CN202166929U - Expansion card structure and heat dissipation structure - Google Patents
Expansion card structure and heat dissipation structure Download PDFInfo
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- CN202166929U CN202166929U CN2011202870307U CN201120287030U CN202166929U CN 202166929 U CN202166929 U CN 202166929U CN 2011202870307 U CN2011202870307 U CN 2011202870307U CN 201120287030 U CN201120287030 U CN 201120287030U CN 202166929 U CN202166929 U CN 202166929U
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 52
- 239000000758 substrate Substances 0.000 claims abstract description 26
- 238000010438 heat treatment Methods 0.000 claims abstract description 15
- 238000001816 cooling Methods 0.000 description 11
- 235000012431 wafers Nutrition 0.000 description 11
- 238000010586 diagram Methods 0.000 description 8
- 230000000007 visual effect Effects 0.000 description 8
- 238000013461 design Methods 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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Abstract
An expansion card structure is disclosed, comprising a substrate unit, a support unit, a heat dissipation unit, a first fan unit and a second an unit. The substrate unit comprises a circuit substrate and at least one heating wafer disposed on the circuit substrate. The support unit comprises at least one support frame body disposed on the circuit substrate. The heat dissipation unit comprises at least one heat dissipation module located in the support frame body and disposed on the heating wafer. The first fan unit comprises at least one axial-flow fan disposed on the support frame body. The at least one axial-flow fan is provided with an air inlet and an air outlet, and the air outlet of the at least one axial-flow fan faces the heat dissipation module. The second fan unit comprises at least one centrifugal fan disposed on the support frame body. The centrifugal fan is provided with at least one air inlet and an air outlet, and the air outlet of the at least one centrifugal fan faces the heat dissipation module.
Description
Technical field
The utility model refers to a kind of expansion board structure and radiator structure that uses at least one tubeaxial fan and at least one centrifugal fan simultaneously especially relevant for a kind of expansion board structure and radiator structure thereof.
Background technology
The development of computer equipment and application for communication, information transmission and the economic development of human society now, occupy very important influence power; Carry out CPU, the chip type power integrated circuit of computing in the computer equipment ... or the like, high heat when carrying out computing, can be produced, and arithmetic speed is faster; The heat that is produced is relatively higher; When temperature arrives the allowable temperature value, CPU, chip type power integrated circuit ... the calculation function that waits will be stagnated and can't computing (i.e. machine is worked as in generation), in order to reduce CPU, chip type power integrated circuit ... the temperature that waits; To keep its normal effectively running, various cooling mechanisms have become indispensable servicing unit.
The chip type power integrated circuit is applied to the computer body with the pattern of interface card usually, like display card, pci card, AGP card, TV Tuner card ... or the like, the wafer at its computing center all can produce high heat.For example, display card is the necessary element that electric signal is converted to image, and the VGA Chip in the display card is that heart is carried out in the computing of display card, directly handles the drawing for order that software is sent here, to become the image that is revealed in display picture.Because the profile of image is very big; In order in the shortest time, to manifest image in display picture; To reach instant picture transmission, the data that the reads speed of VGA Chip is very quick, makes VGA Chip itself produce high temperature relatively; So the VGA Chip of display card needs high efficiency heat radiation, can be in subcritical computing temperature to keep VGA Chip.
In general, the radiating mode of various interface card connects airtight combination one heat radiator in the wafer surface of interface card, and in the convection current of the corresponding assembling in the outside of heat radiator one fan with the reinforcement air, to reach needed heat radiation function.Yet the radiating efficiency of the radiator structure of interface card commonly used still can't effectively promote.So, how,, become the important topic of this cause personage institute desire solution to promote the radiating efficiency of radiator structure by the improvement of structure Design and method.
Summary of the invention
The utility model embodiment is to provide a kind of expansion board structure, and it can use at least one tubeaxial fan and at least one centrifugal fan simultaneously.
The utility model embodiment is to provide a kind of radiator structure, and it can use at least one tubeaxial fan and at least one centrifugal fan simultaneously.
The utility model embodiment provides a kind of expansion board structure, and it comprises: a base board unit, a support unit, a heat-sink unit, one first fan unit, and one second fan unit.This base board unit comprises a circuit substrate and at least one heating wafer that is arranged on this circuit substrate.This support unit comprises at least one supporting frame that is arranged on this circuit substrate.This heat-sink unit comprises and at least onely is positioned at above-mentioned at least one supporting frame and is arranged on the radiating module on above-mentioned at least one heating wafer.This first fan unit comprises at least one tubeaxial fan that is arranged on above-mentioned at least one supporting frame; Wherein above-mentioned at least one tubeaxial fan has an air intake opening and a gas outlet, and the gas outlet of above-mentioned at least one tubeaxial fan is towards above-mentioned at least one radiating module.This second fan unit comprises at least one centrifugal fan that is arranged on above-mentioned at least one supporting frame; Wherein above-mentioned at least one centrifugal fan has an at least one air intake opening and a gas outlet, and the gas outlet of above-mentioned at least one centrifugal fan is towards above-mentioned at least one radiating module.
The utility model embodiment provides a kind of radiator structure, and it comprises: a support unit, a heat-sink unit, one first fan unit, and one second fan unit.This support unit comprises at least one supporting frame that is arranged on the circuit substrate.This heat-sink unit comprises and at least onely is positioned at above-mentioned at least one supporting frame and is arranged on the radiating module at least one pyrotoxin of this circuit substrate.This first fan unit comprises at least one tubeaxial fan that is arranged on above-mentioned at least one supporting frame; Wherein above-mentioned at least one tubeaxial fan has an air intake opening and a gas outlet, and the gas outlet of above-mentioned at least one tubeaxial fan is towards above-mentioned at least one radiating module.This second fan unit comprises at least one centrifugal fan that is arranged on above-mentioned at least one supporting frame; Wherein above-mentioned at least one centrifugal fan has an at least one air intake opening and a gas outlet, and the gas outlet of above-mentioned at least one centrifugal fan is towards above-mentioned at least one radiating module.
In sum; Expansion board structure and radiator structure thereof that the utility model embodiment is provided; It can strengthen the convection current of air through the design of " using at least one tubeaxial fan and at least one centrifugal fan simultaneously ", so that the radiating efficiency of expansion board structure of the utility model and radiator structure thereof can be by effective lifting.
For enabling further to understand the characteristic and the technology contents of the utility model, see also following detailed description and accompanying drawing, yet appended graphic reference and the explanation usefulness of only providing not is to be used for to the utility model limitr in addition about the utility model.
Description of drawings
Figure 1A is the wherein perspective exploded view at a visual angle of the utility model expansion board structure.
Figure 1B is the perspective exploded view at an other visual angle of the utility model expansion board structure.
Fig. 2 A is arranged on the part combination synoptic diagram at the wherein visual angle on the base board unit for the utility model heat-sink unit.
Fig. 2 B is arranged on the part combination synoptic diagram at the other visual angle on the base board unit for the utility model heat-sink unit.
Fig. 3 A is arranged on the part combination synoptic diagram at the wherein visual angle on the base board unit for the utility model support unit.
Fig. 3 B is arranged on the part combination synoptic diagram at the other visual angle on the base board unit for the utility model support unit.
Fig. 4 A is the part combination synoptic diagram that the utility model second fan unit is arranged on the wherein visual angle on the support unit.
Fig. 4 B is the part combination synoptic diagram that the utility model second fan unit is arranged on the other visual angle on the support unit.
Fig. 5 A be the utility model first heat dissipation element and second heat dissipation element cooperatively interact on look synoptic diagram.
Fig. 5 B is the schematic side view that the utility model first heat dissipation element and second heat dissipation element cooperatively interact.
Fig. 6 A is the schematic side view that cooling draught that the utility model tubeaxial fan is produced blows to first heat dissipation element.
Fig. 6 B is the schematic side view that cooling draught that the utility model centrifugal fan is produced blows to second heat dissipation element.
Description of reference numerals
Base board unit-1; Circuit substrate-10; Heating wafer-11; Support unit-2; Supporting frame-20; Top-20A; First extension-20B; Second extension-20C; First holding firmware-200; End face opening-201; Front openings-202; Rear openings-203; Left side opening-204; Right openings-205; Heat-sink unit-3; Radiating module-30; First heat dissipation element-30A; First heat radiator-301A; First flow-guiding channel-302A; Second heat dissipation element-30B; Bottom-300B; Second heat radiator-301B; Second flow-guiding channel-302B; Heat pipe-30C; Terminal part-301C; Terminal part-302C; First fan unit-4; Tubeaxial fan-40; Air intake opening-401; Gas outlet-402; Second fan unit-5; Centrifugal fan-50; Second holding firmware-500; Air intake opening-501; Gas outlet-502.
Embodiment
See also shown in Figure 1A to Fig. 4 B; The utility model provides a kind of expansion board structure; It comprises: a base board unit 1, a support unit 2, a heat-sink unit 3, one first fan unit 4, and one second fan unit 5, wherein support unit 2, heat-sink unit 3, first fan unit 4, and second fan unit 5 be combined into a radiator structure.
Please cooperate shown in Figure 1A and Figure 1B, base board unit 1 comprises a circuit substrate 10 and at least one heating wafer 11 (this is pyrotoxin) that is arranged on the circuit substrate 10.For instance, circuit substrate 10 can be one can insert the interior display card of the computer expansion slot of (figure does not show) (figure does not show), and base board unit 1 comprises two heating wafers 11 that are arranged on the circuit substrate 10.Yet the employed base board unit 1 of the utility model does not exceed with the above-mentioned example of being takeed.
Please cooperate Figure 1A, Figure 1B, Fig. 3 A, reach shown in Fig. 3 B, support unit 2 comprises at least one supporting frame 20 that is arranged on the circuit substrate 10.For instance, supporting frame 20 can be made by an insulating material and form.Moreover, supporting frame 20 have a top 20A, one from the wherein end of top 20A to extend below and be positioned on the circuit substrate 10 the first extension 20B, and one from the other end of top 20A to the second extension 20C that extends below and be positioned on the circuit substrate 10.In addition, the top 20A of supporting frame 20 has a plurality of end face openings 201.The first extension 20B of supporting frame 20 has a plurality of front openings 202 and a plurality of first holding firmware 200, and the second extension 20C of supporting frame 20 has a plurality of rear openings 203.In addition, supporting frame 20 further has the right openings 205 between the other end of the wherein left side opening 204 between the end and at least one an other end and the second extension 20C at the first extension 20B of at least one wherein terminal and second extension 20C at the first extension 20B.Yet the employed support unit 2 of the utility model does not exceed with the above-mentioned example of being takeed.
Please cooperate Figure 1A, Figure 1B, Fig. 2 A, Fig. 2 B, Fig. 3 A, and Fig. 3 B shown in, heat-sink unit 3 comprises and at least onely is positioned at supporting frame 20 and is arranged on the radiating module 30 on the wafer 11 that generates heat.For instance, radiating module 30 comprises at least one first heat dissipation element 30A and at least one second heat dissipation element 30B that is arranged at the first heat dissipation element 30A bottom, and the bottom surface of the second heat dissipation element 30B is attached on the heating wafer 11.In addition, radiating module 30 comprises a plurality of heat pipe 30C, and the wherein terminal part 301C of each heat pipe 30C passes the first heat dissipation element 30A, and the other terminal part 302C of each heat pipe 30C is arranged between the second heat dissipation element 30B and the heating wafer 11.Therefore; The heat that heating wafer 11 is produced not only can be through each second heat dissipation element 30B to be delivered to the first heat dissipation element 30A; And the heat that produced of heating wafer 11 also can be through each heat pipe 30C being delivered to the first heat dissipation element 30A, and then can increase the radiating effect of the utility model.Yet the employed heat-sink unit 3 of the utility model does not exceed with the above-mentioned example of being takeed.
Please cooperate Figure 1A, Figure 1B, Fig. 3 A, reach shown in Fig. 3 B, first fan unit 4 comprises above-mentioned at least one tubeaxial fan 40 that is arranged on the supporting frame 20.For instance, the utility model is explained with 3 tubeaxial fans 40 as an example.Each tubeaxial fan 40 has an air intake opening 401 and a gas outlet 402, and the gas outlet 402 of each tubeaxial fan 40 is towards radiating module 30.The top 20A that above-mentioned a plurality of tubeaxial fan 40 can be fixed in supporting frame 20 goes up and respectively corresponding above-mentioned a plurality of end face openings 201; And the air intake opening 401 of each tubeaxial fan 40 is communicated in each corresponding end face opening 201; Therefore the cooling draught introduced of each tubeaxial fan 40 can vertically pass through air intake opening 401 and gas outlet 402 in regular turn, with the heat radiation (mainly being used for removing the heat that is delivered on the first heat dissipation element 30A) of carrying out radiating module 30.Yet the employed tubeaxial fan 40 of the utility model does not exceed with the above-mentioned example of being takeed.
Please cooperate Figure 1A, Figure 1B, Fig. 4 A, reach shown in Fig. 4 B, second fan unit 5 comprises at least one centrifugal fan 50 that is arranged on the supporting frame 20.For instance, the utility model is explained with 3 centrifugal fans 50 as an example.Each centrifugal fan 50 has an at least one air intake opening 501 and a gas outlet 502, and the gas outlet 502 of each centrifugal fan 50 is towards radiating module 3.Each centrifugal fan 50 has at least two and corresponds respectively to wherein second holding firmware 500 of two first holding firmwares 200; Therefore above-mentioned a plurality of centrifugal fans 50 can be through the mutual fixing of per two first holding firmwares 200 (for example fixing slot) with per two second holding firmwares 500 (for example fixing body); The first extension 20B to be fixed in supporting frame 20 goes up and corresponds respectively to above-mentioned a plurality of front openings 202; And the gas outlet 502 of each centrifugal fan 50 is communicated in each corresponding front openings 202; Therefore the cooling draught introduced of each centrifugal fan 50 can pass through air intake opening 501 and gas outlet 502 in regular turn via the mode that turn 90 degrees, with the heat radiation (mainly being used for removing the heat that is delivered on the second heat dissipation element 30B) of carrying out radiating module 30.Certainly, according to different design requirement, each centrifugal fan 50 also can be set up another and the air intake opening in the opposite direction (figure does not show) of air intake opening 501, also is that each centrifugal fan 50 can have two corresponding air intake openings, with the increase air inflow.Yet the employed centrifugal fan 50 of the utility model does not exceed with the above-mentioned example of being takeed.
See also shown in Fig. 5 A and Fig. 5 B, Fig. 5 A be the first heat dissipation element 30A and the second heat dissipation element 30B on look synoptic diagram, Fig. 5 B is the schematic side view of the first heat dissipation element 30A and the second heat dissipation element 30B.
Can know that by Fig. 5 A the first heat dissipation element 30A comprises the first heat radiator 301A of a plurality of specific ranges separated from one another, and form at least one first flow-guiding channel 302A between per two first heat radiator 301A.Moreover; Since above-mentioned shape each form in the first flow-guiding channel 302A between per two first heat radiator 301A can be directly towards the gas outlet 402 (shown in cooperation Fig. 3 A and Fig. 3 B) of tubeaxial fan 40; So the cooling draught that tubeaxial fan 40 is produced can directly pass through the corresponding first flow-guiding channel 302A, to take away the heat that conducts on above-mentioned a plurality of first heat radiator 301A.
Can know that by Fig. 5 B the second heat dissipation element 30B comprises a bottom 300B and a plurality of 300B extends upward and the second heat radiator 301B of a specific range separated from one another from the bottom, and form at least one second flow-guiding channel 302B between per two second heat radiator 301B.Moreover; Since above-mentioned each form in the second flow-guiding channel 302B between per two second heat radiator 301B can be directly towards the gas outlet 502 (shown in cooperation Fig. 3 A and Fig. 3 B) of centrifugal fan 50; So the cooling draught that centrifugal fan 50 is produced can directly pass through the corresponding second flow-guiding channel 302B, to take away the heat that conducts on above-mentioned a plurality of second heat radiator 301B.
See also shown in Fig. 6 A the schematic side view of the cooling air that it is produced for the utility model tubeaxial fan.Because the gas outlet 402 of each tubeaxial fan 40 can be towards radiating module 30; So the cooling draught that each tubeaxial fan 40 is introduced can get into to blow to the first heat dissipation element 30A (shown in vertical arrow) from end face opening 201 earlier; And then leaving (shown in the arrow of level) from left side opening 204 and right openings 205 respectively, the heat that absorbed by the first heat dissipation element 30A this moment will be cooled air-flow to being taken away.
See also shown in Fig. 6 B, its cooling air that is produced for the utility model centrifugal fan blows to the schematic side view of second heat dissipation element.Because the gas outlet 502 of each centrifugal fan 50 can be towards radiating module 3; So the cooling draught that each centrifugal fan 50 is introduced can get into to blow to the second heat dissipation element 30B (shown in vertical arrow) from front openings 202 earlier; And then leaving (shown in the arrow of level) from rear openings 203, the heat that absorbed by the second heat dissipation element 30B this moment air-flow that will be cooled is taken away.
(the possible effect of embodiment)
In sum; Expansion board structure and radiator structure thereof that the utility model embodiment is provided; It can strengthen the convection current of air through the design of " using at least one tubeaxial fan and at least one centrifugal fan simultaneously ", so that the radiating efficiency of expansion board structure of the utility model and radiator structure thereof can be by effective lifting.
More than be illustrative to the description of the utility model; And it is nonrestrictive; Those skilled in the art is understood, and within spirit that claim limits and scope, can carry out many modifications, variation or equivalence to it, but they will fall in the protection domain of the utility model all.
Claims (18)
1. an expansion board structure is characterized in that, comprising:
One base board unit, it comprises a circuit substrate and at least one heating wafer that is arranged on this circuit substrate;
One support unit, it comprises at least one supporting frame that is arranged on this circuit substrate;
One heat-sink unit, it comprises and at least onely is positioned at said at least one supporting frame and is arranged on the radiating module on said at least one heating wafer;
One first fan unit; It comprises at least one tubeaxial fan that is arranged on said at least one supporting frame; Wherein said at least one tubeaxial fan has an air intake opening and a gas outlet, and the gas outlet of said at least one tubeaxial fan is towards said at least one radiating module; And
One second fan unit; It comprises at least one centrifugal fan that is arranged on said at least one supporting frame; Wherein said at least one centrifugal fan has an at least one air intake opening and a gas outlet, and the gas outlet of said at least one centrifugal fan is towards said at least one radiating module.
2. expansion board structure as claimed in claim 1; It is characterized in that; Said at least one supporting frame have a top, one from the wherein end at this top to extend below and be positioned on this circuit substrate first extension, and one from the other end at this top to second extension that extends below and be positioned on this circuit substrate; Said at least one tubeaxial fan is fixed on the top of said at least one supporting frame, and said at least one centrifugal fan is fixed on first extension of said at least one supporting frame.
3. expansion board structure as claimed in claim 2; It is characterized in that; The top of said at least one supporting frame has a plurality of end face openings that correspond respectively to said at least one tubeaxial fan, and the air intake opening of said at least one tubeaxial fan is communicated in each corresponding end face opening.
4. expansion board structure as claimed in claim 2; It is characterized in that; First extension of said at least one supporting frame has a plurality of front openings corresponding to said at least one centrifugal fan; Second extension of said at least one supporting frame has a plurality of rear openings corresponding to said a plurality of front openings, and the gas outlet of said at least one centrifugal fan is communicated in each corresponding front openings.
5. expansion board structure as claimed in claim 4; It is characterized in that said at least one supporting frame has the right openings between the other end of the wherein left side opening between the end and at least one an other end and this second extension at this first extension of at least one wherein terminal and this second extension at this first extension.
6. expansion board structure as claimed in claim 1; It is characterized in that; Said at least one radiating module comprises that at least one correspondence is arranged at said at least one first heat dissipation element bottom and corresponding to second heat dissipation element of said at least one centrifugal fan in first heat dissipation element of said at least one tubeaxial fan and at least one, and the bottom surface of said at least one second heat dissipation element is attached on said at least one heating wafer.
7. expansion board structure as claimed in claim 6; It is characterized in that; Said at least one first heat dissipation element comprises first heat radiator of a plurality of specific ranges separated from one another, forms at least one side between per two first heat radiator to first flow-guiding channel of the gas outlet of this tubeaxial fan.
8. expansion board structure as claimed in claim 6; It is characterized in that; Said at least one second heat dissipation element comprises that a bottom and a plurality of extends upward from this bottom and second heat radiator of a specific range separated from one another, and forms at least one side between per two second heat radiator to second flow-guiding channel of the gas outlet of this centrifugal fan.
9. expansion board structure as claimed in claim 6; It is characterized in that; Said at least one radiating module comprises a plurality of heat pipes; A wherein terminal part of each heat pipe passes said at least one first heat dissipation element, and an other terminal part of each heat pipe is arranged between said at least one second heat dissipation element and the said at least one heating wafer.
10. a radiator structure is characterized in that, comprising:
One support unit, it comprises at least one supporting frame that is arranged on the circuit substrate;
One heat-sink unit, it comprises and at least onely is positioned at said at least one supporting frame and is arranged on the radiating module at least one pyrotoxin of this circuit substrate;
One first fan unit; It comprises at least one tubeaxial fan that is arranged on said at least one supporting frame; Wherein said at least one tubeaxial fan has an air intake opening and a gas outlet, and the gas outlet of said at least one tubeaxial fan is towards said at least one radiating module; And
One second fan unit; It comprises at least one centrifugal fan that is arranged on said at least one supporting frame; Wherein said at least one centrifugal fan has an at least one air intake opening and a gas outlet, and the gas outlet of said at least one centrifugal fan is towards said at least one radiating module.
11. radiator structure as claimed in claim 10; It is characterized in that; Said at least one supporting frame have a top, one from the wherein end at this top to extend below and be positioned on this circuit substrate first extension, and one from the other end at this top to second extension that extends below and be positioned on this circuit substrate; Said at least one tubeaxial fan is fixed on the top of said at least one supporting frame, and said at least one centrifugal fan is fixed on first extension of said at least one supporting frame.
12. radiator structure as claimed in claim 11; It is characterized in that; The top of said at least one supporting frame has a plurality of end face openings that correspond respectively to said at least one tubeaxial fan, and the air intake opening of said at least one tubeaxial fan is communicated in each corresponding end face opening.
13. radiator structure as claimed in claim 11; It is characterized in that; First extension of said at least one supporting frame has a plurality of front openings corresponding to said at least one centrifugal fan; Second extension of said at least one supporting frame has a plurality of rear openings corresponding to said a plurality of front openings, and the gas outlet of said at least one centrifugal fan is communicated in each corresponding front openings.
14. radiator structure as claimed in claim 13; It is characterized in that said at least one supporting frame has the right openings between the other end of the wherein left side opening between the end and at least one an other end and this second extension at this first extension of at least one wherein terminal and this second extension at this first extension.
15. radiator structure as claimed in claim 10; It is characterized in that; Said at least one radiating module comprises that at least one correspondence is arranged at said at least one first heat dissipation element bottom and corresponding to second heat dissipation element of said at least one centrifugal fan in first heat dissipation element of said at least one tubeaxial fan and at least one, and the bottom surface of said at least one second heat dissipation element is attached on said at least one pyrotoxin.
16. radiator structure as claimed in claim 15; It is characterized in that; Said at least one first heat dissipation element comprises first heat radiator of a plurality of specific ranges separated from one another, forms at least one side between per two first heat radiator to first flow-guiding channel of the gas outlet of this tubeaxial fan.
17. radiator structure as claimed in claim 15; It is characterized in that; Said at least one second heat dissipation element comprises that a bottom and a plurality of extends upward from this bottom and second heat radiator of a specific range separated from one another, and forms at least one side between per two second heat radiator to second flow-guiding channel of the gas outlet of this centrifugal fan.
18. radiator structure as claimed in claim 15; It is characterized in that; Said at least one radiating module comprises a plurality of heat pipes; A wherein terminal part of each heat pipe passes said at least one first heat dissipation element, and an other terminal part of each heat pipe is arranged between said at least one second heat dissipation element and the above-mentioned at least one pyrotoxin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202870307U CN202166929U (en) | 2011-08-09 | 2011-08-09 | Expansion card structure and heat dissipation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202870307U CN202166929U (en) | 2011-08-09 | 2011-08-09 | Expansion card structure and heat dissipation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202166929U true CN202166929U (en) | 2012-03-14 |
Family
ID=45802744
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011202870307U Expired - Fee Related CN202166929U (en) | 2011-08-09 | 2011-08-09 | Expansion card structure and heat dissipation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202166929U (en) |
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2011
- 2011-08-09 CN CN2011202870307U patent/CN202166929U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: COOLER MASTER INTERNATIONAL CO., LTD. Free format text: FORMER OWNER: XUNKAI INTERNATIONAL CO., LTD. Effective date: 20131115 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20131115 Address after: Chinese Taiwan New Taipei City Patentee after: Cooler Master International Co., Ltd. Address before: Taiwan County, Taipei, China Patentee before: Xunkai International Co., Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120314 Termination date: 20140809 |
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| EXPY | Termination of patent right or utility model |