CN203277351U

CN203277351U - Thermal conduction and radiation compressing structure of power transistor

Info

Publication number: CN203277351U
Application number: CN 201320204271
Authority: CN
Inventors: 孙本新
Original assignee: BEIJING EPSOLAR TECHNOLOGY Co Ltd
Current assignee: Beijing Epsolar Technology Co ltd
Priority date: 2013-04-20
Filing date: 2013-04-20
Publication date: 2013-11-06
Anticipated expiration: 2023-04-20

Abstract

A thermal conduction and radiation compressing structure of power transistors is characterized by comprising, from top to bottom, a metal pressure plate, multiple plastic supports equipped with spring sheets, a circuit board, power transistors and a heat radiator, wherein the circuit board is provided with through holes corresponding to the plastic supports equipped with the spring sheets; the power transistors are disposed below the through holes; the multiple plastic supports equipped with the spring sheets are connected into a whole through an intermediate shaft; screws penetrate through the metal pressure plate, the intermediate shaft, the circuit board and the heat radiator from top to bottom, and fix the integral structure into a whole. The thermal conduction and radiation compressing structure of power transistors solves a problem of a conventional product can only compress a single one or two power transistors, and at the same time, the introduction of the spring sheets helps to effectively improve buffer capability, and thus optimum thermal conduction and radiation can be achieved.

Description

Power transistor heat loss through conduction compressing structure

Technical field

The utility model belongs to the electronic switching device field.

Background technology

Power transistor as a kind of electronic switching device, is made simply, and isolation is convenient, good temp characteristic.Have the advantages such as anti-irradiation, low in energy consumption and speed is fast, be widely used in the fields such as computer, communication, the energy, electromechanical instrument, automation appliance.

Being applied in when improving system reliability and response speed of power transistor, its problem that reliably reaches quick heat radiating seems particularly important.Can not in time dispel the heat to affect the stability of system works, even produces serious consequence.

During common power transistor heat radiation, just be screwed simply circuit board, in the time of fixing, power transistor be pressed on spreader surface, power transistor is contacted with spreader surface, thereby carry out the efficiently radiates heat of power transistor.Although this radiating mode is simple in structure, but can not guarantee on the circuit board plate that all power transistors can compacted and good heat radiating, and in order to seek better radiating effect, just can only compress power transistor by tightening fixed screw, but can impact the circuit board mechanical performance, make the circuit board gross distortion even scrap.So, although this mode is simple and practical, be not best radiating mode.

Summary of the invention

Power transistor heat loss through conduction compressing structure comprises from top to bottom successively: metal platen, a plurality of plastic stent with spring leaf, wiring board, power transistor and radiator;

Have through hole corresponding to plastic stent bottom with spring leaf on wiring board; A plurality of plastic stents with spring leaf are linked to be an integral body by jack shaft; Screw passes metal platen, jack shaft, wiring board, power transistor and radiator from top to bottom, and total is fixing as a whole.

Can only be to single or two problems that power transistor compresses before the utility model has effectively solved, importing simultaneously spring leaf can effectively improve buffer capacity, has reached optimized heat loss through conduction.

Description of drawings

Power transistor heat loss through conduction compressing structure schematic diagram in Fig. 1 the utility model

In figure: 1, screw; 2, metal platen; 3, spring leaf; 4, plastic stent; 5, circuit board; 6, power transistor; 7, radiator

Fig. 2 the utility model power transistor heat loss through conduction compressing structure vertical view

Fig. 3 the utility model power transistor heat loss through conduction compressing structure front view

Power transistor heat loss through conduction compressing structure end view in Fig. 4 the utility model

In Fig. 5 the utility model, power transistor passes in the heat radiation compressing structure with the vertical view of spring leaf plastic stent

In figure: 11, jack shaft; 12,, with the plastic stent of spring leaf

Embodiment:

As shown above, be the novel heat loss through conduction compressing structure of the newly designed power transistor of our company.

Now as follows with regard to its structure description:

Whole radiator structure is comprised of screw, metal platen, spring leaf, plastic stent, circuit board, power transistor and radiator.Wherein, spring leaf is injection-moulded in plastic stent.As shown in the figure, piece of metal pressing plate both sides are pressed 21 plastic stents altogether, and the quantity of plastic stent can be adjusted according to the actual conditions of circuit board.All supports are to link together by jack shaft, form an integral body; The position of 3 screws is on jack shaft and equidistantly distributes.Its assembling sequence also as shown in the figure, when the beginning trip bolt, the advancing of screw rotarily drives metal platen and moves to the radiator direction, when pressing spring leaf, metal platen cause plastic stent also to begin to move to the radiator direction, metal platen is whole to be moved to plastic stent, its active force is positioned at the center, thus both sides spring leaf uniform stressed, spring leaf compressing support-moving.The plastic stent that has added spring leaf has played good cushioning effect between metal platen and circuit board, well solved again the easy diastrophic problem of circuit board simultaneously.The hole that can freely pass through the corresponding size in plastic stent bottom is arranged on circuit board, when plastic stent pushes downwards, the tip is passed the position, hole and is touched power tube and drive that it is close to the radiator direction, and make power transistor touch well radiator by constantly tightening screw, reached optimized heat loss through conduction.

Can only single or two problems that power transistor compresses be imported simultaneously spring leaf and can effectively improve buffer capacity before the utility model has effectively solved, buffer capacity does not have the compressing structure of spring leaf can improve 40% left and right relatively.

Above-mentioned example of making is common embodiment of the present utility model, and the simple change of doing in the utility model claim or modification all should belong to covering scope of the present utility model.

Claims

1. power transistor heat loss through conduction compressing structure, is characterized in that: comprise successively from top to bottom: metal platen, a plurality of plastic stent with spring leaf, wiring board, power transistor and radiator;

Have through hole corresponding to plastic stent bottom with spring leaf on wiring board; Power transistor is placed on below described through hole; A plurality of plastic stents with spring leaf are linked to be an integral body by jack shaft; Screw passes metal platen, jack shaft, wiring board and radiator from top to bottom, and total is fixing as a whole.