CN202212650U - Diamond saw blade - Google Patents
Diamond saw blade Download PDFInfo
- Publication number
- CN202212650U CN202212650U CN2011202586438U CN201120258643U CN202212650U CN 202212650 U CN202212650 U CN 202212650U CN 2011202586438 U CN2011202586438 U CN 2011202586438U CN 201120258643 U CN201120258643 U CN 201120258643U CN 202212650 U CN202212650 U CN 202212650U
- Authority
- CN
- China
- Prior art keywords
- saw blade
- toothed segment
- diamond
- diamond saw
- matrix
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
Abstract
The utility model relates to a diamond saw blade, comprising a saw blade body. The periphery of the saw blade body is provided with multiple sawtooth sections, among which chip accommodating grooves are arranged. The diamond saw blade is characterized in that each sawtooth section has wave-shaped saw teeth, and the surface of each saw tooth is provided with a diamond abrasive grain layer. The diamond saw blade of the utility model has the advantages of high cutting efficiency and long service lifetime, and can be applied to cut concretes, asphalts, stones, ductile cast irons, ceramics, tiles, glass, stainless steels, coppers and other materials.
Description
Technical field
The utility model relates to a kind of cutting tool; More particularly, the utility model relates to a kind of diamond saw blade.The diamond saw blade that the utility model relates to is mainly used in the cutting of materials such as concrete, pitch, stone material, nodular cast iron, pottery, ceramic tile, glass, stainless steel, copper material.
Background technology
Method for brazing make diamond tool be by high temperature brazing make that active element in the solder dissolves on diamond abrasive grain and metallic matrix interface, the interaction of diffusion, chemical combination and so on; Thereby improve the cohesive force of matrix, improve the bond strength between abrasive material, bond (brazing filler metal alloy), the matrix three diamond abrasive grain.Its structure generally comprises metallic matrix and diamond abrasive grain, and the week of metallic matrix, the diamond abrasive grain soldering was on metallic matrix and the corresponding both ends of the surface of teeth groove along offering tank.This braze welding diamond saw blade has solved the not enough problem of superhard abrading agent hold on the instrument, also brings new problem simultaneously: because the face of diamond brazing saw blade bond diamond is merely the saw blade outer circumference surface; Therefore, matrix is not ideal enough to the hold of diamond abrasive grain, and the exposed of diamond abrasive grain highly is restricted; Thereby influence efficient, the diamond abrasive grain of participating in grinding simultaneously is too much, behind the abrasive particle blunt; Cause should not come off with the bond bond strength, increases with the processing object contact area, and instrument is difficult to provide the pressure of appropriateness to exercise effective grinding; And cut efficient and reduce, if the diamond quantity that the minimizing instrument shows, though cutting force is little; Cutting efficiency is high, but the life-span reduces.
Summary of the invention
The purpose of the utility model is to overcome above-mentioned deficiency, and the braze welding diamond saw blade of a kind of cutting efficiency height, long service life is provided.
The purpose of the utility model is achieved in that a kind of diamond saw blade; Comprise saw bit matrix; The saw bit matrix edge is provided with a plurality of toothed segment; Be provided with chip pocket between each toothed segment, it is characterized in that all having corrugated sawtooth on each toothed segment, and described serrated surface be provided with the diamond abrasive grain layer.
Wherein, described waveform sawtooth is meant the circular arc sawtooth of continuous fluctuating.
Preferably, said saw bit matrix edge is provided with 4-20 toothed segment; More preferably, said saw bit matrix edge is provided with 6 toothed segment.
Preferably, have 3-15 jagged peaks on described each toothed segment; More preferably, described jagged peaks is 5.
Preferably, the inclination angle between adjacent two toothed segment is 15-90 °; More preferably, described inclination angle is 45-75 °; Most preferably, described inclination angle is 60 °.
Preferably, also be provided with louvre on the described toothed segment; The number of louvre is 2-14 on each toothed segment; Preferably, the number of louvre is 4 on each toothed segment.
Preferably, described chip pocket has the bottom and the polygon open ports of U-shaped.
Preferably, described matrix is the fan-shaped of discoid or strip.More preferably, discoid matrix center is provided with axis hole.
Preferably, the diameter of described saw blade is 50-1000mm; Preferably, the diameter of described saw blade is 105-600mm.
Preferably, the diameter of described louvre is 2-20mm; Preferably, the diameter of described louvre is 3mm.
Preferably, described diamond abrasive grain can be arranged on the toothed segment of matrix through soldering, plating, method for laser welding etc.
The diamond saw blade of the utility model is when the cutting grinding; The diamond abrasive grain of inclined working peak is started working earlier; Each diamond abrasive grain of back progressively adds work; Making has multi-layer diamond participation cutting on the diamond saw blade, thereby can realize continuing the purpose of cutting, has improved the effect of cutting; And the initial contact area during owing to diamond work is less, can reduce to cut resistance, thereby can improve adamantine service life.
The beneficial effect of the utility model is:
1, diamond abrasive grain and saw bit matrix edge junction are made a concerted effort greatly, can not cause that in the heavier processing of load abrasive material comes off too early and causes waste.
2, the chip pocket of the edge special construction of each toothed segment, chip space is bigger; Resistance is little when grinding, chip removal is unobstructed for the sawtooth of waveform design, has improved the processing characteristics and the service life of instrument.
3, the thickness of saw blade can be designed to flake structure, can practice thrift diamond, practices thrift and is cut material, can also reduce power consumption, thereby practice thrift electric energy, has reduced production cost.
Description of drawings
Fig. 1 is the floor map of the diamond circular saw film base body of an embodiment of the utility model.
Fig. 2 is the toothed segment floor map that has diamond abrasive grain of an embodiment of the utility model.
The specific embodiment
Following the present invention will combine accompanying drawing and concrete embodiment that the utility model is done further explanation and explanation.The applicant is that embodiment and accompanying drawing only are in order to further specify technical scheme of the present invention, must not it to be interpreted as the restriction to the invention protection domain what this need declare.
Referring to Fig. 1-2, Fig. 1 is the floor map of the diamond circular saw film base body of an embodiment of the utility model.Fig. 2 is the toothed segment floor map that has diamond abrasive grain of an embodiment of the utility model.Can find out that by Fig. 1-2 the diamond saw blade of present embodiment comprises discoid saw bit matrix 1; The saw bit matrix edge is evenly distributed with 6 toothed segment 2, is provided with chip pocket 4 between each toothed segment, all has corrugated sawtooth on each toothed segment; Wherein the number of jagged peaks 5 is 5; Also be provided with louvre 6 on each toothed segment in addition, the number of louvre 6 is 4 on each toothed segment, and the diameter of louvre is 3mm; Described sawtooth is provided with diamond abrasive grain 3; Inclination angle 11 between two adjacent toothed segment is 60 °; Discoid matrix 1 center is provided with axis hole 7.As shown in Figure 2, described diamond abrasive grain 3 can be arranged on the toothed segment 2 of matrix through soldering, plating, method for laser welding etc.
The above; Be merely the preferred embodiment of the utility model; Can not be interpreted as with this and limit scope of the present invention, the embodiment of all distortion of in claims of the present invention require the scope of protection, being made that is equal to and change is all in the scope that the present invention requires to protect.
Claims (10)
1. diamond saw blade; Comprise saw bit matrix, the saw bit matrix edge is provided with a plurality of toothed segment, is provided with chip pocket between each toothed segment; It is characterized in that all having corrugated sawtooth on each toothed segment, and described serrated surface is provided with the diamond abrasive grain layer.
2. diamond saw blade as claimed in claim 1 is characterized in that described saw bit matrix edge is provided with 4-20 toothed segment.
3. diamond saw blade as claimed in claim 2 is characterised in that described saw bit matrix edge is provided with 6 toothed segment.
4. diamond saw blade as claimed in claim 1 is characterised in that to have 3-15 sawtooth cutting edge of a knife or a sword on described each toothed segment.
5. diamond saw blade as claimed in claim 4 is characterised in that to have 5 jagged peaks on described each toothed segment.
6. diamond saw blade as claimed in claim 1 is characterised in that the inclination angle between adjacent two toothed segment is 15-90 °.
7. diamond saw blade as claimed in claim 6 is characterised in that the inclination angle between adjacent two toothed segment is 60 °.
8. diamond saw blade as claimed in claim 5 be characterised in that also to be provided with louvre on the described toothed segment, and the number of louvre is 4 on each toothed segment.
9. like each described diamond saw blade of claim 1-8, be characterised in that described matrix is discoid, and discoid matrix center is provided with axis hole.
10. diamond saw blade as claimed in claim 1 is characterised in that described diamond abrasive grain can be arranged on the toothed segment of matrix through soldering, plating or method for laser welding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202586438U CN202212650U (en) | 2011-07-21 | 2011-07-21 | Diamond saw blade |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202586438U CN202212650U (en) | 2011-07-21 | 2011-07-21 | Diamond saw blade |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202212650U true CN202212650U (en) | 2012-05-09 |
Family
ID=46011920
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011202586438U Expired - Fee Related CN202212650U (en) | 2011-07-21 | 2011-07-21 | Diamond saw blade |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202212650U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107379278A (en) * | 2017-08-22 | 2017-11-24 | 李刚 | Molten plating diamond saw blade and preparation method thereof |
| CN117161477A (en) * | 2023-10-31 | 2023-12-05 | 临沂友诚制锯技术服务有限公司 | Circular arc light path sawtooth processing technology |
-
2011
- 2011-07-21 CN CN2011202586438U patent/CN202212650U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107379278A (en) * | 2017-08-22 | 2017-11-24 | 李刚 | Molten plating diamond saw blade and preparation method thereof |
| CN117161477A (en) * | 2023-10-31 | 2023-12-05 | 临沂友诚制锯技术服务有限公司 | Circular arc light path sawtooth processing technology |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201511179U (en) | Diamond brazed saw blade | |
| JP3714922B2 (en) | Diamond tools | |
| US4637370A (en) | Rotary saw blade | |
| CN103506964A (en) | Modified diamond abrasive tool and manufacturing method thereof | |
| CA2597284C (en) | Diamond tool | |
| CN202079511U (en) | Diamond saw blade with abrasives directionally arranged in multiple layers | |
| CN201592290U (en) | Diamond brazing saw blade | |
| CN202212650U (en) | Diamond saw blade | |
| CN202029248U (en) | Circular saw blade brazed with single layer interlaced arrangement diamond, for sawing crisp and hard material | |
| CN206185712U (en) | Superhard abrasive material instrument | |
| CN102975292A (en) | Multi-layer soldering diamond string bead | |
| CN102225536A (en) | Diamond saw blade with abrasives under multi-layer orientation arrangement | |
| CN201712070U (en) | Thin brazed multilayer diamond saw blade | |
| CN1260054C (en) | Diamond tool bit and saw blade thereof | |
| CN102259391A (en) | Soldering diamond saw blade | |
| CN205200700U (en) | Ultra -thin saw bit of brazing | |
| CN206519622U (en) | A kind of special circular saw blade of hard alloy | |
| WO2008119298A1 (en) | Newfashioned brazing-sintering diamond tool segment | |
| CN201261232Y (en) | Sparse serration brazing diamond tool block | |
| CN204736339U (en) | Diamond saw strip | |
| JP2008142795A (en) | Saw blade | |
| CN107351265A (en) | Two-sided leaf-teeth dry chip | |
| CN202412488U (en) | Stainless steel band saw blade with alternately arranged large and small emery saw teeth | |
| CN201036898Y (en) | Cutting soft stone saw bit substrate | |
| CN211104845U (en) | Diamond saw blade capable of preventing diamond from falling off too early |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120509 Termination date: 20170721 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |