CN202174659U - Silicon rod workpiece of multi-wire cutting machine - Google Patents

Silicon rod workpiece of multi-wire cutting machine Download PDF

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Publication number
CN202174659U
CN202174659U CN2011202420165U CN201120242016U CN202174659U CN 202174659 U CN202174659 U CN 202174659U CN 2011202420165 U CN2011202420165 U CN 2011202420165U CN 201120242016 U CN201120242016 U CN 201120242016U CN 202174659 U CN202174659 U CN 202174659U
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CN
China
Prior art keywords
silicon rod
silicon
cutting machine
wire
workpiece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2011202420165U
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Chinese (zh)
Inventor
陈春晖
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
YANGZHOU SHINEHOME PV CO Ltd
Original Assignee
YANGZHOU SHINEHOME PV CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by YANGZHOU SHINEHOME PV CO Ltd filed Critical YANGZHOU SHINEHOME PV CO Ltd
Priority to CN2011202420165U priority Critical patent/CN202174659U/en
Application granted granted Critical
Publication of CN202174659U publication Critical patent/CN202174659U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses a silicon rod workpiece of a multi-wire cutting machine, which relates to the field of cutting machines for cutting monocrystal silicon rods and polycrystal silicon rods in a multi-wire way. The silicon rod workpiece of the multi-wire cutting machine comprises a silicon rod, wherein the bottom of the silicon rod is adhered with two resin strips; the two resin strips are respectively arranged on two sides of the width direction of the silicon rod; and the length of each resin strip is respectively equal to that of the bottom of the silicon rod. By the design, by utilizing hard resin strips which are as long as the silicon rod, have widths of 15 MM and thicknesses of 2 MM, and are attached on the left corner and the right corner of the knife entering position of the silicon rod, the silicon rod workpiece of the multi-wire cutting machine cuts a wire mesh into the resin strips with relatively softer textures first, decreases the shake of a steel wire, reduces the non-uniformity of the slice thickness of a silicon slice, and increases the rate of finished products of the silicon slice.

Description

The silicon rod workpiece of multi-line cutting machine
Technical field
The utility model relates to the field of the cutting machine of multi-thread cutting monocrystalline, polycrystalline silicon rod.
Background technology
Elevating mechanism and two home rolls are set in the multi-line cutting machine, and the below of elevating mechanism connects the silicon rod workpiece, and the periphery of every home roll spiral respectively is provided with groove, same steel wire of coiling in the groove of two home rolls, and steel wire is arranged on the below of silicon rod workpiece.Carry out silicon rod when cutting, the rotation of two home rolls drives steel wire and moves back and forth, and elevating mechanism drives the silicon rod workpiece and moves down, and cuts into some silicon chips through the cooperation realization of steel wire and slip is multi-thread.Gauze runs up and causes the steel wire shake during silicon rod feed, and silicon rod directly contacts the gauze of shake, causes the silicon chip feed to go out edge became uneven and wire jumper phenomenon.
Summary of the invention
The purpose of the utility model is in order to overcome the deficiency of prior art, provide a kind of make the silicon chip thickness evenly, the silicon rod workpiece of the multi-line cutting machine that improves the quality of products.
The purpose of the utility model is achieved in that the silicon rod workpiece of multi-line cutting machine; Comprise silicon rod; Two resin streaks are pasted in the bottom of said silicon rod, and two resin streaks are separately positioned on the both sides of silicon rod width, and the length of every resin streak is the equal in length bottom silicon rod respectively.
The utility model is through above design, and utilization is long together with silicon rod, wide 15MM; Thick 2MM hard resin bar on the left and right corner of subsides and silicon rod feed place, lets gauze cut quality softer resin streak relatively earlier; Reduce the steel wire shake, it is even to reduce silicon chip sheet thickness ununiformity, increases the silicon chip yield rate.
Description of drawings
Fig. 1 is a kind of structural representation of the utility model.
The specific embodiment
As shown in Figure 1, the silicon rod workpiece for multi-line cutting machine comprises silicon rod 1, and the both sides that 2, two resin streaks 2 of two resin streaks are separately positioned on silicon rod 1 width are pasted in the bottom of silicon rod 1, the length of every resin streak 2 respectively with the equal in length of silicon rod 1 bottom.

Claims (1)

1. the silicon rod workpiece of multi-line cutting machine comprises silicon rod, it is characterized in that: two resin streaks are pasted in the bottom of said silicon rod, and two resin streaks are separately positioned on the both sides of silicon rod width, and the length of every resin streak is the equal in length bottom silicon rod respectively.
CN2011202420165U 2011-07-11 2011-07-11 Silicon rod workpiece of multi-wire cutting machine Expired - Fee Related CN202174659U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2011202420165U CN202174659U (en) 2011-07-11 2011-07-11 Silicon rod workpiece of multi-wire cutting machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011202420165U CN202174659U (en) 2011-07-11 2011-07-11 Silicon rod workpiece of multi-wire cutting machine

Publications (1)

Publication Number Publication Date
CN202174659U true CN202174659U (en) 2012-03-28

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011202420165U Expired - Fee Related CN202174659U (en) 2011-07-11 2011-07-11 Silicon rod workpiece of multi-wire cutting machine

Country Status (1)

Country Link
CN (1) CN202174659U (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102626949A (en) * 2012-04-09 2012-08-08 江苏金晖光伏有限公司 Polycrystal slicing method for improving silicon rod slicing yield
CN103522432A (en) * 2013-10-28 2014-01-22 江西赛维Ldk太阳能高科技有限公司 Silicon briquette cutting method and device
CN103878891A (en) * 2012-12-24 2014-06-25 九州方园新能源股份有限公司 Silicon rod with chamfered guide strip
CN104309018A (en) * 2014-11-17 2015-01-28 天津市环欧半导体材料技术有限公司 Resin streak structure for cutting silicon slices
CN110370479A (en) * 2019-07-15 2019-10-25 上海新昇半导体科技有限公司 A kind of crystal bar cutter device and method
WO2023019738A1 (en) * 2021-08-18 2023-02-23 天通控股股份有限公司 Slicing method for large size ultra-thin lithium niobate wafer

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102626949A (en) * 2012-04-09 2012-08-08 江苏金晖光伏有限公司 Polycrystal slicing method for improving silicon rod slicing yield
CN103878891A (en) * 2012-12-24 2014-06-25 九州方园新能源股份有限公司 Silicon rod with chamfered guide strip
CN103522432A (en) * 2013-10-28 2014-01-22 江西赛维Ldk太阳能高科技有限公司 Silicon briquette cutting method and device
CN103522432B (en) * 2013-10-28 2016-05-25 江西赛维Ldk太阳能高科技有限公司 Method for cutting silicon block and cutter sweep thereof
CN104309018A (en) * 2014-11-17 2015-01-28 天津市环欧半导体材料技术有限公司 Resin streak structure for cutting silicon slices
CN110370479A (en) * 2019-07-15 2019-10-25 上海新昇半导体科技有限公司 A kind of crystal bar cutter device and method
WO2023019738A1 (en) * 2021-08-18 2023-02-23 天通控股股份有限公司 Slicing method for large size ultra-thin lithium niobate wafer

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20120328

Termination date: 20150711

EXPY Termination of patent right or utility model