CN202171134U - LED (Light Emitting Diode) light bar, LED and PCB (Printed Circuit Board) - Google Patents
LED (Light Emitting Diode) light bar, LED and PCB (Printed Circuit Board) Download PDFInfo
- Publication number
- CN202171134U CN202171134U CN2011201709642U CN201120170964U CN202171134U CN 202171134 U CN202171134 U CN 202171134U CN 2011201709642 U CN2011201709642 U CN 2011201709642U CN 201120170964 U CN201120170964 U CN 201120170964U CN 202171134 U CN202171134 U CN 202171134U
- Authority
- CN
- China
- Prior art keywords
- led
- pcb
- magnetic substance
- negative pin
- conductive magnetic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Abstract
The utility model discloses an LED (Light Emitting Diode) light bar, an LED and a PCB (Printed Circuit Board); the LED is provided with a non-conductive magnetic material layer; the PCB is provided with a magnet layer and an LED positive/negative pin contact structure, wherein the non-conductive magnetic material layer arranged on the LED and the magnet layer arranged on the PCB are in magnetic adsorption, so that the LED is stuck on the PCB; and the LED positive/negative pin contact structure arranged on the PCB corresponds with positive/negative pins of the LED and is used for realizing good contact with the positive/negative pins of the LED after magnetic adsorption. According to the LED light bar, the LED and the PCB disclosed by the utility model, the free-welding reliable contact between the LED and the PCB without tin soldering is realized; other components on the LED light bar are prevented from being oxidized by high temperature, so that the service life is prolonged; the matching degree of the LED light bar and the original design is increased, so that the light entrance effect of the LED light bar is improved; furthermore, in the event of ensuring the reliable connection between the LED and the PCB, the heat dissipation effect of the LED light bar is effectively improved.
Description
Technical field
The utility model relates to the backlight technology, relates in particular to a kind of light emitting diode (LED, Light Emitting Diode) lamp bar, LED and is used to install the PCB of the utility model LED.
Background technology
At present; LED lamp bar is a soldering formula LED lamp bar; Fig. 1 is the composition structural representation of existing welded type LED lamp bar; As shown in Figure 1, existing LED lamp bar comprises: printed circuit board (PCB) (PCB, Printed Circuit Board) 11 and LED (comprise LED lamp body 12 and LED just/negative pin one 3) with pad (Pad) constitute.LED realizes reliably being connected through soldering with PCB, and at present, soldering is connected industry and upward adopts surface patch technology (SMT) to realize.
Fig. 2 is for the pin sketch map of existing LED, and is as shown in Figure 2, and the pin of LED is to go up the corresponding Pad shape of pad with PCB, mainly is to help after scolding tin dissolves in the SMT process LED well being connected with PCB."+" expression positive pole among Fig. 2, "-" expression negative pole.
There is following problem in existing soldering formula LED lamp bar:
After LED is fixing, change inconvenient; LED exists in the SMT process that the welding position is inaccurate promptly pastes askew situation, if departed from the design original intention of LED lamp bar, can influence the light effect of going into of LED lamp bar; When defective products occurring, repairing (Repair) length consuming time of doing over again; And, adopt soldering technology, must fuse through Reflow Soldering, and the pin of other element on the lamp bar such as connector (connector) is oxidized in the Reflow Soldering hot environment easily, is electrically connected performance thereby influenced it.
Summary of the invention
In view of this; The main purpose of the utility model is to provide a kind of LED lamp bar, LED and PCB, can realize LED and PCB exempt from weld reliable the contact, improve the heat dispersion of LED lamp bar; Simultaneously; It is convenient that LED changes, and can realize the adjusting of LED and PCB relative position, thereby improve the light effect of going into of LED.
For achieving the above object, the technical scheme of the utility model is achieved in that
A kind of LED lamp bar comprises: be provided with the LED of non-conductive magnetic substance layer, and be provided with magnet layer and LED just/printing board PCB of negative pin contact structures;
The non-conductive magnetic substance layer of the last setting of LED and PCB go up between the magnet layer that is provided with and adsorb through magnetic, and LED is fitted on the PCB; The LED of the last setting of PCB just/negative pin contact structures, with LED just/negative pin positions is corresponding, be used for contacting with the good of the positive and negative pin of LED in magnetic absorption back realization.
Said non-conductive magnetic substance layer comprises the first non-conductive magnetic substance layer and the second non-conductive magnetic substance layer;
Accordingly, said magnet layer comprises the first magnet layer and the second magnet layer.
Said LED just/negative pin contact structures are resilient contact.
Said LED just/negative pin part covered by said non-conductive magnetic substance layer, part is exposed.
Said LED just/negative pin is a strip.
A kind of LED, comprise LED lamp body, LED just/negative pin, and non-conductive magnetic substance layer; Wherein,
Non-conductive magnetic substance layer comprises the first non-conductive magnetic substance layer and the second non-conductive magnetic substance layer, is separately positioned on LED lamp body lower surface two ends; Be used for and magnet layer that PCB go up to be provided with between through magnetic absorption, LED is fitted on the PCB;
LED just/exposed part of negative pin, be arranged on corresponding PCB go up the LED that is provided with just/position of negative pin contact structures on, be used to realize with PCB go up the LED that is provided with just/negative the good of pin contact structures contact.
Said non-conductive magnetisable material is to be provided with continuously, or is interrupted setting.
Said LED just/negative pin is a strip.
A kind of PCB comprises PCB substrate, magnet layer, and LED pin contact structures; Wherein,
The magnet layer comprises the first magnet layer and the second magnet layer; Be separately positioned on the position of the first non-conductive magnetic substance layer and the second non-conductive magnetic substance layer on the corresponding LED; Be used for and non-conductive magnetic substance layer that LED go up to be provided with between through magnetic absorption, LED is fitted on the PCB;
Said LED pin contact structures comprise positive pin contact structures of LED and the negative pin contact structures of LED;
On the PCB substrate, corresponding LED just/be respectively arranged with on the relevant position of negative pin LED just/negative pin contact structures, be used to realize with PED just/negative the good of pin contact.
Said LED just/negative pin contact structures are resilient contact.
Can find out from the technical scheme that above-mentioned the utility model provides, be provided with the LED of non-conductive magnetic substance layer, and be provided with magnet layer and LED just/PCB of negative pin contact structures.Wherein, the non-conductive magnetic substance layer of the last setting of LED and PCB go up between the magnet layer that is provided with and adsorb through magnetic, and LED is fitted on the PCB; The LED of the last setting of PCB just/negative pin contact structures, with LED just/negative pin positions is corresponding, be used for contacting with the good of the positive and negative pin of LED in magnetic absorption back realization.The utility model has been realized between LED and the PCB exempting to weld reliable the contact without scolding tin; Avoid on the LED lamp bar other element by high-temperature oxydation, thereby prolonged service life; Improve the LED lamp bar and the intrinsic goodness of fit, improved the light effect of going into of LED lamp bar; And, when guaranteeing LED and PCB reliably is connected, effectively improved the radiating effect of LED lamp bar.
Description of drawings
Fig. 1 is the composition structural representation of existing welded type LED lamp bar;
Fig. 2 is the structural representation of existing LED pin;
Fig. 3 is the composition structural representation of the utility model LED lamp bar;
Fig. 4 is the composition structural representation of the utility model LED;
Fig. 5 (a) is the schematic top plan view of the composition structure of the PCB that is used to install the utility model LED;
Fig. 5 (b) is the front elevational schematic of the composition structure of the PCB that is used to install the utility model LED;
Fig. 5 (c) looks sketch map for the right side of the composition structure of the PCB that is used to install the utility model LED.
Description of reference numerals:
11-PCB, 12--LED lamp body, 13--LED just/negative pin, the 31--first non-conductive magnetic substance layer; The 32--second non-conductive magnetic substance layer, the 33--first magnet layer, the 34--second magnet layer; 35--LED just/negative pin contact structures, 36-PCB, 37-LED; 38--LED just/negative pin, 41-LED lamp body, 51--PCB substrate.
The specific embodiment
Fig. 3 is the composition structural representation of the utility model LED lamp bar; As shown in Figure 3; Comprise: be provided with the non-conductive magnetic substance layer LED of (comprising the first non-conductive magnetic substance layer 31 and the second non-conductive magnetic substance layer 32), and be provided with magnet layer (comprising the first magnet layer 33 and the second magnet layer 34) and LED just/PCB 36 of negative pin contact structures 35.Wherein, through magnetic absorption, LED 37 is fitted on the PCB 36 between the magnet layer that is provided with on non-conductive magnetic substance layer that is provided with on the LED 37 and the PCB 36; The LED that is provided with on the PCB 36 just/negative pin contact structures 35, with LED just/negative pin 38 positions are corresponding, be used for contacting with the good of the positive and negative pin of LED in magnetic absorption back realization.
Wherein, non-conductive magnetic substance layer can be as being coated with the nickel-cadmium of insulating barrier; The magnet layer can be like tri-iron tetroxide etc.; LED just/negative pin contact structures 35 can be two parallel strips etc.Can take degree of steaming between non-conductive magnetic substance layer and the LED 37 or plasma enhanced chemical vapor deposition method modes such as (PECVD) is connected, can take modes such as seccotine to be connected between magnet layer and the PCB 36.
Need to prove; About the concrete position that is provided with of non-conductive magnetic substance layer, magnet layer and LED pin contact structures; Fig. 3 only is an example, and is not used in the protection domain that limits the utility model, as long as non-conductive magnetic substance layer is corresponding with the position of magnet layer; The LED pin is corresponding with the position of LED pin contact structures, guarantees that absorption reliably and contact get final product.
The technique effect that the utility model LED lamp bar structure is brought comprises: PCB last LED pin contact structures have realized between LED and the PCB exempting to weld reliable the contact without scolding tin; Because do not need welding procedure, dismounting and change is convenient, and, need not pass through Reflow Soldering, avoid on the LED lamp bar other element by high-temperature oxydation, thereby prolonged service life; LED and PCB be through magnetic absorption, and it (owing to be through the electrically contacting of magnetic attached realization LED pin and resilient contact between LED and the PCB, is not as soldering, to be fixed that the relative position between the two can be finely tuned at any time; Like this; In case find that LED and PCB are not parallel shapes, just can set right easily, attach fixing then through magnetic); Improve the LED lamp bar and the intrinsic goodness of fit, improved the light effect of going into of LED lamp bar; And because magnet has good performance of heat dissipation, the utility model when guaranteeing LED and PCB reliably is connected, has effectively improved the radiating effect of LED lamp bar through magnetic absorption.
Fig. 4 is the composition structural representation of the utility model LED, and is as shown in Figure 4, comprise LED lamp body 41, LED just/negative pin 38, and non-conductive magnetic substance layer; Wherein,
Non-conductive magnetic substance layer comprises: the first non-conductive magnetic substance layer 31 and the second non-conductive magnetic substance layer 32; Be separately positioned on LED lamp body 41 lower surface two ends; Be used for and magnet layer that PCB go up to be provided with between through magnetic absorption, LED is fitted on the PCB; LED just/exposed part of negative pin 38, be arranged on corresponding PCB go up the LED that is provided with just/position of negative pin contact structures 35 on, be used to realize with PCB 36 on the LED that is provided with just/negative the good of pin contact structures 35 contact.
"+" expression is anodal among Fig. 4; "-" expression negative pole; Be provided with the non-conductive magnetisable material of one deck at LED lamp body 41 lower surface two ends; As shown in Figure 4, comprise the first non-conductive magnetic substance layer 31 and the second non-conductive magnetic substance layer 32, the non-conductive magnetisable material of this layer one deck can be continuous setting or the setting that is interrupted.Non-conductive magnetisable material covers a part of LED pin (like dotted portion among the figure), like this, avoided between the positive and negative pin of LED on the one hand, and electric leakage or short circuit between LED and the PCB; On the other hand, non-conductive magnetisable material and PCB go up set magnet and have good magnetic adsorptive power, have guaranteed that LED is connected with the reliable absorption of PCB;
The positive and negative pin of LED also has the exposed part of reserving (like the thick black line part at LED middle part among Fig. 4) except being capped part, and the pin of exposed part is mainly for the ease of the electrically driven (operated) connection in outside.
Among Fig. 4, the LED of the utility model just/negative pin is a strip, mainly be in order to ensure just/negative pin is connected with the internal electrical of LED inside chip, the while has realized better that also LED is connected with the external electric of PCB.Need to prove, connect as long as guarantee good inside and external electric, do not limit LED just/shape of negative pin.
Fig. 5 (a) is the schematic top plan view of the composition structure of the PCB 36 that is used to install the utility model LED; Fig. 5 (b) is the front elevational schematic of the composition structure of the PCB 36 that is used to install the utility model LED, and Fig. 5 (c) looks sketch map for the right side of the composition structure of the PCB 36 that is used to install the utility model LED.Shown in Fig. 5 (a)～Fig. 5 (c), comprising: PCB substrate 51, magnet layer (comprising the first magnet layer 33 and the second magnet layer 34), and LED just/negative pin contact structures 35 (comprising that positive pin contact structures of LED and LED bear the pin contact structures).Wherein,
On PCB substrate 51, corresponding LED just/relevant position of negative pin be provided with LED just/negative pin contact structures 35, these pin contact structures can be resilient contacts, also can be rubber-like contacts not, are preferably resilient contact.Shown in Fig. 5 (a)～Fig. 5 (c); LED just/both sides of negative pin contact structures 35 are provided with certain thickness respectively (does not have special qualification to thickness here; Just explanation is according to the size of LED; Can adjust the power that the corresponding magnetic of different-thickness attaches) magnet, the first magnet layer 33 and the second magnet layer 34 are respectively applied for the first non-conductive magnetic substance layer 31 that go up to be provided with LED to carry out magnetic with the second non-conductive magnetic substance layer 32 and adsorbs.Wherein, The magnet layer comprises the first magnet layer 33 and the second magnet layer 34; Be separately positioned on the position of the first non-conductive magnetic substance layer 31 and the second non-conductive magnetic substance layer 32 on the corresponding LED; Be used for and non-conductive magnetic substance layer that LED go up to be provided with between through magnetic absorption, LED is fitted on the PCB 36; On PCB substrate 51, corresponding LED just/be respectively arranged with on the relevant position of negative pin LED just/negative pin contact structures 35, be used to realize with LED just/negative the good of pin 38 contact.
The utility model passes through the magnetic adsorptive power of non-conductive magnetisable material and the last magnet that is provided with of PCB, LED is adsorbed well be fitted on the PCB; Simultaneously, after magnetic absorption,, guaranteed that PCB contacts with the good of the positive and negative pin of LED, thereby realized electrically driven (operated) reliable connection through the contact contact on the PCB.In addition, what the magnet of the last setting of PBC had not only been realized LED and PCB exempts to weld reliable the contact, and, because magnet has good performance of heat dissipation, improved the heat dispersion of LED lamp bar;
Simultaneously, through magnetic adsorptive power, it is convenient to make that LED changes; And,, be not as soldering, to be fixed owing to be between LED and the PCB through the electrically contacting of magnetic attached realization LED pin and resilient contact; Like this, in case find that LED and PCB are not parallel shapes, just can set right easily; Attach fixingly then through magnetic, realized the adjusting of LED and PCB relative position, thereby improved the light effect of going into of LED.
In addition, the string of LED and driving can be realized controlling by the wiring of PCB on the LED lamp bar.
The above; Be merely the preferred embodiment of the utility model; Be not the protection domain that is used to limit the utility model, any modification of being done within all spirit and principles at the utility model, be equal to replacement and improvement etc., all should be included within the protection domain of the utility model.
Claims (10)
1. a LED lamp bar is characterized in that, comprising: be provided with the LED of non-conductive magnetic substance layer, and be provided with magnet layer and LED just/printing board PCB of negative pin contact structures;
The non-conductive magnetic substance layer of the last setting of LED and PCB go up between the magnet layer that is provided with and adsorb through magnetic, and LED is fitted on the PCB; The LED of the last setting of PCB just/negative pin contact structures, with LED just/negative pin positions is corresponding, be used for contacting with the good of the positive and negative pin of LED in magnetic absorption back realization.
2. LED lamp bar according to claim 1 is characterized in that, said non-conductive magnetic substance layer comprises the first non-conductive magnetic substance layer and the second non-conductive magnetic substance layer;
Accordingly, said magnet layer comprises the first magnet layer and the second magnet layer.
3. the lamp bar of LED according to claim 1 and 2 is characterized in that, said LED just/negative pin contact structures are resilient contact.
4. LED lamp bar according to claim 1 and 2 is characterized in that, said LED just/negative pin part covered by said non-conductive magnetic substance layer, part is exposed.
5. LED lamp bar according to claim 4 is characterized in that, said LED just/negative pin is a strip.
6. a LED is characterized in that, comprise LED lamp body, LED just/negative pin, and non-conductive magnetic substance layer; Wherein,
Non-conductive magnetic substance layer comprises the first non-conductive magnetic substance layer and the second non-conductive magnetic substance layer, is separately positioned on LED lamp body lower surface two ends; Be used for and magnet layer that PCB go up to be provided with between through magnetic absorption, LED is fitted on the PCB;
LED just/exposed part of negative pin, be arranged on corresponding PCB go up the LED that is provided with just/position of negative pin contact structures on, be used to realize with PCB go up the LED that is provided with just/negative the good of pin contact structures contact.
7. LED according to claim 6 is characterized in that, said non-conductive magnetisable material is to be provided with continuously, or is interrupted setting.
8. according to claim 6 or 7 described LED, it is characterized in that, said LED just/negative pin is a strip.
9. a PCB is characterized in that, comprises PCB substrate, magnet layer, and LED pin contact structures; Wherein,
The magnet layer comprises the first magnet layer and the second magnet layer; Be separately positioned on the position of the first non-conductive magnetic substance layer and the second non-conductive magnetic substance layer on the corresponding LED; Be used for and non-conductive magnetic substance layer that LED go up to be provided with between through magnetic absorption, LED is fitted on the PCB;
Said LED pin contact structures comprise positive pin contact structures of LED and the negative pin contact structures of LED;
On the PCB substrate, corresponding LED just/be respectively arranged with on the relevant position of negative pin LED just/negative pin contact structures, be used to realize with PED just/negative the good of pin contact.
10. PCB according to claim 9 is characterized in that, said LED just/negative pin contact structures are resilient contact.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201709642U CN202171134U (en) | 2011-05-25 | 2011-05-25 | LED (Light Emitting Diode) light bar, LED and PCB (Printed Circuit Board) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201709642U CN202171134U (en) | 2011-05-25 | 2011-05-25 | LED (Light Emitting Diode) light bar, LED and PCB (Printed Circuit Board) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202171134U true CN202171134U (en) | 2012-03-21 |
Family
ID=45829329
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011201709642U Expired - Lifetime CN202171134U (en) | 2011-05-25 | 2011-05-25 | LED (Light Emitting Diode) light bar, LED and PCB (Printed Circuit Board) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202171134U (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103899944A (en) * | 2012-12-27 | 2014-07-02 | 金健 | Magnetic force mounted type LED fluorescent lamp |
| CN106163112A (en) * | 2016-08-31 | 2016-11-23 | 安徽赛福电子有限公司 | A kind of adhesive contact-type electronic element corollary apparatus |
| CN106211576A (en) * | 2016-08-31 | 2016-12-07 | 安徽赛福电子有限公司 | A kind of adhesive contact circuit board |
| CN106455319A (en) * | 2016-08-31 | 2017-02-22 | 安徽赛福电子有限公司 | Attracting contact type electronic element pin |
| CN109085721A (en) * | 2018-09-11 | 2018-12-25 | 昆山龙腾光电有限公司 | Backlight module and liquid crystal display device |
| WO2020107770A1 (en) * | 2018-11-28 | 2020-06-04 | 武汉华星光电技术有限公司 | Area light source backlight module, liquid crystal display panel, and led chip soldering method |
| CN114639311A (en) * | 2022-03-22 | 2022-06-17 | Tcl华星光电技术有限公司 | Display panel and mobile terminal |
-
2011
- 2011-05-25 CN CN2011201709642U patent/CN202171134U/en not_active Expired - Lifetime
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103899944A (en) * | 2012-12-27 | 2014-07-02 | 金健 | Magnetic force mounted type LED fluorescent lamp |
| CN103899944B (en) * | 2012-12-27 | 2016-12-28 | 金健 | A kind of magnetic force mount type LED daylight lamp |
| CN106163112A (en) * | 2016-08-31 | 2016-11-23 | 安徽赛福电子有限公司 | A kind of adhesive contact-type electronic element corollary apparatus |
| CN106211576A (en) * | 2016-08-31 | 2016-12-07 | 安徽赛福电子有限公司 | A kind of adhesive contact circuit board |
| CN106455319A (en) * | 2016-08-31 | 2017-02-22 | 安徽赛福电子有限公司 | Attracting contact type electronic element pin |
| CN109085721A (en) * | 2018-09-11 | 2018-12-25 | 昆山龙腾光电有限公司 | Backlight module and liquid crystal display device |
| CN109085721B (en) * | 2018-09-11 | 2021-11-16 | 昆山龙腾光电股份有限公司 | Backlight module and liquid crystal display device |
| WO2020107770A1 (en) * | 2018-11-28 | 2020-06-04 | 武汉华星光电技术有限公司 | Area light source backlight module, liquid crystal display panel, and led chip soldering method |
| CN114639311A (en) * | 2022-03-22 | 2022-06-17 | Tcl华星光电技术有限公司 | Display panel and mobile terminal |
| CN114639311B (en) * | 2022-03-22 | 2023-11-28 | Tcl华星光电技术有限公司 | Display panel and mobile terminal |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN202171134U (en) | LED (Light Emitting Diode) light bar, LED and PCB (Printed Circuit Board) | |
| CN203099477U (en) | Seamless connection type light-emitting diode (LED) light bar | |
| CN103912805B (en) | A kind of welding-free type surface-mounted LED lamp structure | |
| TW200733022A (en) | Emissive device and electronic apparatus | |
| CN206130552U (en) | Exempt from to weld high -power LED lamp pearl fixing device of type | |
| CN102217430A (en) | Illumination device comprising two printed circuit boards | |
| CN202501427U (en) | Electronically-conductive connection structure of LED aluminum substrate and driving power supply | |
| CN204026262U (en) | One is exempted to weld LED | |
| CN201606705U (en) | LED lamp tube | |
| CN102128419A (en) | Breakdown protection method of LED (Light-Emitting Diode) light source and LED lamp | |
| CN201339833Y (en) | Packaging structure of surface package type light emitting diode lamp | |
| CN103075644A (en) | LED (light-emitting diode) lamp | |
| CN202032361U (en) | Anti-puncture LED (light-emitting diode) lamp | |
| CN103240481B (en) | Welder's piece installing | |
| CN208886447U (en) | A kind of LED light bar | |
| CN203431562U (en) | LED light source module | |
| CN206628608U (en) | A kind of battery spring lamination and there is its automobile key | |
| CN101872833B (en) | LED signal lamp, PCB (Printed Circuit Board) substrate structure thereof and light source assembly | |
| CN202056797U (en) | LED flexible strip lamp multidirectional connecting plate | |
| CN204372844U (en) | For the fast-assembling wiring construction of LED | |
| CN207990238U (en) | A kind of New LED modular structure | |
| CN219775650U (en) | Welding-free wire lamp | |
| CN202442234U (en) | LED automotive lamp having PCB lamp holder structure | |
| CN203590598U (en) | Direct insertion welding type T-board PCB structure | |
| CN106969301B (en) | A kind of corner button of ceiling lamp |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: JINGDONGFANG SCIENCE AND TECHNOLOGY GROUP CO., LTD Free format text: FORMER OWNER: BEIJING BOE PHOTOELECTRICITY SCIENCE + TECHNOLOGY CO., LTD. Effective date: 20150626 Owner name: BEIJING BOE PHOTOELECTRICITY SCIENCE + TECHNOLOGY Effective date: 20150626 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20150626 Address after: 100015 Jiuxianqiao Road, Beijing, No. 10, No. Patentee after: BOE Technology Group Co., Ltd. Patentee after: Beijing BOE Photoelectricity Science & Technology Co., Ltd. Address before: 100176 Beijing city in Western Daxing District economic and Technological Development Zone, Road No. 8 Patentee before: Beijing BOE Photoelectricity Science & Technology Co., Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120321 |