CN202231009U - Novel fluorescent powder-free dual wavelength blended white-light LED encapsulation - Google Patents

Novel fluorescent powder-free dual wavelength blended white-light LED encapsulation Download PDF

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Publication number
CN202231009U
CN202231009U CN2011203804482U CN201120380448U CN202231009U CN 202231009 U CN202231009 U CN 202231009U CN 2011203804482 U CN2011203804482 U CN 2011203804482U CN 201120380448 U CN201120380448 U CN 201120380448U CN 202231009 U CN202231009 U CN 202231009U
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CN
China
Prior art keywords
led chip
electrode
ceramics bracket
chip group
ceramic bracket
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2011203804482U
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Chinese (zh)
Inventor
张小海
张理诺
刘三林
于金冰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZHEJIANG JINGSHEN MICROELECTRONIC TECHNOLOGY CO LTD
Original Assignee
ZHEJIANG JINGSHEN MICROELECTRONIC TECHNOLOGY CO LTD
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by ZHEJIANG JINGSHEN MICROELECTRONIC TECHNOLOGY CO LTD filed Critical ZHEJIANG JINGSHEN MICROELECTRONIC TECHNOLOGY CO LTD
Priority to CN2011203804482U priority Critical patent/CN202231009U/en
Application granted granted Critical
Publication of CN202231009U publication Critical patent/CN202231009U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

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  • Led Device Packages (AREA)

Abstract

The utility model provides a novel fluorescent powder-free dual wavelength blended white-light LED encapsulation, which has a simple structure and convenience in control, and comprises a ceramic bracket, electrodes, a focusing lens, aglets and an LED chip group, wherein a groove is formed on the top surface of the ceramic bracket, and the bottom surface of the ceramic bracket is horizontal; the LED chip group comprises a blue light LED chip and a yellow-green light LED chip symmetrically mounted in the center of the groove on the ceramic bracket; each electrode is provided with a top part, a lateral part and a bottom part, the top part of the electrode is inserted into the middle part of the ceramic bracket and jointed and propped against the grooved bottom surface of the ceramic bracket, and the lateral part and the bottom part of the electrode are respectively jointed and propped against the lateral surface and the bottom surface of the ceramic bracket; the two ends of each aglet are respectively linked to the LED chip group and the top part of corresponding electrode; and the focusing lens is positioned on the top surface of the ceramic bracket and wraps the LED chip group.

Description

Exempt from the mixed white light LEDs encapsulation of fluorescent material dual wavelength
Technical field
The utility model relates to the white light LEDs encapsulation, and the led chip that especially relates to combination RGB mode forms the LED encapsulation of white light.
Background technology
Current prior art is used led chip to produce white light and is mainly contained three kinds of modes: blue-ray LED+yellow phosphor powder of 1. using wavelength 410nm; 2. use the ultraviolet light+RGB phosphor powder of wavelength between 365~460nm; 3. with three chips of combination RGB.The 1. the kind mode be the main flow of current white light LEDs, the high volume production of efficient is convenient, but processing procedure is complicated; The color quality consistency is poor; 2. in the kind mode, and encapsulating material receives the easy deterioration of ultraviolet radiation, and 1. 2. the fluorescent material life-span in the mode is lower than led chip; 3. to plant the mode photochromic effect best, but control circuit is complicated.
Summary of the invention
What the utility model provided a kind of novelty exempts from fluorescent material dual wavelength white light LEDs encapsulation, has simple in structure and controls characteristics easily.
The mixed white light LEDs of fluorescent material dual wavelength of exempting from that the utility model provides encapsulates; Comprise ceramics bracket, electrode, condenser lens, gold thread and led chip group; The end face of ceramics bracket has groove; The bottom surface level of ceramics bracket, led chip group comprise that symmetry is installed in the blue-light LED chip and the green-yellow light led chip of the groove central authorities of ceramics bracket, and electrode has top, sidepiece and bottom; The top of electrode is plugged in the ceramics bracket middle part and fits and is connected on the groove floor of ceramics bracket; Side and the bottom surface fitted respectively and abut to ceramics bracket in the sidepiece of electrode and bottom, the gold thread two ends connect led chip group and top of electrodes respectively, and condenser lens is positioned at the end face of ceramics bracket and envelopes the led chip group.
Blue-light LED chip and green-yellow light led chip form the mixed white light of dual wavelength, need not do the phosphor powder allotment, and drives control ratio RGB primitive colours LED is easy, and the briliancy, wavelength, the color rendering that obtain, can freely adjust within the specific limits.Because of white light is to be made up of blue light, green-yellow light; Therefore the flexible color that can do beyond the white is luminous; Concrete grammar is the wavelength of control water colour system and bluish-green colour system, and the tone that obtains is according to this compared and used the led chip of phosphor powder purer, is fit to very much colourity is required very harsh LCD module use backlight; The high briliancy white light LEDs that adds yellow phosphor powder with blue-ray LED compares; The briliancy of novel dual-wavelength white light LEDs is also not a halfpenny the worse, and it is that to add green-yellow light by blue light mixed, does not almost have the puzzlement of ruddiness lavatory light.The design of applied ceramics bracket and electrode simultaneously has the little advantage of thermal stress that heat conduction is fast and encapsulate the back product.
The mixed white light LEDs of fluorescent material dual wavelength of exempting from that the utility model further provides encapsulates; Big up and small down horn-like of the end face groove of its ceramics bracket; Trumpet-shaped groove can help extracting the ejaculation light of the led chip group of groove floor, makes that the white light of output is more even.
Below in conjunction with accompanying drawing and embodiment the utility model is done further explain.
Description of drawings
Fig. 1 is the structural representation of exempting from the mixed white light LEDs encapsulation of fluorescent material dual wavelength embodiment of the utility model.
Fig. 2 is the schematic top plan view of Fig. 1.
Embodiment
Like Fig. 1, shown in Figure 2; The mixed white light LEDs of fluorescent material dual wavelength of exempting from of the utility model encapsulates embodiment; Comprise ceramics bracket 1, electrode 2, condenser lens 3, gold thread 4 and led chip group; Use the support of ceramic material to have good, the thermoelectric separation of heat conduction, the coefficient of expansion and semiconductor chip is close, thermal stress is little advantage, the end face of ceramics bracket 1 has groove 5, big up and small down horn-like of the groove of present embodiment 5; Extraction when helping the light ejaculation; The bottom surface level of ceramics bracket 1, led chip group comprise that symmetry is installed in the blue-light LED chip 6 and the green-yellow light led chip 7 of groove 5 central authorities of ceramics bracket, and electrode 2 has top 21, sidepiece 22 and bottom 23; The top 21 of electrode 2 is plugged in ceramics bracket 1 middle part and fits and is connected on groove 5 bottom surfaces of ceramics bracket; Fit respectively and abut to the side and the bottom surface of ceramics bracket in the sidepiece 22 and the bottom 23 of electrode 2, gold thread 4 two ends connect led chip group and top of electrodes 21 respectively, and condenser lens 3 is positioned at the end face of ceramics bracket and envelopes the led chip group.The junction temperature that the led chip group produces is transmitted to ceramics bracket 1, dispels the heat for MCPCB (operplate printing circuit board) through large tracts of land bottom 23 conduction of electrode 2 then, and ceramics bracket 1 is thin, and thermally conductive pathways is short, and it is fast to conduct heat.The briliancy of dual wavelength led chip, Wavelength distribution are different, must carry out the adjustment of current value limit value, offer the electric current of blue-light LED chip 6 and green-yellow light led chip 7 through control, just can mix pure tone flexibly.

Claims (2)

1. exempt from the mixed white light LEDs encapsulation of fluorescent material dual wavelength for one kind; It is characterized in that: comprise ceramics bracket (1), electrode (2), condenser lens (3), gold thread (4) and led chip group; The end face of said ceramics bracket (1) has groove (5); The bottom surface level of said ceramics bracket (1); Said led chip group comprises that symmetry is installed in the blue-light LED chip (6) and the green-yellow light led chip (7) of the groove of ceramics bracket (5) central authorities; Said electrode (2) has top (21), sidepiece (22) and bottom (23), and the top (21) of said electrode (2) is plugged in ceramics bracket (1) middle part and fits and is connected on groove (5) bottom surface of ceramics bracket, fits respectively and abut to the side and the bottom surface of ceramics bracket in the sidepiece (22) of said electrode (2) and bottom (23); Said gold thread (4) two ends connect led chip group and top of electrodes (21) respectively, and said condenser lens (3) is positioned at the end face of ceramics bracket and envelopes the led chip group.
2. according to claim 1ly exempt from the mixed white light LEDs encapsulation of fluorescent material dual wavelength, it is characterized in that: big up and small down horn-like of the end face groove (5) of said ceramics bracket.
CN2011203804482U 2011-09-30 2011-09-30 Novel fluorescent powder-free dual wavelength blended white-light LED encapsulation Expired - Fee Related CN202231009U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2011203804482U CN202231009U (en) 2011-09-30 2011-09-30 Novel fluorescent powder-free dual wavelength blended white-light LED encapsulation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011203804482U CN202231009U (en) 2011-09-30 2011-09-30 Novel fluorescent powder-free dual wavelength blended white-light LED encapsulation

Publications (1)

Publication Number Publication Date
CN202231009U true CN202231009U (en) 2012-05-23

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011203804482U Expired - Fee Related CN202231009U (en) 2011-09-30 2011-09-30 Novel fluorescent powder-free dual wavelength blended white-light LED encapsulation

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CN (1) CN202231009U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104659185A (en) * 2015-02-09 2015-05-27 上海三思电子工程有限公司 LED light emitting device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104659185A (en) * 2015-02-09 2015-05-27 上海三思电子工程有限公司 LED light emitting device

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GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20120523

Termination date: 20130930