CN202111937U - Flexible printing wiring board, and connection structure and electronic equipment thereof - Google Patents
Flexible printing wiring board, and connection structure and electronic equipment thereof Download PDFInfo
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- CN202111937U CN202111937U CN2011201360805U CN201120136080U CN202111937U CN 202111937 U CN202111937 U CN 202111937U CN 2011201360805 U CN2011201360805 U CN 2011201360805U CN 201120136080 U CN201120136080 U CN 201120136080U CN 202111937 U CN202111937 U CN 202111937U
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- flexible printing
- printing distributing
- distributing board
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Abstract
The utility model provides a flexible printing wiring board, and a connection structure and electric equipment thereof. The flexible printing wiring board (10) is provided with: an electrode connection area (S) located on one surface of both surfaces of the flexible printing wiring board (10) to allow electrodes (2a) to be exposed, and a wiring circuit (13 (2b, 3b)) located on the other surface opposite to the electrode connection area (S). By arranging a blind hole (h) at a position, when viewing downwards, overlapped with the electrodes (2a) located in the electrode connection area (S), the electrodes (2a) are connected with the wiring circuit (13) in an electric conduction mode, and in the electrode connection area on one surface there is not provided a wiring circuit, and thereby ACF is used to effectively connect the electrodes with each other in an electric conduction mode, and simultaneously the connection structure is miniaturized.
Description
Technical field
The utility model relates to a kind of flexible printing distributing board, its joint construction and electronic equipment; More particularly, relate to and a kind ofly can when utilizing anisotropic conductive film (ACF:Anisotropic Conductive Film) that electrode is connected with electrically conducting manner each other, realize flexible printing distributing board, its joint construction of miniaturization and the electronic equipment that uses them.
Background technology
In electronic equipments such as portable terminal; Use a plurality of flexible printing distributing boards; In this electronic equipment, the electrode of flexible printing distributing board is connected, or the electrode of flexible printing distributing board and the electrode of miscellaneous part is connected with electrically conducting manner with electrically conducting manner each other.For these portable terminals etc., seek miniaturization always, also pursue miniaturization for the joint construction of the electrode of flexible printing distributing board.
For the high efficiency of tackling manufacturing approach and the requirement of above-mentioned miniaturization, the method (with reference to TOHKEMY 2004-119063 communique) that a kind of electrode with 2 flexible printing distributing boards utilizes anisotropic conductive film (ACF) to connect with electrically conducting manner has each other been proposed.In the conduction of utilizing ACF to carry out connects, through by 2 electrode zone clamping ACF that expose above-mentioned electrode and carry out heating and pressurizing, thereby each electrode is connected with electrically conducting manner each other.Thus, can realize miniaturization to a certain extent efficiently with the electrode of the flexible printing distributing board while connected to one another.
In electronic equipments such as portable terminal, be used to dispose the flexible printing distributing board and the space set is more and more littler.Therefore, need make especially and utilize ACF that electrode structure connected to one another is diminished.But,, then have the limit aspect diminishing at the joint construction that makes electrode if use the flexible printing distributing board of the electrode structure of prior art.
The utility model content
The purpose of the utility model is, the electronic equipment that a kind of flexible printing distributing board, its joint construction is provided and uses them, and it can make this joint construction miniaturization when utilizing ACF efficiently electrode to be connected with electrically conducting manner each other.
The flexible printing distributing board of the utility model is the double-faced flexible printing distributing board with electrode.This flexible printing distributing board is characterised in that to have: the electrode join domain, and it is arranged on the two-sided face, and electrode is exposed; And wiring circuit, it is positioned on another face with electrode join domain opposition side.And, with the blind hole that is arranged in the electrode position overlapped place of electrode join domain, this electrode is connected with electrically conducting manner with wiring circuit when overlooking through being arranged on, in the electrode join domain on a face wiring circuit is not set.
According to said structure, electrode is exposed in face side, wiring circuit is arranged at the back side, utilize via hole to be connected at the electrode of face side and the wiring circuit of rear side with electrically conducting manner.Therefore, need not to worry the short circuit between the wiring circuit, the conduction that can concentrate between the electrode connects.And in the prior art, have to for example all distributions is parallel and slenderly arrange with the consecutive wiring circuit of electrode end.
Expose in the front through the electrode that only makes as noted above, thereby need not to consider to prevent the short circuit between the distribution end, can make the miniaturization of electrode join domain.In addition, owing to utilize blind hole to connect the wiring circuit of the sharp rear side of the electrode of face side,, realize firm connection so can make electrode smooth.For connecting between the electrode that utilizes ACF to carry out, it is important not only being electrically connected, and it also is important that a flexible printing distributing board and another flexible printing distributing board (perhaps miscellaneous part) are carried out mechanical connection.Be that the conduction of on the basis of carrying out mechanical connection securely, carrying out connects.Under this connotation, can make electrode smooth and form firm connection this point and have very large meaning.
Above-mentioned result is, can utilize ACF to form the joint construction between the electrode efficiently, realizes miniaturization simultaneously, and can make the joint construction that utilizes ACF to form be imbued with durability.In addition, because ACF is an expensive component, thus seek inhibition to area, but, can help to suppress the cost of ACF according to said structure.
Can the electrode of above-mentioned flexible printing distributing board be connected with electrically conducting manner across ACF with the electrode of miscellaneous part or the electrode of another above-mentioned flexible printing distributing board.Thus, can obtain miniaturization efficiently and be imbued with the joint construction of durability.
The electronic equipment of the utility model is characterised in that to have the joint construction of above-mentioned flexible printing distributing board or above-mentioned flexible printing distributing board.Thus, can obtain comprising economy excellence, firmly and the electronic equipment of the flexible printing distributing board joint construction of miniaturization.
The manufacturing approach of the flexible printing distributing board of the utility model is characterised in that to have following operation, prepares to have in the two-sided laminated of basic unit the operation of the copper plating film plywood of Copper Foil that is:; Formation run through the copper plating film plywood a face Copper Foil and basic unit and with the Copper Foil of another face operation as the blind hole of bottom; Form the operation of the coat of metal with mode along the Copper Foil of a blind hole and a face; Pattern forms operation; In this operation; Through the coat of metal of a face and the Copper Foil of Copper Foil and another face are carried out etching; Thereby the coat of metal and Copper Foil by a face form the wiring circuit pattern, and in the zone of another face corresponding with blind hole, form electrode pattern by the Copper Foil of another face; And vacate the zone that electrode pattern is positioned at, attach an insulating barrier that covers a face, and the operation of another side insulating barrier that covers the wiring circuit pattern of another face.
According to said method, can use the flexible printing distributing board of the joint construction that existing flow process simply and at an easy rate obtains utilizing ACF to form small-sized and excellent in te pins of durability efficiently.As above-mentioned insulating barrier, can use cover film (cover lay film), insulative resin (for example polyimide resin) layer etc.
The manufacturing approach of the joint construction of the flexible printing distributing board of the utility model is to use the flexible printing distributing board through the manufacturing approach manufacturing of above-mentioned flexible printing distributing board, the joint construction of manufacturing flexible printing distributing board.The method is characterized in that; Electrode pattern zone with a face of flexible printing distributing board; And have with the miscellaneous part of the electrode pattern of the electrode pattern aligned in position of this flexible printing distributing board or with the state of this electrode pattern aligned in position of the flexible printing distributing board of this flexible printing distributing board identical type under, carry out crimping across ACF.
According to said method, can obtain being imbued with the joint construction of durability and miniaturization efficiently.
According to the utility model, can obtain following joint construction, that is, it utilizes ACF efficiently electrode to be connected with electrically conducting manner each other, and has realized miniaturization, and durability and economy are excellent.
Description of drawings
Fig. 1 is the vertical view of flexible printing distributing board in the execution mode 1 of expression the utility model.
Fig. 2 is the profile along the II-II line of the flexible printing distributing board of Fig. 1.
Fig. 3 illustrates the concrete example of miniaturization of the electrode join domain of flexible printing distributing board,
Fig. 3 (a) is the figure of expression the utility model example, and in addition, Fig. 3 (b) is the figure of the existing example of expression.
Fig. 4 illustrates the manufacturing approach of the flexible printing distributing board shown in Fig. 1 and 2; Fig. 4 (a) is the figure of the two-sided copper plating film plywood of expression; Fig. 4 (b) is the figure that is illustrated in the state after the perforate on the Copper Foil of rear side; Fig. 4 (c) is that expression utilizes laser beam to offer the figure of the state of blind hole, and Fig. 4 (d) is the figure of the state behind the expression formation copper coating.
Fig. 5 (a) is that expression utilizes wet etching to form electrode pattern in face side, and side forms the figure of the state behind the wiring circuit pattern overleaf, and Fig. 5 (b) is the figure that expression is fitted with the state behind the overlay tree adipose membrane of band bonding agent.
Fig. 6 is the vertical view of joint construction of the flexible printing distributing board in the execution mode 2 of expression the utility model.
Fig. 7 is the profile along the VII-VII line of joint construction of the flexible printing distributing board of Fig. 6.
Embodiment
Below, the execution mode of the utility model is described.In addition, in description of drawings,, omit repeat specification for identical element mark same numeral.In addition, the dimensional ratios of accompanying drawing might not be consistent with illustrated content.
(execution mode 1-flexible printing distributing board-)
Fig. 1 is the vertical view of flexible printing distributing board 10 in the execution mode 1 of expression the utility model.In flexible printing distributing board 10, be provided with electrode join domain S.In Fig. 1, in electrode join domain S, the state configuration of exposing not to be capped resin molding 6 coatings has 4 electrode 2a, but in fact is arranged with more electrode.This flexible printing distributing board 10 is double-faced flexible printing distributing boards, is provided with above-mentioned electrode 2a in the front, and in addition, side is provided with wiring circuit 13 overleaf.The wiring circuit 13 of rear side utilizes the copper coating 3b that passes blind hole h and is connected with electrically conducting manner with positive electrode 2a from rear side.
Fig. 2 is the profile along the flexible printing distributing board 10 of the II-II line of Fig. 1.Face side in the basic unit that is made up of polyimide film 1 is provided with electrode join domain S, in this electrode join domain S, is provided with electrode (pattern) 2a.Do not cover bond layer 5 and overlay tree adipose membrane 6 on the electrode join domain S, electrode 2a all exposes.Electrode 2a is formed by Copper Foil.
On the other hand, the rear side in basic unit 1 through constituting the material of wiring circuit 2b, 3b by Copper Foil and copper coating, and is formed with wiring circuit (pattern) 13.The wiring circuit 13 of rear side (2b, 3b) utilizes the wiring circuit 3b that is made up of the copper coating that passes blind hole h, is connected with electrically conducting manner from the back side of dorsal part with electrode 2a.Blind hole h runs through wiring circuit 2b and basic unit 1 and with the hole as the bottom surface, the back side of electrode 2a.
The electrode join domain S that disposes the electrode/wiring circuit of above-mentioned structure compares with existing flexible printing distributing board, has following advantage.
(F1) in the electrode arrangement portion of existing flexible printing distributing board, at least at the periphery of electrode, wiring circuit and electrode are positioned at identical faces for example on the front, and on this front, are continuous.Relative therewith, in this execution mode, wiring circuit is positioned at rear side, the part of not exposing in the front of electrode join domain.Therefore, owing to be configured to only make electrode 2a to expose,, therefore, can make whole also miniaturization of size so can make the simple structure of electrode join domain S.For example when the live width d of wiring circuit 2b was 70 μ m, can make the interval g between the electrode 2a was about 0.1mm～0.15mm, and in addition, the size Ed that can make the limit of foursquare electrode 2a is 0.3mm～0.4mm.
Enumerating concrete example describes.Fig. 3 (b) illustrates the electrode in the existing flexible printing distributing board.In electrode join domain S, be provided with 1 * 36 electrode with back gauge 1.0mm.Electrode size can be made as length 2.5mm * width 0.1mm, is spaced apart 0.1mm.At this moment, electrode join domain S needs vertical 3.5mm * horizontal 9.1mm, footprint area 31.85mm
2Relative therewith, Fig. 3 (a) is the flexible printing distributing board of this execution mode, in electrode join domain S, is provided with 6 row * 6 row with back gauge 1.0mm and amounts to 36 electrodes.Under the situation of Fig. 3 (a), can make (1) electrode size (a foursquare limit) is 0.4mm, is spaced apart 0.15mm.In the case, electrode join domain S is vertical 5.15mm * horizontal 5.15mm, and area is 26.5mm
2In addition, also further miniaturization and to make (2) electrode size be 0.3mm is spaced apart 0.1mm.Electrode join domain S under this situation becomes vertical 4.3mm * horizontal 4.3mm=18.49mm
2If compare with the existing example of Fig. 3 (b), even then under the situation of (1), also can make area be reduced to 83%, in addition, under the situation of (2), can be reduced to 58%.The ratio that this area reduces we can say very big.And, Fig. 3 (a) and Fig. 3 (b) are compared, compare with the horizontal row and the situation of arranging more longways with existing electrode, under the situation of the example of the utility model, can make in length and breadth length consistent and concentrate compactly.
(F2) with miniaturization side by side, in the joint construction between the electrode of ACF in middle clamping, the mechanical strength of 2 electrode rows groups that are crimped is important.The crimping structure of electrode/ACF/ electrode is peeled off through regular meeting.That is, importantly improve the mechanical endurance of above-mentioned crimping structure.
Because wiring circuit 13,, so when carrying out crimping at clamping ACF, the above-mentioned electrode that only will protrude is as the crimping object so is exerted pressure through blind hole and support electrode 2a from dorsal part easily.In addition, be easy to keep the smooth posture of electrode.Therefore, can make the crimping stabilisation of utilizing ACF to carry out.If exist the section of wiring circuit end to be circular parallel distribution, then the ACF of fusion is difficult to arrive round the latter half when crimping, produces a lot of spaces sometimes.As noted above, utilize between the flexible printing distributing board that ACF carries out or flexible printing distributing board and miscellaneous part between be connected, be to form firm mechanical connection as prerequisite.Therefore, the stabilisation of above-mentioned crimping has very large meaning.Through the stabilisation of above-mentioned crimping, its result can obtain being imbued with the crimping structure of durability.
Below, describe to the manufacturing approach of the flexible printing distributing board 10 of this execution mode.At first, shown in Fig. 4 (a), prepare to have the two-sided copper plating film plywood of Copper Foil 2 in the two-sided laminated of the basic unit that constitutes by polyimide film 1.
In basic unit 1,, then preferably use polyimide based resin, polyamide-based resins such as polyimides, polyamidoimide if pay attention to high-fire resistance and flexibility.In addition; Be used in use can using main component to contain the bonding agent of polyimide resin, polyamide-imide resin, epoxy resin, phenolic resins, mylar, polyurethane resin, acrylic resin, melamine resin etc. under the situation of matrix bonding agent of laminated copper foil 2.The thickness of preferred basic unit 1 is about 5 μ m～50 μ m, and in addition, the preferred substrate bonding agent is about 0.5 μ m～30 μ m.
Then, shown in Fig. 4 (b), utilize in the Copper Foil 2 that is etched in rear side and offer hole h1.Then shown in Fig. 4 (c), illuminating laser beam and the blind hole h that runs through polyimide film 1 is set.Blind hole h runs through the basic unit 1 of the Copper Foil 2 and the polyimide film of rear side, by Copper Foil 2 obturations of face side.Then, shown in Fig. 4 (d), form the Copper Foil 2 of coating rear side and the copper coating 3 of blind hole h through copper facing.At this moment, the copper coating 3 of Copper Foil of face side 2 and rear side is in the state of mechanical connection at the back side of the Copper Foil of this face side and connects with electrically conducting manner.
Then, utilizing the conductive part (Copper Foil 2 and copper coating 3) that is etched in face side and rear side to carry out pattern forms.For this reason, just, form not shown corrosion-resisting pattern on the back side, the pattern that utilizes wet etching to carry out conductive part then forms.In face side, shown in Fig. 5 (a), utilize the Copper Foil of face side to form electrode (pattern) 2a.In addition, utilize the Copper Foil 2 of rear side and copper coating 3 to form wiring circuit (pattern) 13 (2b, 3b).Wiring circuit 13 utilizes the copper coating pattern 3b that passes blind hole h to be connected with the back side of electrode 2a, but does not expose fully in face side.
Then,, vacate this zone, the overlay tree adipose membrane 6 of the band bonding agent of fitting with the mode of in electrode join domain S, exposing electrode 2a in face side.Cover the lower floor that bond layer 5 is positioned at overlay tree adipose membrane 6.In addition, side overleaf is with the fit overlay tree adipose membrane 6 of band bonding agent of the mode that covers whole wiring circuit 13.Side also can have the bond layer 5 of covering overleaf.As overlay tree adipose membrane 6, the preferred insulating resin that uses soft deflection.In addition, preferably with thermal endurance to about 150 ℃ in bonding process heating.For example can enumerate the resin of polyimide.In addition, can enumerate the polyethylene, polypropylene, polybutene etc. of TPO.In addition, can suitably use liquid crystal polymer.In addition, also there are cyclic olefin polymer, non-polar polyolefinic, cyclohexadiene base polymer etc.Also can use various polyphenylene oxide.The thickness of preferred covering resin layer 6 is about 5 μ m～50 μ m.
As bonding agent, can use the for example hot melt class bonding agent of polystyrene type, polyethylene kind etc.Thus, can realize making the raising of efficient.In addition, also can use polyesters or polyamide-based hot melt class bonding agent, epoxy resin.The preferred thickness that covers bond layer 5 is about 5 μ m～50 μ m.
Through said method, can utilize existing processes to form expeditiously and positive only expose electrode and do not expose the electrode join domain S of wiring circuit in the front.
(joint construction of execution mode 2-flexible printing distributing board-)
Fig. 6 is the vertical view of joint construction 50 of the flexible printing distributing board in the execution mode 2 of expression the utility model.In Fig. 6, with in the middle of ACF 21 is clamped in, and make electrode join domain S relatively and crimping by the flexible printing distributing board 10 shown in 2 Fig. 1 and 2.
Fig. 7 is the profile along the VII-VII line of Fig. 6.2 flexible printing distributing boards 10,10 are through making electrode join domain S, S relative, in the middle of ACF 21 is clamped in and carry out crimping, thus machinery and electrically connecting.ACF 21 is through being heated and on thickness direction, being under pressure, thereby with 2 electrode 2a mechanical connections and be electrically connected.
Have thermosetting resin (containing curing agent) and conductive particle as main component among the ACF 21.As thermosetting resin, for example can suitably use epoxy resin.ACF 21 is clamped between the electrode 2a, 2a of 2 flexible printing distributing boards 10, through when being under pressure, being heated, thereby forms soft state, near the state or the molten condition of fusion, and the gap of 2 electrode 2a, 2a is filled.That is, seamlessly fill by ACF 21 between 2 electrode 2a, the 2a.
And, harden through the effect of curing agent, with 2 electrode 2a, 2a, or 2 flexible printing distributing boards 10,10 bonding.The volume ratio of conductive particle, shape etc. are set at and can not make adjacent electrode 2a short circuit.In the resin of ACF 21, preferably use thermosetting epoxy resin etc., but in addition, also can use the polyimide resin of silicone resin or excellent heat resistance.Using under the situation of epoxy resin, can use bisphenol-A or Bisphenol F and chlorohydrin reaction and the resin that is commonly referred to as bisphenols that forms.Also can use novolaks (novolac) resinoid.As the conductive particle of ACF 21, can use metallic particles, coat of metal resin core particle of different shape (granular, needle-like etc.) etc.As metallic particles, the nickel particle of preferred granular or needle-like, as coat of metal resin core particle, preferably with acrylic resin (acryl) or polystyrene as the gold-plated particle of nuclear etc.
The joint construction of the flexible printing distributing board in this execution mode compared with prior art has following advantage (J1)～(J5).
(J1) in the prior art, mounted connector on printing distributing board inserts flexible printing distributing board and connects to this connector.The method of this use connector is compared with the method for using ACF, and cost increases.
(J2) because ACF does not have conductivity in the horizontal, thus can short circuit between the adjacent electrode, thus, can be with connecting with electrically conducting manner for 1 pair 1 reliably between the electrode.1 couple between the kind electrode 1 conduction connects, and through wiring circuit being arranged on the structure that rear side makes the flexible printing distributing board 10 of the utility model that electrode 2a exposes from the front, can realize more reliably.
(J3) in addition,, electrode join domain S simple structure can be made, therefore, the overall dimensions miniaturization can be made as shown in the explanation in the advantage (F1) of the flexible printing distributing board of execution mode 1.Thus, can suppress the area of the ACF of costliness, thereby suppress the cost of ACF.
(J4) in addition, because at clamping ACF and when carrying out crimping, only the above-mentioned electrode of protrusion becomes the crimping object, so exert pressure easily.In addition, be easy to keep the smooth posture of electrode.Therefore, can make to utilize the crimping stabilisation that ACF carries out and form firm conduction and connect.Its result can obtain the crimping structure that is imbued with durability of 2 flexible printing distributing boards.This advantage (J4) at length is illustrated in the advantage (F2) of flexible printing distributing board.
(J5) ACF 21 fills the gap of 2 flexible printing distributing boards 10, generation between 10, can not be exposed in the air.Therefore, can eliminate the long oxidation of electrode and periphery thereof and make problem such as conductivity deterioration.
In foregoing, be illustrated to the execution mode and the embodiment of the utility model, but execution mode of above-mentioned disclosed the utility model and embodiment are merely illustration, the scope of the utility model also can't help the execution mode of these utility models and is limited.The scope that the scope of the utility model is put down in writing according to claims illustrates, and in addition, is included in the connotation that equates with the record of claims and all changes in the scope.
According to flexible printing distributing board of the utility model etc., can utilize ACF, efficiently and simply the electrode of this flexible printing distributing board and the electrode of miscellaneous part are connected with electrically conducting manner, make this joint construction miniaturization simultaneously.In addition, when above-mentioned electrode being connected with electrically conducting manner each other and this flexible printing distributing board and miscellaneous part carried out mechanical connection, can obtain stablizing and being imbued with the connection of durability.
Claims (3)
1. flexible printing distributing board, it is the double-faced flexible printing distributing board with electrode,
It is characterized in that,
Have: the electrode join domain, it is arranged on the said two-sided face, and said electrode is exposed; And
Wiring circuit, it is positioned on another face with said electrode join domain opposition side,
With the blind hole that is arranged in the electrode position overlapped place of said electrode join domain, this electrode is connected with electrically conducting manner with said wiring circuit when overlooking through being arranged on,
On the flexible printing distributing board at said electrode join domain place, wiring circuit only is configured on said another face.
2. the joint construction of a flexible printing distributing board is characterized in that,
The said electrode of the described flexible printing distributing board of claim 1 is connected with electrically conducting manner across anisotropic conductive film with the electrode of miscellaneous part or with the said electrode of the described flexible printing distributing board of another claim 1.
3. an electronic equipment is characterized in that,
Joint construction with the described flexible printing distributing board of claim 1 or the described flexible printing distributing board of claim 2.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010105799A JP2011233848A (en) | 2010-04-30 | 2010-04-30 | Flexible printed circuit board and its connecting structure, manufacturing method thereof, and electronic equipment |
| JP2010-105799 | 2010-04-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202111937U true CN202111937U (en) | 2012-01-11 |
Family
ID=45322836
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011201360805U Expired - Fee Related CN202111937U (en) | 2010-04-30 | 2011-05-03 | Flexible printing wiring board, and connection structure and electronic equipment thereof |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2011233848A (en) |
| CN (1) | CN202111937U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106489121A (en) * | 2014-09-08 | 2017-03-08 | 富士胶片株式会社 | Touch panel conducting film and touch panel |
| CN109076704A (en) * | 2016-03-17 | 2018-12-21 | 杜邦-东丽株式会社 | Flexible circuit board and its manufacturing method |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI684389B (en) * | 2015-04-17 | 2020-02-01 | 王忠寶 | A printing circuit board structure |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000036644A (en) * | 1998-07-17 | 2000-02-02 | Canon Inc | Double-sided flexible printed board |
| JP2004031555A (en) * | 2002-06-25 | 2004-01-29 | Nec Corp | Circuit board device and connection method between substrates |
-
2010
- 2010-04-30 JP JP2010105799A patent/JP2011233848A/en active Pending
-
2011
- 2011-05-03 CN CN2011201360805U patent/CN202111937U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106489121A (en) * | 2014-09-08 | 2017-03-08 | 富士胶片株式会社 | Touch panel conducting film and touch panel |
| CN109076704A (en) * | 2016-03-17 | 2018-12-21 | 杜邦-东丽株式会社 | Flexible circuit board and its manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2011233848A (en) | 2011-11-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120111 Termination date: 20180503 |