. a light emission diode package member comprises:
Lead frame comprises a plurality of conductive chip carriers;
Be arranged in said a plurality of conductive chip carrier the light-emitting diode on each;
Lens cover said lead frame at least in part; And
Hold the polymeric shells of said lead frame at least in part, said polymeric shells comprises: relative, have first first type surface and second first type surface of height distance therebetween; Relative, have a side surface of width distance therebetween; With relative, have the end face of length distance therebetween, it is characterized in that said height distance, said width distance and said length distance are all less than 2.6mm.
12. light emission diode package member according to claim 11; It is characterized in that; Said housing holds said lead frame at least in part and defines a chamber; Said chamber extends to the inside of said housing from the bottom surface of said first first type surface to said chamber, and the ratio of the area of the area of said chamber bottom surface and said first type surface is at least 35%.
13. light emission diode package member according to claim 11 comprises red light emitting diodes wafer, green LED wafer and blue LED wafer.
14. light emission diode package member according to claim 11; It is characterized in that; Said housing holds said lead frame at least in part and defines a chamber; Said chamber extends to the inside of said housing from said first first type surface to the bottom surface of said chamber, and each conductive chip carrier has and extended the length of chamber bottom surface length more than at least 1/2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201898860U CN202282348U (en) | 2011-05-27 | 2011-05-27 | LED package and LED display |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201898860U CN202282348U (en) | 2011-05-27 | 2011-05-27 | LED package and LED display |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012201614204U Division CN202871786U (en) | 2011-03-02 | 2011-05-27 | Light emitting diode package and light emitting diode display |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202282348U true CN202282348U (en) | 2012-06-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011201898860U Expired - Lifetime CN202282348U (en) | 2011-05-27 | 2011-05-27 | LED package and LED display |
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| Country | Link |
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| CN (1) | CN202282348U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108321149A (en) * | 2017-01-18 | 2018-07-24 | 惠州科锐半导体照明有限公司 | Light emission diode package member and light emitting diode indicator |
| CN113078253A (en) * | 2021-04-01 | 2021-07-06 | 淄博职业学院 | Art exhibition lighting device |
-
2011
- 2011-05-27 CN CN2011201898860U patent/CN202282348U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108321149A (en) * | 2017-01-18 | 2018-07-24 | 惠州科锐半导体照明有限公司 | Light emission diode package member and light emitting diode indicator |
| CN108321149B (en) * | 2017-01-18 | 2022-08-26 | 惠州科锐半导体照明有限公司 | Light emitting diode package and light emitting diode display |
| CN113078253A (en) * | 2021-04-01 | 2021-07-06 | 淄博职业学院 | Art exhibition lighting device |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CU01 | Correction of utility model |
Correction item: Priority information Correct: PCT/CN2011/000335 2011.03.02 CN Number: 25 Page: The title page Volume: 29 |
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| CU03 | Publication of corrected utility model |
Correction item: Priority information Correct: You Number: 25 Volume: 28 |
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Free format text: CORRECT: PRIORITY INFORMATION; FROM: NONE TO: BE |
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