CN202200625U - Laminating, plate-arranging and positioning combined structure of metal substrate - Google Patents
Laminating, plate-arranging and positioning combined structure of metal substrate Download PDFInfo
- Publication number
- CN202200625U CN202200625U CN 201120280611 CN201120280611U CN202200625U CN 202200625 U CN202200625 U CN 202200625U CN 201120280611 CN201120280611 CN 201120280611 CN 201120280611 U CN201120280611 U CN 201120280611U CN 202200625 U CN202200625 U CN 202200625U
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- CN
- China
- Prior art keywords
- pin
- locating hole
- pin section
- pcb board
- metal substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility model provides a laminating, plate-arranging and positioning combined structure of a metal substrate, comprising a PCB board, a metal backboard, and a T-shaped pin which is connected between the PCB board and the metal backboard, wherein a first positioning hole is arranged on the PCB board; a second positioning hole is arranged on the metal backboard; the aperture of the first positioning hole is not equal to that of the second positioning hole. The T-shaped pin comprises a first pin section and a second pin section which are connected with each other and the diameters of the first pin section and the second pin section are not equal, and the first pin section and the second pin section are arranged in the first positioning hole and the second positioning hole, respectively. The laminating, plate-arranging and positioning combined structure of metal substrate of the utility model replaces present common linear pin with the T-shaped pin of which the diameters of two pin sections are not consistent, realizes accurately positioning of stitching of the PCB board and the metal back board of which the apertures are not consistent, and simultaneously provides a solution for assembling of two fittings of which the apertures of the positioning holes are not consistent.
Description
Technical field
The utility model relates to a kind of location combining structure, relates in particular to a kind of metal substrate layer pressure plate location combining structure.
Background technology
During the pressing of metal current substrate, PCB and metal backing row plate adopt linear pattern pin location, and for inconsistent metal backing of pore size and PCB pressing row plate location, the linear pattern pin can not effectively be located PCB and metal backing.
Therefore, be necessary existing pin is improved, to overcome the above-mentioned problem that exists.
The utility model content
The purpose of the utility model is to provide a kind of metal substrate layer pressure plate location combining structure; Adopt the inconsistent T font pin of two pin section diameters to replace conventional at present linear pattern pin, the accurate location of realizing inconsistent PCB in aperture and metal backing pressing.
For realizing above-mentioned purpose; The utility model provides a kind of metal substrate layer pressure plate location combining structure; Comprise: pcb board, metal backing and be connected pcb board and metal backing between T font pin; This pcb board is provided with first locating hole, and metal backing is provided with second locating hole, and the first locating hole aperture and the second locating hole aperture are unequal; This T font pin comprises and interconnects and the unequal first pin section of diameter and the second pin section the first pin section and second pin section corresponding respectively being installed in first locating hole and second locating hole.
Also comprise bonding sheet, this bonding sheet is located between pcb board and the metal backing.
The said first locating hole aperture is greater than the second locating hole aperture, and the first pin section diameter is greater than the second pin section diameter.
The said first locating hole aperture is less than the second locating hole aperture, and the first pin section diameter is less than the second pin section diameter.
The first pin section all is the rounding horn shape with the end of the opposing end of the second pin section.
The beneficial effect of the utility model: the metal substrate layer pressure plate location combining structure of the utility model; Adopt the inconsistent T font pin of two pin section diameters to replace conventional at present linear pattern pin; Realize the accurate location of inconsistent pcb board in aperture and metal backing pressing, also solution is provided simultaneously for the assembling of the inconsistent two kinds of accessories in locating hole aperture.
In order further to understand the characteristic and the technology contents of the utility model, see also following detailed description and accompanying drawing, yet accompanying drawing only provides reference and explanation usefulness, is not to be used for the utility model is limited about the utility model.
Description of drawings
Below in conjunction with accompanying drawing, describe in detail through the specific embodiment the utility model, the technical scheme that makes the utility model and other beneficial effect is obvious.
In the accompanying drawing,
Fig. 1 is the structural representation of the utility model metal substrate layer pressure plate location combining structure.
The specific embodiment
With reference to shown in Figure 1; The metal substrate layer pressure plate location combining structure of the utility model one embodiment; Comprise: pcb board 10, metal backing 20 and be connected pcb board 10 and the T font of 20 of metal backings pin 30 also comprise the bonding sheet of being located between pcb board 10 and the metal backing 20 40.This pcb board 10 is provided with first locating hole 11; Metal backing 20 is provided with second locating hole 21; And these first, second locating hole 11,21 apertures are inconsistent; Greater than second locating hole, 21 apertures, or first locating hole, 11 apertures are less than second locating hole, 21 apertures like first locating hole, 11 apertures, and pcb board 10 is installed in first, second locating holes 11,21 through this T font pin 30 with metal backing 20 and accurately located.This bonding sheet 40 also is provided with through hole (indicate) and is beneficial to T font pin 30 and passes, and first locating hole 11 that said through hole can corresponding pcb board 10 is provided with.
Said T font pin 30 comprises the interconnective first pin section, the 31 and second pin section 32; The diameter of the first pin section, the 31 and second pin section 32 is unequal; Corresponding first locating hole 11 of difference and second locating hole 21; When first locating hole, 11 apertures during greater than second locating hole, 21 apertures, the first pin section, 31 diameters are greater than the second pin section, 32 diameters; Otherwise first locating hole, 11 apertures are less than second locating hole, 21 apertures, and then the first pin section, 31 diameters are less than the second pin section, 32 diameters.The diameter of this first, second pin section 31,32 is made according to first locating hole 11 of pcb board 10 and second locating hole, 21 pore sizes of metal backing 20, and is general smaller in the aperture of this first, second locating hole 11,21, like little 0.05mm.With reference to shown in Figure 1, in the present embodiment, the diameter of the first pin section 31 is greater than the second pin section 32.This two pins section 31,32 correspondence respectively is installed in first, second locating hole 11,21, and pcb board 10 and metal backing 20 are positioned, and forms certain bit combination structure.
When first locating hole, 11 apertures of pcb board 10 greater than with second locating hole, 21 apertures of metal backing 20, during the location, select suitable T font pin 30 according to first, second locating hole 11,21 pore sizes.The first pin section, 31 corresponding first locating holes 11 that diameter in the T font pin 30 is bigger; 32 correspondence second locating holes 21 of the second pin section; Through pressing corresponding respectively the coincideing of two pin sections 31,32 is installed in first, second locating hole; Thereby pcb board 10, metal backing 20 form certain bit combination structure with T font pin 30, realize the pressing row plate location of inconsistent pcb board 10 in locating hole aperture and metal backing 20.
In addition; The end of the first pin section, the 31 and second pin section, 32 opposing ends makes it be the rounding horn shape all with the rounding setting, promptly makes two ends of this T font pin 30 be rounding; Comparatively smooth, the sharp edge of can avoiding like this pinning weighs, scrapes damage etc. wounded to pcb board 10 plate faces.
In sum; The metal substrate layer pressure plate location combining structure of the utility model; Adopt the inconsistent T font pin of two pin section diameters to replace conventional at present linear pattern pin; Realize the accurate location of inconsistent pcb board in aperture and metal backing pressing, also solution is provided simultaneously for the assembling of the inconsistent two kinds of accessories in locating hole aperture.
The above; For the person of ordinary skill of the art; Can make other various corresponding changes and distortion according to the technical scheme and the technical conceive of the utility model, and all these changes and distortion all should belong to the protection domain of the utility model claim.
Claims (5)
1. a metal substrate layer pressure plate is located combining structure; It is characterized in that; Comprise: pcb board, metal backing and be connected pcb board and metal backing between T font pin; This pcb board is provided with first locating hole, and metal backing is provided with second locating hole, and the first locating hole aperture and the second locating hole aperture are unequal; This T font pin comprises and interconnects and the unequal first pin section of diameter and the second pin section the first pin section and second pin section corresponding respectively being installed in first locating hole and second locating hole.
2. metal substrate layer pressure plate as claimed in claim 1 location combining structure is characterized in that also comprise bonding sheet, this bonding sheet is located between pcb board and the metal backing.
3. metal substrate layer pressure plate as claimed in claim 1 location combining structure is characterized in that, the said first locating hole aperture is greater than the second locating hole aperture, and the first pin section diameter is greater than the second pin section diameter.
4. metal substrate layer pressure plate as claimed in claim 1 location combining structure is characterized in that, the said first locating hole aperture is less than the second locating hole aperture, and the first pin section diameter is less than the second pin section diameter.
5. metal substrate layer pressure plate as claimed in claim 1 location combining structure is characterized in that, the first pin section all is the rounding horn shape with the end of the opposing end of the second pin section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120280611 CN202200625U (en) | 2011-08-03 | 2011-08-03 | Laminating, plate-arranging and positioning combined structure of metal substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120280611 CN202200625U (en) | 2011-08-03 | 2011-08-03 | Laminating, plate-arranging and positioning combined structure of metal substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202200625U true CN202200625U (en) | 2012-04-25 |
Family
ID=45964762
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201120280611 Expired - Lifetime CN202200625U (en) | 2011-08-03 | 2011-08-03 | Laminating, plate-arranging and positioning combined structure of metal substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202200625U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110290652A (en) * | 2019-07-25 | 2019-09-27 | 上海航天电子通讯设备研究所 | A kind of high-accuracy positioning laminater of LCP multilayer circuit board and method |
-
2011
- 2011-08-03 CN CN 201120280611 patent/CN202200625U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110290652A (en) * | 2019-07-25 | 2019-09-27 | 上海航天电子通讯设备研究所 | A kind of high-accuracy positioning laminater of LCP multilayer circuit board and method |
| CN110290652B (en) * | 2019-07-25 | 2021-04-02 | 上海航天电子通讯设备研究所 | LCP multi-layer circuit board high-precision positioning laminating device and method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP03 | Change of name, title or address |
Address after: 523127 Dongcheng District City, Guangdong province (with sand) science and Technology Industrial Park Road, No. 33 vibration with the number of Patentee after: Shengyi electronic Limited by Share Ltd Address before: 523000 Dongcheng District (Dongguan) science and Technology Industrial Park, Guangdong, China Patentee before: Dongguan Shengyi Electronics Ltd. |
|
| CX01 | Expiry of patent term |
Granted publication date: 20120425 |
|
| CX01 | Expiry of patent term |