CN202120891U - Power transistor heat radiation apparatus - Google Patents

Power transistor heat radiation apparatus Download PDF

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Publication number
CN202120891U
CN202120891U CN2011201826237U CN201120182623U CN202120891U CN 202120891 U CN202120891 U CN 202120891U CN 2011201826237 U CN2011201826237 U CN 2011201826237U CN 201120182623 U CN201120182623 U CN 201120182623U CN 202120891 U CN202120891 U CN 202120891U
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CN
China
Prior art keywords
power transistor
circuit board
fin
screw
metal platen
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN2011201826237U
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Chinese (zh)
Inventor
孙本新
张永岐
Original Assignee
BEIJING EPSOLAR TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BEIJING EPSOLAR TECHNOLOGY Co Ltd filed Critical BEIJING EPSOLAR TECHNOLOGY Co Ltd
Priority to CN2011201826237U priority Critical patent/CN202120891U/en
Application granted granted Critical
Publication of CN202120891U publication Critical patent/CN202120891U/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

Disclosed is a power transistor heat radiation apparatus, comprising a screw, a plastic briquetting, a metal pressure plate, a circuit board, a power transistor, and a radiating fin, wherein the metal pressure plate, the plastic briquetting, the circuit board, the power transistor, and the radiating fin are sequentially arranged; the metal pressure plate, the circuit board, and the radiating fin are provided with screw holes at the corresponding position; and the screw passes through the screw holes of the metal pressure plate, the circuit board, and the radiating fin. With the technical scheme of this utility model, the power transistor can be made to well contact with the radiating fin, thereby achieving the best conductive and heat radiating effect. Moreover, the circuit board is unlikely to bend or deform.

Description

A kind of power transistor heat abstractor
Technical field
The utility model relates to the electronic switching device technical field, relates in particular to a kind of power transistor heat abstractor.
Background technology
Power transistor is as a kind of electronic switching device, makes simply, and it is convenient to isolate, and good temp characteristic has advantages such as anti-irradiation, low in energy consumption and speed is fast, is widely used in fields such as computer, communication, the energy, electromechanical instrument, automation appliance.
Being applied in when improving system reliability and response speed of power transistor, its problem that reliably reaches quick heat radiating just seems particularly important.If power transistor can not in time dispel the heat, can influence the stability of system works, even produce serious consequence.
Common power transistor heat radiation is through screw power transistor to be pressed on fin surface simply, power transistor is contacted with fin surface, thereby carry out the efficiently radiates heat of power transistor.Although this radiating mode is simple in structure; But can not guarantee on the circuit board that all power transistors can both compacted and good heat radiating; And in order to seek better radiating effect; Just must compress power transistor, but can impact the circuit board mechanical performance like this, make circuit board gross distortion even scrap through tightening fixed screw.
The utility model content
The purpose of the utility model is to propose a kind of power transistor heat abstractor, can power transistor be touched fin well, reaches optimized heat loss through conduction effect.
For reaching this purpose, the utility model adopts following technical scheme:
A kind of power transistor heat abstractor; Comprise screw, plastics briquetting, metal platen, circuit board, power transistor and fin; Metal platen, plastics briquetting, circuit board, power transistor and fin are arranged in order; The position that metal platen, circuit board and fin are corresponding is provided with screw, and screw passes the screw of metal platen, circuit board and fin.
The upper end of two plastics briquettings is installed on the metal platen two ends, and plastics briquetting lower end is most advanced and sophisticated, with the power transistor corresponding position hole with the most advanced and sophisticated identical size of plastics briquetting is set on the circuit board.
Adopt the technical scheme of the utility model, not only can power transistor have been touched fin well, reached optimized heat loss through conduction effect, and solved the easy diastrophic problem of circuit board well.
Description of drawings
Fig. 1 is a power transistor construction for heat radiating device sketch map in the utility model embodiment.
Fig. 2 is a partial cross section sketch map in the power transistor heat abstractor in the utility model embodiment.
Embodiment
Further specify the technical scheme of the utility model below in conjunction with accompanying drawing and through embodiment.
Fig. 1 is a power transistor construction for heat radiating device sketch map in the utility model embodiment.Fig. 2 is a partial cross section sketch map in the power transistor heat abstractor in the utility model embodiment.As depicted in figs. 1 and 2, this power transistor heat abstractor comprises screw 1, plastics briquetting 2, metal platen 3, circuit board 4, power transistor 5 and fin 6.
Metal platen, plastics briquetting, circuit board, power transistor and fin are arranged in order, and the position that metal platen, circuit board and fin are corresponding is provided with screw, and screw passes the screw of metal platen, circuit board and fin.The upper end of two plastics briquettings is installed on the metal platen two ends, and plastics briquetting lower end is most advanced and sophisticated, with the power transistor corresponding position hole with the most advanced and sophisticated identical size of plastics briquetting is set on the circuit board.
When the beginning trip bolt; The rotation of advancing of screw drives metal platen and moves to the fin direction, and the plastics briquetting also begins to move to the fin direction simultaneously, and a slice metal platen drives two plastics briquettings and moves; And active force is positioned at the center; So two plastics briquettings are evenly stressed, the plastics briquetting has played cushioning effect between metal platen and circuit board, has well solved the easy diastrophic problem of circuit board.
Two holes that can freely pass through the same most advanced and sophisticated size of plastics briquetting are arranged on circuit board; When the plastics briquetting pushes downwards; The tip pass the hole touch power transistor and drive its to the fin direction near; And make power transistor touch fin well through constantly tightening screw, reached optimized heat loss through conduction effect.
The above; Be merely the preferable embodiment of the utility model; But the protection range of the utility model is not limited thereto; Anyly be familiar with this technological people in the technical scope that the utility model disclosed, the variation that can expect easily or replacement all should be encompassed within the protection range of the utility model.Therefore, the protection range of the utility model should be as the criterion with the protection range of claim.

Claims (2)

1. power transistor heat abstractor; It is characterized in that; Comprise screw, plastics briquetting, metal platen, circuit board, power transistor and fin; Metal platen, plastics briquetting, circuit board, power transistor and fin are arranged in order, and the position that metal platen, circuit board and fin are corresponding is provided with screw, and screw passes the screw of metal platen, circuit board and fin.
2. a kind of power transistor heat abstractor according to claim 1; It is characterized in that; The upper end of two plastics briquettings is installed on the metal platen two ends, and plastics briquetting lower end is most advanced and sophisticated, with the power transistor corresponding position hole with the most advanced and sophisticated identical size of plastics briquetting is set on the circuit board.
CN2011201826237U 2011-06-01 2011-06-01 Power transistor heat radiation apparatus Expired - Lifetime CN202120891U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2011201826237U CN202120891U (en) 2011-06-01 2011-06-01 Power transistor heat radiation apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011201826237U CN202120891U (en) 2011-06-01 2011-06-01 Power transistor heat radiation apparatus

Publications (1)

Publication Number Publication Date
CN202120891U true CN202120891U (en) 2012-01-18

Family

ID=45461932

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011201826237U Expired - Lifetime CN202120891U (en) 2011-06-01 2011-06-01 Power transistor heat radiation apparatus

Country Status (1)

Country Link
CN (1) CN202120891U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107517560A (en) * 2016-06-16 2017-12-26 上海安浦鸣志自动化设备有限公司 A kind of fixing device of power tube

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107517560A (en) * 2016-06-16 2017-12-26 上海安浦鸣志自动化设备有限公司 A kind of fixing device of power tube

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee
CP01 Change in the name or title of a patent holder

Address after: 100085 Haidian District, Beijing information industry base on the 3rd Street, building two, floor A, No. 228, paragraph

Patentee after: BEIJING EPSOLAR TECHNOLOGY CO., LTD.

Address before: 100085 Haidian District, Beijing information industry base on the 3rd Street, building two, floor A, No. 228, paragraph

Patentee before: Beijing Epsolar Technology Co., Ltd.

CX01 Expiry of patent term
CX01 Expiry of patent term

Granted publication date: 20120118