CN202205723U - 蚀刻装置 - Google Patents
蚀刻装置 Download PDFInfo
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- CN202205723U CN202205723U CN2011203351463U CN201120335146U CN202205723U CN 202205723 U CN202205723 U CN 202205723U CN 2011203351463 U CN2011203351463 U CN 2011203351463U CN 201120335146 U CN201120335146 U CN 201120335146U CN 202205723 U CN202205723 U CN 202205723U
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CN2011203351463U CN202205723U (zh) | 2011-09-07 | 2011-09-07 | 蚀刻装置 |
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CN2011203351463U CN202205723U (zh) | 2011-09-07 | 2011-09-07 | 蚀刻装置 |
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CN202205723U true CN202205723U (zh) | 2012-04-25 |
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CN2011203351463U Expired - Fee Related CN202205723U (zh) | 2011-09-07 | 2011-09-07 | 蚀刻装置 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103149344A (zh) * | 2013-03-08 | 2013-06-12 | 兰州大学 | 板层组合式毛细水上升试验柱 |
CN108598016A (zh) * | 2018-03-15 | 2018-09-28 | 福建省福联集成电路有限公司 | 一种均匀场流的蚀刻装置 |
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2011
- 2011-09-07 CN CN2011203351463U patent/CN202205723U/zh not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103149344A (zh) * | 2013-03-08 | 2013-06-12 | 兰州大学 | 板层组合式毛细水上升试验柱 |
CN103149344B (zh) * | 2013-03-08 | 2014-12-31 | 兰州大学 | 板层组合式毛细水上升试验柱 |
CN108598016A (zh) * | 2018-03-15 | 2018-09-28 | 福建省福联集成电路有限公司 | 一种均匀场流的蚀刻装置 |
CN108598016B (zh) * | 2018-03-15 | 2024-01-23 | 福建省福联集成电路有限公司 | 一种均匀场流的蚀刻装置 |
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Free format text: FORMER OWNER: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION Effective date: 20130422 |
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C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201203 PUDONG NEW AREA, SHANGHAI TO: 100176 DAXING, BEIJING |
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TR01 | Transfer of patent right |
Effective date of registration: 20130422 Address after: 100176 No. 18, Wenchang Avenue, Beijing economic and Technological Development Zone, Beijing Patentee after: Semiconductor Manufacturing International (Beijing) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120425 Termination date: 20180907 |
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CF01 | Termination of patent right due to non-payment of annual fee |