CN202145463U - Light emitting diode - Google Patents
Light emitting diode Download PDFInfo
- Publication number
- CN202145463U CN202145463U CN 201120218414 CN201120218414U CN202145463U CN 202145463 U CN202145463 U CN 202145463U CN 201120218414 CN201120218414 CN 201120218414 CN 201120218414 U CN201120218414 U CN 201120218414U CN 202145463 U CN202145463 U CN 202145463U
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- CN
- China
- Prior art keywords
- emitting diode
- light
- glue envelope
- light output
- particle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility model relates to a light emitting diode, comprising a support, a luminous wafer arranged on the support, and a glue sealer wrapping the luminous wafer on the support, wherein the light outgoing surface of the glue sealer is plane, the light outgoing surface of the glue sealer is provided with a plurality of micro lenses used for light transmission, and the micro lenses are formed by curve-surface particles arranged on the light outgoing surface of the glue sealer. The light emitting diode can enable the light loss caused by total reflection of the outgoing surface to be reduced by using the micro lenses thereby improving the light outgoing efficiency of the light emitting diode.
Description
Technical field
The utility model relates to light-emitting diode, relates in particular to the structure of the light output surface of light-emitting diode.
Background technology
The semiconductor lighting industry is risen in the whole world, and LED (light-emitting diode) becomes the focus that attracts the attention of millions of people.But LED will really can replace incandescent lamp and fluorescent lamp and get into general illumination market, and the reduction of its cost also depends on the lifting of light efficiency.And the lifting of light efficiency except the lifting that requires LED wafer quantum efficiency, also need adopt the structure of more optimizing to be lifted out optical efficiency simultaneously in the LED encapsulation process.
Referring to Fig. 1; Present high-power LED; The LED of area source type particularly; Generally include a support 1, be arranged on the luminescent wafer 2 on this support 1, the pin 3 that is electrically connected with luminescent wafer 2 and this luminescent wafer 2 is coated on the glue envelope 4 on this support 1, the light output surface 41 of this glue envelope 4 is planes.This existing structure; When the light L0 that luminescent wafer 2 sends shines in the outside air through glue envelope 4; Because the difference of glue envelope 4 and outside air refractive index when most smooth L1 can launch, has part light L2 at the interface of glue envelope 4 with outside air; Just light output surface 41 places quilt causes light loss to internal reflection.LED gluewater for packaging refractive index by generally is 1.53 calculating, and the light loss that then causes owing to surperficial total reflection is: Δ=(
) 2=4.38%.
The utility model content
The technical problem that the utility model will solve is to overcome the deficiency that above-mentioned prior art exists, and proposes a kind of encapsulating structure of light-emitting diode, can reduce the light loss that causes owing to the light output surface total reflection, thereby promotes the light extraction efficiency of light-emitting diode.
The technical scheme that the utility model proposes to above-mentioned technical problem comprises; A kind of light-emitting diode is proposed; Comprise a support, be arranged on the luminescent wafer on this support and this luminescent wafer is coated on the glue envelope on this support; The light output surface of this glue envelope is a plane, and the light output surface of this glue envelope is provided with a plurality of micro lens in order to printing opacity, and this micro lens is to be made up of the curved surface particle on the light output surface that is arranged on this glue envelope.
This curved surface particle is the hemispherical particle that protrudes in the light output surface of this glue envelope.
The diameter of this curved surface particle is 0.01-2mm.
Interval between curved surface particle and the curved surface particle is more than or equal to 0.01mm.
Interval between curved surface particle and the curved surface particle is smaller or equal to 2mm.
This curved surface particle is identical with the material of this glue envelope.
This micro lens is to adopt spray art to take shape on the light output surface of this glue envelope.
This micro lens is to adopt printing or print on the light output surface that technology takes shape in this glue envelope.
This micro lens is to adopt chemical etching process to take shape on the light output surface of this glue envelope.
This micro lens is to adopt the laser lithography technological forming on the light output surface of this glue envelope.
Compared with prior art; The beneficial effect of the light-emitting diode of the utility model comprises: the light output surface through this glue envelope is provided with a plurality of micro lens in order to printing opacity; Utilize these micro lens can reduce the light loss that causes owing to the light output surface total reflection, thereby promote the light extraction efficiency of light-emitting diode.
Description of drawings
Fig. 1 is the profile of the encapsulating structure of existing light-emitting diode.
Fig. 2 is the profile of encapsulating structure of the light-emitting diode embodiment of the utility model.
Fig. 3 is the vertical view of encapsulating structure of the light-emitting diode embodiment of the utility model.
Embodiment
Below in conjunction with accompanying drawing, the utility model is given elaboration further.
As shown in Figures 2 and 3; One preferred embodiment of the encapsulating structure of the light-emitting diode embodiment of the utility model; This light-emitting diode comprises a support 1, is arranged on the luminescent wafer 2 on this support 1, the pin 3 that is electrically connected with luminescent wafer 2 and this luminescent wafer 2 is coated on the glue envelope 4 on this support 1; The light output surface 41 of this glue envelope 4 is planes; The light output surface 41 of this glue envelope 4 is provided with a plurality of micro lens 5 in order to printing opacity, and this micro lens 5 is to be made up of the curved surface particle on the light output surface 41 that is arranged on this glue envelope 4.
This curved surface particle is the hemispherical particle that protrudes in the light output surface 41 of this glue envelope 4.A kind of feasible moulding process of these hemispherical particles roughly comprises: select spraying to use glue, this glue employing LED gluewater for packaging or selection are identical or close with LED gluewater for packaging refractive index, in conjunction with good, and do not have bad chemical reaction; Utilizing atomising device, is that vaporific granular size is at 0.01-1mm through the adjustment jet size; Above-mentioned vaporific particle spray coating on the LED surface, through adjustment spray amount and spray time, is made to keep the 0.02-1mm spacing between the particle; The support that will spray vaporific particle is put into baking box, adopts suitable temperature, makes vaporific particle form the dome-type micro-structural at surface cure.
Compared with prior art; The beneficial effect that the light-emitting diode of the utility model has comprises: through form surface micro camera lens 5 structures of 0.01-2mm diameter at the light output surface 41 of this glue envelope 4; These micro lens 5 structures adopt the glue of or close refractive index same with the packaging plastic water, can reduce the shooting angle of light, reduce the occurrence probability of total reflection; Promote the light extraction efficiency of LED, but do not influence the macrostructure of LED; Further, adopt the mode moulding of spraying, simple and practical, and low-cost.
Foregoing; Be merely the preferred embodiment of the utility model; It is not the embodiment that is used to limit the utility model; Those of ordinary skills can carry out corresponding flexible or modification very easily according to the main design and the spirit of the utility model, such as: adopt printing or printing, chemical etching or laser lithography technology to substitute above-mentioned spray art with moulding micro lens 5; Again such as: adopt other through calculating can fine bright dipping complex-curved particle substitute above-mentioned hemispherical particle, so the protection range of the utility model should be as the criterion with the desired protection range of claims.
Claims (10)
1. light-emitting diode; It comprises a support, be arranged on the luminescent wafer on this support and this luminescent wafer is coated on the glue envelope on this support; The light output surface of this glue envelope is a plane; It is characterized in that the light output surface of this glue envelope is provided with a plurality of micro lens in order to printing opacity, this micro lens is to be made up of the curved surface particle on the light output surface that is arranged on this glue envelope.
2. according to the described light-emitting diode of claim 1, it is characterized in that this curved surface particle is the hemispherical particle that protrudes in the light output surface of this glue envelope.
3. according to the described light-emitting diode of claim 2, it is characterized in that the diameter of this curved surface particle is 0.01-2mm.
4. according to the described light-emitting diode of claim 3, it is characterized in that the interval between curved surface particle and the curved surface particle is more than or equal to 0.01mm.
5. according to the described light-emitting diode of claim 4, it is characterized in that the interval between curved surface particle and the curved surface particle is smaller or equal to 2mm.
6. according to the described light-emitting diode of claim 1, it is characterized in that this curved surface particle is identical with the material of this glue envelope.
7. according to the arbitrary described light-emitting diode of claim 1 to 6, it is characterized in that this micro lens is to adopt spray art to take shape on the light output surface of this glue envelope.
8. according to the arbitrary described light-emitting diode of claim 1 to 6, it is characterized in that this micro lens is to adopt printing or print on the light output surface that technology takes shape in this glue envelope.
9. according to the arbitrary described light-emitting diode of claim 1 to 6, it is characterized in that this micro lens is to adopt chemical etching process to take shape on the light output surface of this glue envelope.
10. according to the arbitrary described light-emitting diode of claim 1 to 6, it is characterized in that this micro lens is to adopt the laser lithography technological forming on the light output surface of this glue envelope.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120218414 CN202145463U (en) | 2011-06-24 | 2011-06-24 | Light emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120218414 CN202145463U (en) | 2011-06-24 | 2011-06-24 | Light emitting diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202145463U true CN202145463U (en) | 2012-02-15 |
Family
ID=45581392
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201120218414 Expired - Lifetime CN202145463U (en) | 2011-06-24 | 2011-06-24 | Light emitting diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202145463U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107658376A (en) * | 2017-09-11 | 2018-02-02 | 聚灿光电科技（宿迁）有限公司 | A kind of adopting surface mounted LED encapsulates particle |
-
2011
- 2011-06-24 CN CN 201120218414 patent/CN202145463U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107658376A (en) * | 2017-09-11 | 2018-02-02 | 聚灿光电科技（宿迁）有限公司 | A kind of adopting surface mounted LED encapsulates particle |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120215 |