CN202137483U - Automatic soldering mechanism for electronic circuit board - Google Patents
Automatic soldering mechanism for electronic circuit board Download PDFInfo
- Publication number
- CN202137483U CN202137483U CN201120201801U CN201120201801U CN202137483U CN 202137483 U CN202137483 U CN 202137483U CN 201120201801 U CN201120201801 U CN 201120201801U CN 201120201801 U CN201120201801 U CN 201120201801U CN 202137483 U CN202137483 U CN 202137483U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- pipeline
- electronic circuit
- automatic soldering
- soldering mechanism
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model relates to the technical field of the machinery, particularly to an automatic soldering mechanism for an electronic circuit board. The automatic soldering mechanism for the electronic circuit board comprises a pipeline and a tin storing box, and is characterized in that: a pipeline is arranged between mobile assembly lines; the pipeline is provided with a plurality of air holes; and the tin storing box is arranged below the pipeline. Compared with the prior art, the automatic soldering mechanism for the electronic circuit board is added with an automatic soldering mechanism and can finish the soldering operation of the elements on the circuit board at one time; the temperature is controlled by temperature; the damage of the elements is reduced; and the production efficiency is increased greatly.
Description
Technical field
The utility model relates to field of mechanical technique, is the automatic soldering mechanism of electronic circuit board specifically.
Background technology
When the tradition workman carries out soldering to the components and parts on the wiring board, all be that speed slowly influences production efficiency so by hand with welding rod with soldering in the circuit board.
Summary of the invention
The utility model is the deficiency that overcomes prior art, and providing can be fast and soldering mechanism automatically, increases work efficiency greatly.
Be to realize above-mentioned purpose, the automatic soldering mechanism of design electronic circuit board comprises pipeline, Chu Xixiang, and it is characterized in that: be provided with pipeline between the moving assemly line, pipeline is provided with some pores, and the pipeline below is provided with Chu Xixiang.
The utility model is compared with prior art, has increased automatic soldering mechanism, can be with the disposable completion soldering of the components and parts on wiring board operation, and temperature control temperature reduces the damage of components and parts, has improved production efficiency greatly.
Description of drawings
Fig. 1 is the utility model structural representation.
Referring to Fig. 1,1 is moving assemly line, and 2 is pore, and 3 is pipeline, and 4 is Chu Xixiang.
The specific embodiment
According to accompanying drawing the utility model is done further explanation below.
As shown in Figure 1, wiring board moves on moving assemly line 1, and pipeline 3 is provided with some pores 2; Liquid tin is stamped by cylinder, emits venthole 2, when wiring board moves on the pipeline; Liquid tin can be attached on the copper sheet at the wiring board back side automatically, so just accomplishes the disposable completion soldering of the components and parts operation on the wiring board, and excess liquid tin flows in the storage tin case 4 recycle; So not only shorten the time, and reduced the damage of components and parts, improved production efficiency greatly.
Claims (1)
1. the automatic soldering mechanism of an electronic circuit board comprises pipeline, Chu Xixiang, and it is characterized in that: be provided with pipeline (3) between the moving assemly line (1), pipeline (3) is provided with some pores (2), and pipeline (3) below is provided with Chu Xixiang (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120201801U CN202137483U (en) | 2011-06-15 | 2011-06-15 | Automatic soldering mechanism for electronic circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120201801U CN202137483U (en) | 2011-06-15 | 2011-06-15 | Automatic soldering mechanism for electronic circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202137483U true CN202137483U (en) | 2012-02-08 |
Family
ID=45548561
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201120201801U Expired - Lifetime CN202137483U (en) | 2011-06-15 | 2011-06-15 | Automatic soldering mechanism for electronic circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202137483U (en) |
-
2011
- 2011-06-15 CN CN201120201801U patent/CN202137483U/en not_active Expired - Lifetime
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120208 |