CN202246865U - Gold cylinder of surface processing chemical nickel gold production mechanism - Google Patents
Gold cylinder of surface processing chemical nickel gold production mechanism Download PDFInfo
- Publication number
- CN202246865U CN202246865U CN2011202802738U CN201120280273U CN202246865U CN 202246865 U CN202246865 U CN 202246865U CN 2011202802738 U CN2011202802738 U CN 2011202802738U CN 201120280273 U CN201120280273 U CN 201120280273U CN 202246865 U CN202246865 U CN 202246865U
- Authority
- CN
- China
- Prior art keywords
- gold
- cylinder
- golden
- chemical nickel
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Abstract
The utility model provides a gold cylinder of a surface processing chemical nickel gold production mechanism, wherein the gold cylinder comprises a gold immersion cylinder and a gold recycling cylinder which are arranged continuously. The arranged gold recycling cylinder can be used for cleaning a circuit board, and liquids containing gold stained by the circuit board are reserved and can be recycled after being extracted. According to the utility model, the problem of resource waste can be solved effectively, and the production cost is also lowered.
Description
Technical field
The utility model relates to PCB production unit field, is specifically related to the golden cylinder of a kind of surface treatment chemical nickel and gold production mechanism.
Background technology
Domestic PC B board production enterprise adopts electric golden production line to carry out the surface treatment work of circuit card mostly at present, and promptly the re-plating last layer is golden after the PCB surface conductor is electroplated last layer nickel earlier, and nickel plating mainly is the diffusion that prevents between gold and the copper.This working method cost is higher relatively, and resulting resultant metal low in glossiness, planeness is not high, and brightness is not high, and weldability is poor.And, be the compound that plates one deck nickel and phosphorus through chemical reaction on the surface of copper earlier, and then plate one deck gold on the surface of nickel through replacement(metathesis)reaction by the change gold method that the golden method of electricity is amplified out; It is low to change golden cost, and resulting resultant metal is glossy, and uniformity coefficient is high; Good planeness; Weldability is good, and easy to operate, so the first-selection of the many enterprise reforms of cost.Because the improvement of production technique, corresponding production equipment also need significantly be adjusted.
The utility model content
To the problem that exists in the above prior art, the utility model provides a kind of golden cylinder that soaks the effective surface treatment chemical nickel and gold production mechanism of gold.
The utility model is realized through following technical scheme:
The golden cylinder of surface treatment chemical nickel and gold production mechanism, said golden cylinder comprise that soaking golden cylinder reclaims cylinder with gold, and both are provided with continuously.
The beneficial effect of the utility model is: soak golden operation when circuit card places golden cylinder; Except be plated on the gold of circuit board surface through replacement(metathesis)reaction; Circuit card self is stained with in the liquid of band and is also contained a spot of gold; If do not reclaim, then the gold in the liquid can participate in washing and running off along with circuit card, causes the waste of resource and the increase of cost.The gold that the utility model is provided with reclaims cylinder, promptly is through the cleaning to circuit card, circuit card is stained with containing of band golden liquid retention gets off, and extracts that the back is recyclable to be utilized again.Can solve wasting of resources problem effectively, also reduce production cost.
Description of drawings
Fig. 1 is the structural representation of the utility model.
Among the figure: 1 for soaking golden cylinder; 2 is that gold reclaims cylinder.
Embodiment
Below in conjunction with accompanying drawing and embodiment the utility model is explained further details.
The utility model provides the golden cylinder of a kind of surface treatment chemical nickel and gold production mechanism, comprises that soaking golden cylinder 1 reclaims cylinder 2 with gold, and both are provided with continuously.
The purpose that is provided with of the utility model is; Soak golden cylinder 1 and soak golden operation when circuit card places; Except being plated on the gold of circuit board surface through replacement(metathesis)reaction, circuit card self is stained with in the liquid of band and is also contained a spot of gold, if do not reclaim; Then the gold in the liquid can participate in washing and running off along with circuit card, causes the waste of resource and the increase of cost.The gold that the utility model is provided with reclaims cylinder 2, promptly is through the cleaning to circuit card, circuit card is stained with containing of band golden liquid retention gets off, and extracts that the back is recyclable to be utilized again.Can solve wasting of resources problem effectively, also reduce production cost.
Claims (1)
1. the golden cylinder of surface treatment chemical nickel and gold production mechanism is characterized in that said golden cylinder comprises that soaking golden cylinder reclaims cylinder with gold, and both are provided with continuously.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011202802738U CN202246865U (en) | 2011-08-03 | 2011-08-03 | Gold cylinder of surface processing chemical nickel gold production mechanism |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011202802738U CN202246865U (en) | 2011-08-03 | 2011-08-03 | Gold cylinder of surface processing chemical nickel gold production mechanism |
Publications (1)
Publication Number | Publication Date |
---|---|
CN202246865U true CN202246865U (en) | 2012-05-30 |
Family
ID=46108135
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2011202802738U Expired - Fee Related CN202246865U (en) | 2011-08-03 | 2011-08-03 | Gold cylinder of surface processing chemical nickel gold production mechanism |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN202246865U (en) |
-
2011
- 2011-08-03 CN CN2011202802738U patent/CN202246865U/en not_active Expired - Fee Related
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102605400B (en) | Steel strip continuous copper plating process | |
CN203007451U (en) | Electrolytic copper foil forming machine provided with water squeezing roller and liquid squeezing roller | |
CN109267130A (en) | The electroplating system and electro-plating method of diamond cutting secant | |
CN107287582B (en) | A kind of chemical plating stannum copper wire and preparation method thereof | |
CN101815405A (en) | Nickel-less immersion gold electric gold thickening process for printed circuit board | |
CN206498004U (en) | Mancarried electronic aid charging inlet corrosion-resistant coating structure | |
CN103233250B (en) | A kind of thick layer gold gold finger galvanizing method | |
CN103481583A (en) | Treated copper foil with porous structure on surface and preparation method thereof | |
CN202246865U (en) | Gold cylinder of surface processing chemical nickel gold production mechanism | |
CN202705522U (en) | Spot plating device | |
CN205000002U (en) | Perpendicular continuous electroplating equipment of moduleization | |
CN204982071U (en) | Waste cupric liquor copper recovery device | |
CN204634170U (en) | A kind of printed circuit board (PCB) sinks nickeline processing unit | |
CN200985363Y (en) | Electroplating liquid container | |
CN203128684U (en) | Continuous composite plating sand overlying slot of diamond cutting line | |
CN102703885B (en) | Gold plating process for PCB (Printed Circuit Board) | |
CN204539632U (en) | A kind of high-quality pcb boardization gold production line | |
CN105386100A (en) | Method for electroplating copper and sliver on iron-nickel alloy frame | |
CN215121324U (en) | PCB consent copper thick liquid structure of environmental protection saving | |
CN105442004B (en) | A kind of porous surface metal structure and preparation method thereof is with inlaying electroplanting device | |
CN104294331A (en) | Pretreatment method of gravure copper plating | |
CN103898595A (en) | Continuous composite plating sand overlying tank for diamond cutting line | |
CN203333803U (en) | Adjustable insoluble anode device | |
Ru | Technical study on the treatment of PCB production waste liquid and copper extraction | |
CN202246860U (en) | Producing mechanism for surface treating electroless nickel immersion gold |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120530 Termination date: 20140803 |
|
EXPY | Termination of patent right or utility model |