CN202106241U - Cooling device of high-speed spindle - Google Patents
Cooling device of high-speed spindle Download PDFInfo
- Publication number
- CN202106241U CN202106241U CN2011201600160U CN201120160016U CN202106241U CN 202106241 U CN202106241 U CN 202106241U CN 2011201600160 U CN2011201600160 U CN 2011201600160U CN 201120160016 U CN201120160016 U CN 201120160016U CN 202106241 U CN202106241 U CN 202106241U
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- Prior art keywords
- water
- cooling
- main shaft
- water channel
- shaft shell
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Abstract
The utility model discloses a cooling device of a high-speed spindle, which comprises a sealed water jacket, a spiral water channel, a cooling water circulation system, a semiconductor refrigerating piece and a water-cooling heat-dissipation pipe and is characterized in that the spiral water channel includes a left-side spiral water channel and a right-side spiral water channel which are mutually independent, and a water supply pipeline of the cooling water circulation system is simultaneously connected with water inlets of the two spiral water channels. The water-cooling heat-dissipation pipe comprises a cooling pipe and a heat accumulation portion, one end of the cooling pipe is a water inlet of the cooling pipe, and the other end of the cooling pipe is a water outlet of the cooling pipe. A cold end of the semiconductor refrigerating piece is contacted with a center section of a spindle casing, and a hot end of the semiconductor refrigerating piece is contacted with the heat accumulation portion of the water-cooling heat-dissipation pipe. Water outlets of the two spiral water channels are simultaneously connected with the water inlet of the cooling pipe, and the water outlet of the cooling pipe is connected with a return water pipeline of the cooling water circulation system. The cooling device of the high-speed spindle is an ideal cooling device for the high-speed spindle.
Description
Technical field
The utility model relates to a kind of cooling device that is used for high-speed electric main shaft, especially a kind of device that semiconductor refrigerating technology is applied to the high speed electric principal shaft system cooling.
Background technology
High-speed electric main shaft mainly comprises main shaft shell, armature spindle, stator component and rotor part, often is applied in high rotating speed, the high-precision processing and manufacturing.Because electric main shaft is integrated in its inside with motor, makes it increase a bigger pyrotoxin.The heating of motor mainly contains the copper loss heating of stator and the iron loss heating of rotor, and the heating of its stator winding accounts for more than 2/3rds of motor gross calorific power.In addition, rotor is rotation at a high speed in the main shaft housing, and the air that stirs in the inner chamber also can generate heat.Cool off as untimely, will make mechanical system heating distortion, thereby influence its precision.
Present stage, high-speed electric main shaft adopted water-cooling pattern to cool off more.Water-cooling pattern mainly adopts jacket structure for water, is provided with water channel between water jacket and the main shaft shell, and water channel has spiral channel and two kinds in straight water channel, utilizes the cooling water that is flowing in the water channel that high speed electric principal shaft system is cooled off.Recirculated cooling water with certain pressure and flow flows at an end of shell, and the other end flows out.Have data to show, the middle part caloric value of electric main shaft is maximum.In the process of flow of cooling water, water temperature raises gradually, so with the temperature difference of main shaft shell will be more and more littler, so cooling effect also can also cause the temperature distributing disproportionation at two ends simultaneously worse and worse.In addition, specific heat of water holds bigger, and its cooling velocity is also slower, and cooling effect is bad.
Semiconductor refrigerating is claimed thermoelectric cooling or temperature-difference refrigerating again, has extraordinary thermoelectric transfer characteristic.It is simple in structure, and size is little, and cooling piece is made up of thermoelectric pile and lead, does not have any mechanical moving element, and noise is low, does not have wearing and tearing, and the life-span is long; Have higher reliability and good maintenanceability.Cryogenic temperature and speed can be regulated in prescribed limit through changing operating current and voltage swing, and refrigerating capacity can change between milliwatt and multikilowatt, and the refrigeration temperature difference can reach 20 and spend to 150 degree.
Though semiconductor technology has above-mentioned plurality of advantages, do not find semiconductor refrigerating technology is applied to the report of high speed electric principal shaft system in the prior art.
The utility model content
The task of the utility model is to solve the existing technological deficiency of cooling device of prior art high speed electricity main shaft, and a kind of cooling device of high-speed electric main shaft is provided.
Its technical solution is:
A kind of cooling device of high-speed electric main shaft comprises the sealed water jacket that is nested with on the main shaft shell, spiral water channel and the cooling water recirculation system that is opened in the main shaft shell; Above-mentioned spiral water channel comprises the spiral water channel in left side that is positioned at main shaft shell left side; With the spiral water channel in right side that is positioned at main shaft shell right side; Spiral water channel in left side and the spiral water channel in right side are independently of one another; The water channel water inlet of the spiral water channel in left side is positioned at the left-hand end of main shaft shell, and the water channel delivery port is positioned at the central sections of main shaft shell, and the water channel water inlet of the spiral water channel in right side is positioned at the right-hand end of main shaft shell; The water channel delivery port is positioned at the central sections of main shaft shell, and the supply channel of cooling water recirculation system connects two water channel water inlets simultaneously; Above-mentioned cooling device also comprises semiconductor chilling plate and water-cooling pipe; The water-cooling pipe comprises cooling tube and heat accumulation portion; One end of cooling tube is the cooling tube water inlet; The other end is the cooling tube delivery port, and the cold junction of semiconductor chilling plate contacts with the central sections of main shaft shell, and the hot junction contacts with the heat accumulation portion of water-cooling pipe; Above-mentioned two water channel delivery ports connect the cooling tube water inlet simultaneously, and the cooling tube delivery port connects the water return pipeline of cooling water recirculation system.
Above-mentioned semiconductor chilling plate has two or more than two, upwards evenly distributes in the week of the central part of main shaft shell.
The heat accumulation portion of above-mentioned water-cooling pipe passes the installing hole that sealed water jacket is offered; Semiconductor chilling plate is installed in the seat hole of main shaft shell; The cold junction of semiconductor chilling plate is towards main shaft shell one side; The hot junction contacts towards water jacket one side and with the end face of heat accumulation portion, and it is fixing to be connected and sealed between sealed water jacket and the heat accumulation portion.
Be provided with the pipe grid in the above-mentioned cooling tube.
The utlity model has following technique effect:
The utility model is divided into three sections with the main shaft shell and cools off, and wherein the main shaft shell adopts the water-cooling pattern cooling for left and right two sections, and interlude takes semiconductor chilling plate to cool off, and can realize the reinforcement cooling to middle position.Because semiconductor chilling plate will energy-producingly shift after connecting DC current; Form bigger cold junction and the hot junction of the temperature difference; Therefore be equivalent to a heat pump during its work, directly from the main shaft shell, absorb heat and be transported to the water-cooling pipe, the speed of transfer of heat is fast, efficient is high.In addition, the spiral water channel of and arranged on left and right sides feeds cooling water simultaneously, because the temperature difference is bigger, the speed of cooling is also very fast.The utility model is the comparatively desirable cooling device of high-speed electric main shaft.
Description of drawings
Below in conjunction with the accompanying drawing and the specific embodiment the utility model is described further:
Fig. 1 is the structural principle sketch map of a kind of embodiment of the utility model, mainly shows the main shaft housing parts.
Fig. 2 shows the water-cooling pipe in the utility model, for a kind of cuing open shown state.
Fig. 3 shows the rigging position relation between water-cooling pipe, semiconductor chilling plate and the main shaft shell in the aforesaid way, is a kind of section state.
The specific embodiment
In conjunction with Fig. 1, Fig. 2 and Fig. 3, a kind of cooling device of high-speed electric main shaft comprises the sealed water jacket (not shown) that is nested with on main shaft shell 3, spiral water channel and the cooling water recirculation system that is opened in main shaft shell 3.Above-mentioned spiral water channel comprises the spiral water channel 2 in left side that is positioned at main shaft shell left side; With the spiral water channel in right side that is positioned at main shaft shell right side, the spiral water channel 2 in left side is independently of one another with the spiral water channel in right side, promptly is not communicated with between the two; The water channel water inlet of the spiral water channel in left side is positioned at the left-hand end of main shaft shell; The water channel delivery port is positioned at the central sections of main shaft shell, and the water channel water inlet 4 of the spiral water channel in right side is positioned at the right-hand end of main shaft shell, and water channel delivery port 5 is positioned at the central sections of main shaft shell; The supply channel of cooling water recirculation system connects two water channel water inlets simultaneously, promptly connects the water channel water inlet of the spiral water channel of left and right side simultaneously.Above-mentioned cooling device also comprises semiconductor chilling plate 9 and water-cooling pipe 7; Water-cooling pipe 7 comprises cooling tube and heat accumulation portion 8; Be provided with pipe grid 6 in the cooling tube, an end of cooling tube is the cooling tube water inlet, and the other end is the cooling tube delivery port; The cold junction of semiconductor chilling plate 9 contacts with the central part of main shaft shell 3, and the hot junction contacts with the heat accumulation portion 8 of water-cooling pipe.Above-mentioned two water channel delivery ports connect the cooling tube water inlet simultaneously, and promptly the water channel delivery port of the spiral water channel of left and right side connects the cooling tube water inlet simultaneously, and the cooling tube delivery port connects the water return pipeline of cooling water recirculation system.Above-mentioned semiconductor chilling plate 9 has two, three or four etc., is preferably four, and all semiconductor chilling plates circumferentially evenly distribute at the central part of main shaft shell.The heat accumulation portion of above-mentioned water-cooling pipe passes the installing hole that sealed water jacket is offered; Semiconductor chilling plate 9 is installed in the seat hole 1 of main shaft shell; The cold junction of semiconductor chilling plate is towards main shaft shell one side; The hot junction contacts towards water jacket one side and with the end face of heat accumulation portion, and it is fixing to be connected and sealed between sealed water jacket and the heat accumulation portion.
Above-mentioned main shaft shell, that is the matrix of cooling, the two ends of shell process the low-angle conical surface, are used to place seal washer.The middle part of main shaft shell is along the seat hole that is circumferentially with four block semiconductor cooling pieces.Above-mentioned sealed water jacket cooperates with body seal, and sealed water jacket adopts the certain organic material of intensity, at the position of correspondence processing entery and delivery port and four installing holes.
In the aforesaid way, semiconductor chilling plate can adopt the 12V DC power supply, and the motion of internal electron forms cold junction and hot junction to produce the transfer of heat.The shell of its cold junction and spindle is the main shaft housing contacts, and the hot junction contacts with the heat accumulation portion of water-cooling pipe.The effective hot junction of cooling off semiconductor chilling plate of above-mentioned water-cooling, cooling tube contacts cooling water with wherein pipe grid, and heat accumulation portion absorbs heat from the hot junction of semiconductor chilling plate, passes to cooling water and takes away thereupon.
Statement by above is known, the internal heat that the main shaft shell is transmitted, directly being taken away by cooling water of two ends; Being delivered to through semiconductor chilling plate of middle part also finally passes to cooling water in the radiating tube.The intervention of semiconductor chilling plate has increased cooling range, can obviously improve cooling effect.
The technology contents of not addressing in the aforesaid way is taked or is used for reference prior art and can realize.
Need to prove that those skilled in the art also can make the multiple variation of associating easily under the instruction of this specification, such as the equivalent variations mode, or obvious mode of texturing, these variations all should be within the protection domain of the utility model.
Claims (4)
1. the cooling device of a high-speed electric main shaft comprises the sealed water jacket that is nested with on the main shaft shell, spiral water channel and the cooling water recirculation system that is opened in the main shaft shell; It is characterized in that: said spiral water channel comprises the spiral water channel in left side that is positioned at main shaft shell left side; With the spiral water channel in right side that is positioned at main shaft shell right side; Spiral water channel in left side and the spiral water channel in right side are independently of one another; The water channel water inlet of the spiral water channel in left side is positioned at the left-hand end of main shaft shell, and the water channel delivery port is positioned at the central sections of main shaft shell, and the water channel water inlet of the spiral water channel in right side is positioned at the right-hand end of main shaft shell; The water channel delivery port is positioned at the central sections of main shaft shell, and the supply channel of cooling water recirculation system connects two water channel water inlets simultaneously; Said cooling device also comprises semiconductor chilling plate and water-cooling pipe; The water-cooling pipe comprises cooling tube and heat accumulation portion; One end of cooling tube is the cooling tube water inlet; The other end is the cooling tube delivery port, and the cold junction of semiconductor chilling plate contacts with the central sections of main shaft shell, and the hot junction contacts with the heat accumulation portion of water-cooling pipe; Above-mentioned two water channel delivery ports connect the cooling tube water inlet simultaneously, and the cooling tube delivery port connects the water return pipeline of cooling water recirculation system.
2. the cooling device of high-speed electric main shaft according to claim 1, it is characterized in that: said semiconductor chilling plate has two or more than two, upwards evenly distributing in week of the central part of main shaft shell.
3. the cooling device of high-speed electric main shaft according to claim 1; It is characterized in that: the heat accumulation portion of said water-cooling pipe passes the installing hole that sealed water jacket is offered; Semiconductor chilling plate is installed in the seat hole of main shaft shell; The cold junction of semiconductor chilling plate is towards main shaft shell one side, and the hot junction contacts towards water jacket one side and with the end face of heat accumulation portion, and it is fixing to be connected and sealed between sealed water jacket and the heat accumulation portion.
4. the cooling device of high-speed electric main shaft according to claim 1 is characterized in that: be provided with the pipe grid in the said cooling tube.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201600160U CN202106241U (en) | 2011-05-19 | 2011-05-19 | Cooling device of high-speed spindle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201600160U CN202106241U (en) | 2011-05-19 | 2011-05-19 | Cooling device of high-speed spindle |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202106241U true CN202106241U (en) | 2012-01-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011201600160U Expired - Fee Related CN202106241U (en) | 2011-05-19 | 2011-05-19 | Cooling device of high-speed spindle |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202106241U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103341785A (en) * | 2013-07-23 | 2013-10-09 | 高泉正 | High-speed main shaft cooling device |
-
2011
- 2011-05-19 CN CN2011201600160U patent/CN202106241U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103341785A (en) * | 2013-07-23 | 2013-10-09 | 高泉正 | High-speed main shaft cooling device |
| CN103341785B (en) * | 2013-07-23 | 2015-11-25 | 高泉正 | The cooling device of high-speed main spindle |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120111 Termination date: 20130519 |