CN202127552U - Fixture for solder levelling of PCB (printed circuit board) finished small board - Google Patents

Fixture for solder levelling of PCB (printed circuit board) finished small board Download PDF

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Publication number
CN202127552U
CN202127552U CN 201120229240 CN201120229240U CN202127552U CN 202127552 U CN202127552 U CN 202127552U CN 201120229240 CN201120229240 CN 201120229240 CN 201120229240 U CN201120229240 U CN 201120229240U CN 202127552 U CN202127552 U CN 202127552U
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CN
China
Prior art keywords
titanium
thick stick
board
pcb
lever
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN 201120229240
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Chinese (zh)
Inventor
王志武
谢伦魁
刘赟
Original Assignee
Shenzhen Kinwong Electronic Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Kinwong Electronic Co Ltd filed Critical Shenzhen Kinwong Electronic Co Ltd
Priority to CN 201120229240 priority Critical patent/CN202127552U/en
Application granted granted Critical
Publication of CN202127552U publication Critical patent/CN202127552U/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

The utility model discloses a fixture for the solder levelling of a PCB (printed circuit board) finished small board and relates to the technical field of the fixture for the solder levelling operation of the PCB finished small board. A reference lever 1 is regulated to a required position through a reference lever slide wail 2 and is locked by a reference lever fixing lock 3; a board to be produced is clamped by a titanium lever 4 through a titanium lever slide rail 6 and the titanium lever 4 is locked by a titanium lever fixing lock 5; then the fixture for the solar levelling of the PCB finished small board is fixed on a hook of a solder levelling machine through a fixture positioning hole 7; and finally, the fixed vertical solder levelling can be carried out. An inner cross edge at the top of a titanium frame is set into a sawtooth shape. An inner cross edge of the reference lever 1 is set into a sawtooth shape. An inward edge of the titanium lever 4 is set into a sawtooth shape. After the fixture for the solar levelling of the PCB finished small board, which is provided by the utility model, is adopted, the quality problems of damage to the finished small board, solder accumulation of a pad at the edge of the board, damage caused by pulling to the positioning hole in the board and the like cannot be caused.

Description

PCB finished product platelet Tin spray clamp tool
Technical field:
The utility model relates to employed a kind of anchor clamps in the PCB production process, refers more particularly to the anchor clamps of a kind of PCB of being used for finished product platelet spray tin operation.
Background technology:
Vertical at present spray tin is the normal surface treatment mode that adopts in the PCB manufacturing process; Usually adopt edges of boards instrument hook hole to locate to whole plate (having edges of boards and the location hole on the edges of boards effective unit outside) and the mode of edges of boards assist location is accomplished spray tin; And after PCB is shaped to production board; Because of edges of boards and the location hole that does not have outside effective unit positions; When production board need return the processing of spray tin because of quality problem; Be prone to cause that plate damages, location hole such as pulls at quality problem in the edges of boards pad heap tin, plate, the adjustment equipment job parameter (air knife pressure, air knife angle, guide rail spacing etc.) of being correlated with all can't effectively be improved, so the finished product platelet can't guarantee vertically to spray the tin operation under the qualify requirement.
The vertical spray tin difficult point of known finished product platelet: be that mainly production board does not have the edges of boards outside effective unit, and do not have the stationary positioned hole outside effective unit, do not satisfy vertical spray tin operating condition.Industry processing mode commonly used does before, and (1) manual tin that drags is repaired: this kind mode efficient low relatively (in the time of particularly need repairing) to large tracts of land, and quality is unstable; (2) usually platelet spray tin mode operation: utilize in the effective unit of finished product platelet the mode of location, non-metallic hole and effective edges of boards assist location to accomplish vertical spray tin; This kind returns the spray mode and is prone to cause quality problem such as plate damages, the edges of boards pad is piled tin, the interior location hole of plate is pulled, and acceptance rate is only less than 50%.
The PCB finished product platelet Tin spray clamp tool that the utility model provides carries out the operation of fixed vertical spray tin, can not cause the damage and edges of boards pad heap tin of finished product platelet, and the interior location hole of plate quality problem such as pulls, and acceptance rate reaches 98%.
Summary of the invention:
For realizing above-mentioned purpose, the utility model mainly adopts following technical scheme:
Said PCB finished product platelet Tin spray clamp tool adopts the titanium mount structure, and a removable benchmark thick stick is established in the centre, and two slide rails are arranged on the longitudinal edge of titanium frame, and the benchmark thick stick can move up and down according to the size of plate;
Said PCB finished product platelet Tin spray clamp tool, the titanium arch is provided with the titanium thick stick of two slips, and titanium arch horizontal edge is provided with two slide rails, and the titanium thick stick can move left and right;
Said PCB finished product platelet Tin spray clamp tool, the interior horizontal edge of titanium arch is set as zigzag, and the interior horizontal edge of benchmark thick stick is set as zigzag, and the titanium thick stick is set as zigzag on inner edge;
Compared with prior art; The described PCB finished product of the utility model platelet Tin spray clamp tool; The mode that adopts clamps vertically to spray tin can not cause the damage and edges of boards pad heap tin of finished product platelet, and the interior location hole of plate such as pulls at quality problem; PCB finished product platelet spray tin yield is guaranteed, and vertically sprays the tin yield and can reach 98%.
Description of drawings:
Fig. 1 is the utility model structural representation.
Identifier declaration among the figure: benchmark thick stick 1, benchmark thick stick slide rail 2, benchmark thick stick pin 3, titanium thick stick 4, titanium thick stick pin 5, titanium thick stick slide rail 6, anchor clamps location hole 7.
Embodiment:
The core concept of the utility model is: described PCB finished product platelet Tin spray clamp tool; Through establishing a movably benchmark thick stick, the titanium arch is provided with the titanium thick stick of two slips, and the interior horizontal edge of titanium arch is set as zigzag; The interior horizontal edge of benchmark thick stick is set as zigzag, and the titanium thick stick is set as zigzag on inner edge.Carry out the operation of fixed vertical spray tin, can not cause the damage and edges of boards pad heap tin of finished product platelet, and the interior location hole of plate quality problem such as pulls, acceptance rate reaches 98%.
For setting forth the thought and the purpose of the utility model, will combine accompanying drawing and specific embodiment that the utility model is done further explanation below.
Shown in accompanying drawing, the described PCB finished product of the utility model platelet Tin spray clamp tool has been drawn together: benchmark thick stick 1, benchmark thick stick slide rail 2, benchmark thick stick pin 3, titanium thick stick 4, titanium thick stick pin 5, titanium thick stick slide rail 6, anchor clamps location hole 7.
Said PCB finished product platelet Tin spray clamp tool, concrete operations situation following steps:
At first measure and wait to produce plate length and width degree, plate to be produced is put into PCB finished product platelet Tin spray clamp tool, benchmark thick stick 1 is transferred to the position that needs through benchmark thick stick slide rail 2; And lock with benchmark thick stick pin 3; Titanium thick stick 4 clamps plate to be produced through titanium thick stick slide rail 6, and locks with titanium thick stick pin 5, then through anchor clamps location hole 7; PCB finished product platelet Tin spray clamp tool is fixed in the tin-spraying machine extension purchases, just can just carry out fixed vertical spray tin at last.The interior horizontal edge of titanium arch is set as zigzag, and the interior horizontal edge of benchmark thick stick 1 is set as zigzag, and titanium thick stick 4 is set as jagged purpose on inner edge, is in order when spraying tin, to guarantee certain gap, can not produce edges of boards heap tin.
More than the PCB finished product platelet Tin spray clamp tool that the utility model provided has been carried out detailed introduction; Used concrete example among this paper the principle and the execution mode of the utility model are set forth, the explanation of above embodiment just is used to help to understand the method and the core concept thereof of the utility model; Simultaneously, for one of ordinary skill in the art, according to the thought of the utility model, the part that on embodiment and range of application, all can change, in sum, this description should not be construed as the restriction to the utility model.

Claims (5)

1.PCB finished product platelet Tin spray clamp tool is characterized in that comprising the benchmark thick stick, the cross bar in the middle of described benchmark thick stick is arranged on.
2. PCB finished product platelet Tin spray clamp tool according to claim 1 is characterized in that also comprising benchmark thick stick slide rail, and described benchmark thick stick slide rail is arranged on two slide rails of the longitudinal edge of titanium frame, and the benchmark thick stick can be moved up and down.
3. PCB finished product platelet Tin spray clamp tool according to claim 1 is characterized in that also comprising the titanium thick stick, and described titanium thick stick is arranged on the short vertical pole of titanium arch.
4. PCB finished product platelet Tin spray clamp tool according to claim 1 is characterized in that also comprising titanium thick stick slide rail, and described titanium thick stick slide rail is arranged on two slide rails of titanium arch horizontal edge, makes the titanium thick stick can move left and right.
5. PCB finished product platelet Tin spray clamp tool according to claim 1 is characterized in that described engrail is that the interior horizontal edge of titanium arch is set as zigzag, and the interior horizontal edge of benchmark thick stick is set as zigzag, and the titanium thick stick is set as zigzag on inner edge.
CN 201120229240 2011-06-30 2011-06-30 Fixture for solder levelling of PCB (printed circuit board) finished small board Expired - Lifetime CN202127552U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201120229240 CN202127552U (en) 2011-06-30 2011-06-30 Fixture for solder levelling of PCB (printed circuit board) finished small board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201120229240 CN202127552U (en) 2011-06-30 2011-06-30 Fixture for solder levelling of PCB (printed circuit board) finished small board

Publications (1)

Publication Number Publication Date
CN202127552U true CN202127552U (en) 2012-01-25

Family

ID=45490612

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201120229240 Expired - Lifetime CN202127552U (en) 2011-06-30 2011-06-30 Fixture for solder levelling of PCB (printed circuit board) finished small board

Country Status (1)

Country Link
CN (1) CN202127552U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107231758A (en) * 2017-06-02 2017-10-03 惠州市金百泽电路科技有限公司 A kind of small size returns spray tin method without hanging hole pcb board
CN109366395A (en) * 2018-12-07 2019-02-22 昆山兢美电子科技有限公司 A kind of pcb board test rapid jigs

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107231758A (en) * 2017-06-02 2017-10-03 惠州市金百泽电路科技有限公司 A kind of small size returns spray tin method without hanging hole pcb board
CN107231758B (en) * 2017-06-02 2019-04-16 惠州市金百泽电路科技有限公司 A kind of small size returns spray tin method without hanging hole pcb board
CN109366395A (en) * 2018-12-07 2019-02-22 昆山兢美电子科技有限公司 A kind of pcb board test rapid jigs

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee

Owner name: SHENZHEN KINWONG ELECTRONIC CO., LTD.

Free format text: FORMER NAME: KINGWONG ELECTRONICS (SHENZHEN) CO., LTD.

CP01 Change in the name or title of a patent holder

Address after: 518126, No. 166, Reservoir Road, iron Gang village, West Village, Shenzhen, Guangdong, Baoan District

Patentee after: Shenzhen Kinwong Electronic Co., Ltd.

Address before: 518126, No. 166, Reservoir Road, iron Gang village, West Village, Shenzhen, Guangdong, Baoan District

Patentee before: Kinwong Electronic (Shenzhen) Co., Ltd.

CX01 Expiry of patent term

Granted publication date: 20120125

CX01 Expiry of patent term