CN202129514U - Multilayer diamond electroplated file - Google Patents
Multilayer diamond electroplated file Download PDFInfo
- Publication number
- CN202129514U CN202129514U CN201120193610U CN201120193610U CN202129514U CN 202129514 U CN202129514 U CN 202129514U CN 201120193610 U CN201120193610 U CN 201120193610U CN 201120193610 U CN201120193610 U CN 201120193610U CN 202129514 U CN202129514 U CN 202129514U
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- China
- Prior art keywords
- diamond
- file
- heat radiation
- chip area
- argyle
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- Expired - Fee Related
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Abstract
The utility model relates to a multilayer diamond electroplated file which is mainly used for grinding various cutters and hard materials. The multilayer diamond electroplated file comprises a diamond file substrate (1), wherein the thickness of the diamond file substrate (1) is 7.5-8.5mm; honeycomb-shaped heat dissipating chip grooves (3) or argyle heat dissipating chip grooves (4) are arranged on two working surfaces of the diamond file substrate(1); multiple layers of diamond particles (2) are electroplated in the center areas of the honeycomb-shaped heat dissipating chip grooves (3) or argyle heat dissipating chip grooves (4) from internal to external; and the particle size of the multiple layers of diamond particles sequentially increases by degrees from internal to external. During grinding, diamonds at the highest point of a working surface begins to work first, and then other diamonds begin to work gradually, so that the multiple layers of diamonds on the diamond file participate in grinding; and the initial contact surfaces of the diamonds during working are smaller, so that the grinding resistance can be reduced, therefore, the service life of the diamonds can be prolonged.
Description
Technical field
The utility model relates to a kind of diamond file.Be specifically related to a kind of multi-layer plating diamond file.Be mainly used in the grinding of various cutters and hard material.Belong to the jewelling tool technical field.
Background technology
The diamond file that uses in producing at present generally is to utilize multi-layer sintering or individual layer electroplating technology to make; Abrasive particle is by mechanically embedding, is embedded in the binder course; Hold is little, and work in-process causes abrasive material to come off too early because of hold is not enough easily, causes waste.On the other hand, abrasive material is a random distribution in sintering and plating tool, and the proud exposure of abrasive particle is not high, and chip space is less, and the adhesion that when grinding, is easy to generate abrasive dust is stopped up, and reduces the processing characteristics and the service life of instrument.
Summary of the invention
The purpose of the utility model is to overcome above-mentioned deficiency, provides that a kind of ground effect is good, the multi-layer plating diamond of long service life file.
The purpose of the utility model is achieved in that a kind of multi-layer plating diamond file; Comprise diamond file matrix; Said diamond file matrix thickness is 7.5～8.5mm; Two working surfaces at diamond file matrix are provided with cellular decorative pattern heat radiation chip area or Argyle heat radiation chip area, are electroplate with the multilayer diamond grains from the inside to the outside at cellular decorative pattern heat radiation chip area or Argyle heat radiation chip area middle section, and the granularity of multilayer diamond grains increases progressively from the inside to the outside successively.
When grinding, the diamond of working face peak is started working earlier, and each diamond of back progressively adds work, makes the diamond file go up the multilayer diamond and participates in grinding, and the initial contact area during diamond work is less, can reduce grinding resistance, thereby can improve the service life of diamond.
The beneficial effect of the utility model is:
1, electroplates the multilayer diamond grains, the service life of improving diamond.
2, adopt cellular or Argyle helps chip removal and heat radiation, improve the service life of multi-layer plating diamond file.
Through abovementioned technology, the rasion of the utility model multi-layer plating diamond is cut effective, and cost is low, long service life.
Description of drawings
Fig. 1 is the floor map one of the utility model multi-layer plating diamond file.
Fig. 2 is the partial enlarged drawing of Fig. 1.
Fig. 3 is the floor map two of the utility model multi-layer plating diamond file.
Fig. 4 is the partial enlarged drawing of Fig. 3.
Reference numeral among the figure:
Diamond grains 2
Cellular decorative pattern heat radiation chip area 3
Argyle heat radiation chip area 4.
The specific embodiment
Referring to Fig. 1 ~ 4, Fig. 1 is the floor map one of the utility model multi-layer plating diamond file.Fig. 2 is the partial enlarged drawing of Fig. 1.Fig. 3 is the floor map two of the utility model multi-layer plating diamond file.Fig. 4 is the partial enlarged drawing of Fig. 3.Can find out by Fig. 1, Fig. 2, Fig. 3 and Fig. 4; The utility model multi-layer plating diamond file; Comprise diamond file matrix 1; Diamond file matrix 1 thickness is 7.5～8.5mm, and two working surfaces making smooth with a file matrix 1 at diamond are provided with cellular decorative pattern heat radiation chip area 3 or Argyle heat radiation chip area 4, and the length of the cellular decorative pattern of wherein cellular decorative pattern heat radiation chip area 3 is that 15mm, width are that 10.5mm, thickness are 0.5mm; The Argyle length of Argyle heat radiation chip area 4 is that 5mm, width are that 5mm, thickness are 0.5mm; Cellular decorative pattern heat radiation chip area 3 or Argyle heat radiation chip area 4 middle sections at a working surface are electroplate with two-layer diamond grains 2 from the inside to the outside, inside and outside the granularity of two-layer diamond grains 2 be followed successively by: 170/200,140/170; Cellular decorative pattern heat radiation chip area 3 or Argyle heat radiation chip area 4 middle sections at another working surface are electroplated two-layer diamond grains 2 from the inside to the outside, inside and outside the granularity of two-layer diamond grains 2 be followed successively by: 325/400,270/325.The electro-plating method of said diamond grains is:
(1) diamond grains is carried out roughened,
(2) in bond, add manganese, form nickel, cobalt, manganese ternary alloy three-partalloy, add the nanometer diamond powder again simultaneously and be deposited in the bond,
(3) in plating bath, add nanometer diamond powder and cationic surfactant, process nanometer diamond powder suspension.
Step 2, diamond file matrix is carried out multi-layer plating.
Claims (2)
1. a multi-layer plating diamond is made smooth with a file; Comprise diamond file matrix (1); It is characterized in that: said diamond file matrix (1) thickness is 7.5～8.5mm; Two working surfaces at diamond file matrix (1) are provided with cellular decorative pattern heat radiation chip area (3) or Argyle heat radiation chip area (4); Be electroplate with multilayer diamond grains (2) from the inside to the outside at cellular decorative pattern heat radiation chip area (3) or Argyle heat radiation chip area (4) middle section, the granularity of multilayer diamond grains (2) increases progressively from the inside to the outside successively.
2. a kind of multi-layer plating diamond file according to claim 1, it is characterized in that: the length of the cellular decorative pattern of said cellular decorative pattern heat radiation chip area (3) is that 15mm, width are that 10.5mm, thickness are 0.5mm; The Argyle length of Argyle heat radiation chip area (4) is that 5mm, width are that 5mm, thickness are 0.5mm; Cellular decorative pattern heat radiation chip area (3) or Argyle heat radiation chip area (4) middle section at a working surface are electroplate with two-layer diamond grains (2) from the inside to the outside, inside and outside the granularity of two-layer diamond grains (2) be followed successively by: 170/200,140/170; Cellular decorative pattern heat radiation chip area (3) or Argyle heat radiation chip area (4) middle section at another working surface are electroplated two-layer diamond grains (2) from the inside to the outside, inside and outside the granularity of two-layer diamond grains (2) be followed successively by: 325/400,270/325.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120193610U CN202129514U (en) | 2011-06-10 | 2011-06-10 | Multilayer diamond electroplated file |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120193610U CN202129514U (en) | 2011-06-10 | 2011-06-10 | Multilayer diamond electroplated file |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202129514U true CN202129514U (en) | 2012-02-01 |
Family
ID=45518301
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201120193610U Expired - Fee Related CN202129514U (en) | 2011-06-10 | 2011-06-10 | Multilayer diamond electroplated file |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202129514U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102744463A (en) * | 2012-07-16 | 2012-10-24 | 奇瑞汽车股份有限公司 | Clearing tool for welding slag in car sliding door guide rail |
| CN103722241A (en) * | 2013-11-27 | 2014-04-16 | 铜陵市经纬流体科技有限公司 | Rotary file |
-
2011
- 2011-06-10 CN CN201120193610U patent/CN202129514U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102744463A (en) * | 2012-07-16 | 2012-10-24 | 奇瑞汽车股份有限公司 | Clearing tool for welding slag in car sliding door guide rail |
| CN102744463B (en) * | 2012-07-16 | 2015-06-10 | 奇瑞汽车股份有限公司 | Clearing tool for welding slag in car sliding door guide rail |
| CN103722241A (en) * | 2013-11-27 | 2014-04-16 | 铜陵市经纬流体科技有限公司 | Rotary file |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120201 Termination date: 20150610 |
|
| EXPY | Termination of patent right or utility model |