CN202177646U - 探棒组件 - Google Patents

探棒组件 Download PDF

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Publication number
CN202177646U
CN202177646U CN201120275982.7U CN201120275982U CN202177646U CN 202177646 U CN202177646 U CN 202177646U CN 201120275982 U CN201120275982 U CN 201120275982U CN 202177646 U CN202177646 U CN 202177646U
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CN
China
Prior art keywords
probe
connecting line
rod component
probe rod
probe assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201120275982.7U
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English (en)
Inventor
田波
陈国义
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CN201120275982.7U priority Critical patent/CN202177646U/zh
Priority to TW100214503U priority patent/TWM423249U/zh
Priority to US13/233,914 priority patent/US20130033281A1/en
Application granted granted Critical
Publication of CN202177646U publication Critical patent/CN202177646U/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06788—Hand-held or hand-manipulated probes, e.g. for oscilloscopes or for portable test instruments
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G01R31/2817—Environmental-, stress-, or burn-in tests

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
  • Testing Resistance To Weather, Investigating Materials By Mechanical Methods (AREA)
  • Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)

Abstract

一种探棒组件，包括依次连接的探头、连接线及转接头，所述连接线的外皮采用耐高温和/或耐高湿材料制成。所述探棒组件能耐高温及高湿，具有较长的使用寿命。

Description

探棒组件
技术领域
本实用新型涉及一种探棒组件。
背景技术
在研发过程中，经常需要用示波器对电子产品（如电脑主板）进行测试。在某些情况下，为了满足调试或测试的需求，需要模拟一定的外部环境以对被测产品的可靠性进行测试，例如，需要模拟高温和/或高湿的环境。然而，若在这种高温和/或高湿的环境下使用现有的示波器探棒，往往会严重影响探棒的使用寿命，同时也会影响探棒测试的准确度。
实用新型内容
针对上述问题，有必要提供一种能在高温和/或高湿环境下使用的探棒组件。
一种探棒组件，包括依次连接的探头、连接线及转接头，所述连接线的外皮采用耐高温和/或耐高湿材料制成。
较佳地，所述连接线的外皮由聚氯乙烯材料制成。
较佳地，所述探头直接放置于一待测对象的待测点上或者焊接于所述待测点上。
附图说明
图1为本实用新型较佳实施方式的探棒组件的示意图。
主要元件符号说明
探头 10
连接线 20
转接头 30
如下具体实施方式将结合上述附图进一步说明本实用新型。
具体实施方式
请参照图1，本实用新型探棒组件100包括依次连接的探头10、连接线20及转接头30。
所述探头10用于对一待测对象（图未示）的待测点进行信号采样。在本较佳实施方式中，所述探头10大致呈尖锥形，其可被直接放置于所述待测对象的待测点上；也可被焊接于所述待测点上，以方便固定所述探头10。
所述连接线20用于将探头10采集到的采样信号传输至所述转接头30。所述连接线20的外皮由聚氯乙烯（Polyvinylchloride，PVC）等耐高温和/或耐高湿的材料制成，如此，当所述探棒组件100处于高温和/或高湿的环境中时，所述连接线20也不会被腐蚀损坏。
所述转接头30电性连接至一示波器（图未示）。所述转接头30用于对探头10采集到的采样信号进行一定处理，例如整形、滤波后，传输至所述示波器。
由于所述探棒组件100的连接线20的外皮采用PVC等耐高温和/或耐高湿材料制成，即便所述探帮组件100由于测试的需要而处于高温和/或高湿的环境中时，所述连接线20也不会被腐蚀损坏，因此，可有效延长所述探棒组件100的使用寿命。

Claims (3)

1.一种探棒组件，包括依次连接的探头、连接线及转接头，其特征在于：所述连接线的外皮采用耐高温和/或耐高湿材料制成。
2.如权利要求1所述的探棒组件，其特征在于：所述连接线的外皮由聚氯乙烯材料制成。
3.如权利要求1或2所述的探棒组件，其特征在于：所述探头直接放置于一待测对象的待测点上或者焊接于所述待测点上。
CN201120275982.7U 2011-08-01 2011-08-01 探棒组件 Expired - Fee Related CN202177646U (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201120275982.7U CN202177646U (zh) 2011-08-01 2011-08-01 探棒组件
TW100214503U TWM423249U (en) 2011-08-01 2011-08-05 Probe assembly
US13/233,914 US20130033281A1 (en) 2011-08-01 2011-09-15 Probe assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201120275982.7U CN202177646U (zh) 2011-08-01 2011-08-01 探棒组件

Publications (1)

Publication Number Publication Date
CN202177646U true CN202177646U (zh) 2012-03-28

Family

ID=45867520

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201120275982.7U Expired - Fee Related CN202177646U (zh) 2011-08-01 2011-08-01 探棒组件

Country Status (3)

Country Link
US (1) US20130033281A1 (zh)
CN (1) CN202177646U (zh)
TW (1) TWM423249U (zh)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4408160A (en) * 1981-04-08 1983-10-04 Southwest Research Institute Acoustic Barkhausen stress detector apparatus and method
CH677144A5 (zh) * 1988-12-21 1991-04-15 Weber Hans R
US5631571A (en) * 1996-04-03 1997-05-20 The United States Of America As Represented By The Secretary Of The Air Force Infrared receiver wafer level probe testing
US6956362B1 (en) * 2001-12-14 2005-10-18 Lecroy Corporation Modular active test probe and removable tip module therefor
US6847219B1 (en) * 2002-11-08 2005-01-25 Cascade Microtech, Inc. Probe station with low noise characteristics
US6980419B2 (en) * 2003-03-12 2005-12-27 Zonare Medical Systems, Inc. Portable ultrasound unit and docking station
CN101281233B (zh) * 2007-04-05 2012-01-18 鸿富锦精密工业（深圳）有限公司 电连接器测试系统
US7973547B2 (en) * 2008-08-13 2011-07-05 Infineon Technologies Ag Method and apparatus for detecting a crack in a semiconductor wafer, and a wafer chuck
US8179121B2 (en) * 2009-03-30 2012-05-15 Pcb Piezotronics, Inc. Bridge sensor with collocated electronics and two-wire interface
CN102539848A (zh) * 2010-12-21 2012-07-04 鸿富锦精密工业（深圳）有限公司 探棒组合

Also Published As

Publication number Publication date
TWM423249U (en) 2012-02-21
US20130033281A1 (en) 2013-02-07

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20120328

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