CN202159709U - 一种低温共烧陶瓷led基板结构 - Google Patents
一种低温共烧陶瓷led基板结构 Download PDFInfo
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- CN202159709U CN202159709U CN2011202572030U CN201120257203U CN202159709U CN 202159709 U CN202159709 U CN 202159709U CN 2011202572030 U CN2011202572030 U CN 2011202572030U CN 201120257203 U CN201120257203 U CN 201120257203U CN 202159709 U CN202159709 U CN 202159709U
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CN2011202572030U CN202159709U (zh) | 2011-07-20 | 2011-07-20 | 一种低温共烧陶瓷led基板结构 |
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CN2011202572030U CN202159709U (zh) | 2011-07-20 | 2011-07-20 | 一种低温共烧陶瓷led基板结构 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106058030A (zh) * | 2016-07-29 | 2016-10-26 | 王汉清 | 一种半导体发光单元散热结构的制造方法 |
CN106098920A (zh) * | 2016-07-29 | 2016-11-09 | 王汉清 | 一种半导体发光单元的散热结构 |
CN110708866A (zh) * | 2019-11-14 | 2020-01-17 | 苏师大半导体材料与设备研究院(邳州)有限公司 | 一种陶瓷导热式电路板 |
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2011
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106058030A (zh) * | 2016-07-29 | 2016-10-26 | 王汉清 | 一种半导体发光单元散热结构的制造方法 |
CN106098920A (zh) * | 2016-07-29 | 2016-11-09 | 王汉清 | 一种半导体发光单元的散热结构 |
CN106098920B (zh) * | 2016-07-29 | 2018-08-31 | 上海贺鸿电子科技股份有限公司 | 一种半导体发光单元的散热结构 |
CN106058030B (zh) * | 2016-07-29 | 2019-01-01 | 江苏天煌照明集团有限公司 | 一种led发光单元散热结构的制造方法 |
CN110708866A (zh) * | 2019-11-14 | 2020-01-17 | 苏师大半导体材料与设备研究院(邳州)有限公司 | 一种陶瓷导热式电路板 |
CN110708866B (zh) * | 2019-11-14 | 2020-11-13 | 苏师大半导体材料与设备研究院(邳州)有限公司 | 一种陶瓷导热式电路板 |
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Effective date of registration: 20200317 Address after: 322118 No.42, Wansheng street, Hengdian Town, Dongyang City, Jinhua City, Zhejiang Province Patentee after: hengdian group holding co ltd Address before: 200050 No. 1295 Dingxi Road, Shanghai, Changning District Patentee before: SHANGHAI INSTITUTE OF CERAMICS, CHINESE ACADEMY OF SCIENCES |
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Effective date of registration: 20201113 Address after: 5 / F, 42 Wansheng street, Hengdian Town, Dongyang City, Jinhua City, Zhejiang Province Patentee after: Zhejiang silicon ceramic technology Co., Ltd Address before: 322118 No.42, Wansheng street, Hengdian Town, Dongyang City, Jinhua City, Zhejiang Province Patentee before: hengdian group holding Co.,Ltd. |
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Granted publication date: 20120307 |
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