CN202093932U - Glue pouring and fixing device for ring-shaped inductor - Google Patents

Glue pouring and fixing device for ring-shaped inductor Download PDF

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Publication number
CN202093932U
CN202093932U CN 201120177026 CN201120177026U CN202093932U CN 202093932 U CN202093932 U CN 202093932U CN 201120177026 CN201120177026 CN 201120177026 CN 201120177026 U CN201120177026 U CN 201120177026U CN 202093932 U CN202093932 U CN 202093932U
Authority
CN
China
Prior art keywords
metal splint
ring
lower metal
annular inductance
shaped inductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 201120177026
Other languages
Chinese (zh)
Inventor
刘勇
赵英军
李湘斌
高军
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Megmeet Electrical Co Ltd
Original Assignee
Shenzhen Megmeet Electrical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Megmeet Electrical Co Ltd filed Critical Shenzhen Megmeet Electrical Co Ltd
Priority to CN 201120177026 priority Critical patent/CN202093932U/en
Application granted granted Critical
Publication of CN202093932U publication Critical patent/CN202093932U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses a glue pouring and fixing device for a ring-shaped inductor. The device provided by the utility model comprises a circular upper metal splint, a circular lower metal splint, an upper insulating base plate, a lower insulating base plate and an insulating sleeve, wherein, a plurality of small holes are respectively formed on the upper insulating base plate and the lower insulating base plate; the upper metal splint and the lower metal splint clamp the ring-shaped inductor through the upper insulating base plate and the lower insulating base plate; the insulating sleeve penetrates the ring-shaped inductor, the upper metal splint and the lower metal splint; one end of the insulating sleeve is fixed on the upper metal splint, and the other end is fixed on the lower metal splint; the upper and the lower insulting base plates and the ring-shaped inductor, as well as the upper and the lower metal splints and the upper and the lower insulating base plates are respectively fixed through bonding; and a heat guide glue body is arranged between the upper and the lower metal splints and the ring-shaped inductor in an encapsulating manner. The glue pouring and fixing device provided by the utility model can fix the ring-shaped inductor, and has good radiating effects and small occupied area.

Description

A kind of annular inductance encapsulating fixture
[technical field]
The utility model relates to electronic product, relates in particular to a kind of annular inductance encapsulating fixture.
[background technology]
In electronic product, the annular inductance is the enamel covered wire of coiling on a toroidal core, because its design feature is considered the requirement of safety electric insulation simultaneously, the annular inductance can not directly be fixed on the pcb board, normally be bonded on the insulation board, be welded on the pcb board fixing by the several pins on the insulation board again with epoxy glue.Though this fixed form has solved the fixation problem of annular inductance, can not solve the heat dissipation problem of annular inductance.Under the air blast cooling condition, the heat radiation of annular inductance also is not a problem, but under natural heat dissipation (not having cooling fan) condition, it is exactly a big problem that the thermal conductance of annular inductance is come out.
The common heat conduction scheme of prior art is pad one deck elastic heat conducting silica gel material between annular inductance and casing, or design a can and encase inductance, the inside embedding Heat Conduction Material, this method heat conduction and fixing more satisfactory, but consider the safety required distance, its can volume and the casing area that takies are all very big.
[summary of the invention]
The utility model provides a kind of annular inductance encapsulating fixture, its energy stationary annular inductance, and good heat dissipation effect, and it is little to take volume.
The technical solution of the utility model is:
A kind of annular inductance encapsulating fixture comprises circular upper and lower metal splint and upper and lower insulating pad and insulating sleeve, has a plurality of apertures on the upper and lower insulating pad, and upper and lower metal splint is clamped annular inductance by upper and lower insulating pad respectively; Insulating sleeve passes annular inductance and upper and lower metal splint, and an end of insulating sleeve is fixed on the metal splint, and the other end of insulating sleeve is fixed on down on the metal splint;
Between upper and lower insulating pad and the annular inductance, be adhesively fixed respectively between upper and lower metal splint and the upper and lower insulating pad, and embedding has the heat conduction colloid between upper and lower metal splint and annular inductance.
Annular inductance encapsulating fixture of the present utility model, clamp annular inductance by upper and lower metal splint, and embedding has the heat conduction colloid between upper and lower metal splint and annular inductance, utilizing screw to pass insulating sleeve again is fixed on annular inductance on the casing, good fixing effect, easy to assembly firm; And embedding has the heat conduction colloid between upper and lower metal splint and annular inductance, and the aperture that this heat conduction colloid passes on the upper and lower insulating pad contacts with annular inductance, the thermal conductance of annular inductance can be come out good heat dissipation effect; In addition, the utility model is to clamp annular inductance by upper and lower metal splint, and embedding has the heat conduction colloid between upper and lower metal splint and annular inductance, compact conformation, and it is little to take up room, and product cost is low.
[description of drawings]
Fig. 1 is annular inductance encapsulating fixture of the present utility model shape and structure figure in one embodiment;
Fig. 2 is the front view of the annular inductance encapsulating fixture of Fig. 1;
Fig. 3 is the vertical view of the annular inductance encapsulating fixture of Fig. 1.
[embodiment]
Below in conjunction with accompanying drawing specific embodiment of the utility model is done a detailed elaboration.
As Fig. 1,2,3, annular inductance encapsulating fixture of the present utility model, comprise circular upper and lower metal splint 21,22 and upper and lower insulating pad 31,32 and insulating sleeve 4, have a plurality of apertures on last insulating pad 31 and the following insulating pad 32, upper and lower metal splint 21,22 is clamped annular inductance 1 by upper and lower insulating pad 31,32 respectively, last insulating pad 31 is between last metal splint 21 and annular inductance 1, and following insulating pad 32 is down between metal splint 22 and the annular inductance 1; Insulating sleeve 4 passes annular inductance 1 and upper and lower metal splint 21,22, one end of insulating sleeve 4 is fixed on the metal splint 21, the other end is fixed on down on the metal splint 22, utilizing screw to pass this insulating sleeve 4 can be fixed on annular inductance 1 on the casing, good fixing effect, easy to assembly firm;
Between upper and lower insulating pad 31,32 and the annular inductance 1, be adhesively fixed respectively between upper and lower metal splint 21,22 and the upper and lower insulating pad 31,32, and embedding has the heat conduction colloid between upper and lower metal splint 21,22 and annular inductance 1.
Before embedding heat conduction colloid between upper and lower metal splint 21,22 and the annular inductance 1, earlier with glue with between upper and lower insulating pad 31,32 and the annular inductance 1, be adhesively fixed respectively between upper and lower metal splint 21,22 and the upper and lower insulating pad 31,32, so that embedding heat conduction colloid, the aperture that this heat-conducting glue physical efficiency is passed on the upper and lower insulating pad 31,32 contacts with annular inductance 1, thereby the thermal conductance on the annular inductance 1 can be come out, radiating effect is relatively good.
And the utility model is to clamp annular inductance by upper and lower metal splint, and embedding has the heat conduction colloid between upper and lower metal splint and annular inductance, compact conformation, and it is little to take up room, and product cost is low.
In a preferred embodiment, upper and lower insulating pad 31,32 be shaped as circle, be complementary with upper and lower metal splint 21,22 shapes, to improve insulation effect.
This heat conduction colloid can be epoxide-resin glue or the high strength bonded adhesivess such as polyurethane resin adhesive or acrylic size that solidify.The sheet metal that upper and lower metal splint can be iron, steel, the copper equal strength is big.Upper and lower insulating pad can be withstand voltage and all higher plastic material of intensity.Insulating sleeve is that withstand voltage higher insulating material is made, and is used for the insulation between screw and the annular inductance.The encapsulating of upper and lower metal splint and annular inductance guarantees that by outside frock clamp the heat-conducting glue body profile of formation is close with annular inductance profile.
Above-described the utility model execution mode does not constitute the qualification to the utility model protection range.Any modification of within spirit of the present utility model and principle, being done, be equal to and replace and improvement etc., all should be included within the claim protection range of the present utility model.

Claims (2)

1. annular inductance encapsulating fixture, it is characterized in that: comprise circular upper and lower metal splint and upper and lower insulating pad and insulating sleeve, have a plurality of apertures on the upper and lower insulating pad, upper and lower metal splint is clamped annular inductance by upper and lower insulating pad respectively; Insulating sleeve passes annular inductance and upper and lower metal splint, and an end of insulating sleeve is fixed on the metal splint, and the other end of insulating sleeve is fixed on down on the metal splint; Between upper and lower insulating pad and the annular inductance, be adhesively fixed respectively between upper and lower metal splint and the upper and lower insulating pad, and embedding has the heat conduction colloid between upper and lower metal splint and annular inductance.
2. annular inductance encapsulating fixture according to claim 1 is characterized in that: upper and lower insulating pad be shaped as circle, be complementary with upper and lower metal splint shape.
CN 201120177026 2011-05-30 2011-05-30 Glue pouring and fixing device for ring-shaped inductor Expired - Fee Related CN202093932U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201120177026 CN202093932U (en) 2011-05-30 2011-05-30 Glue pouring and fixing device for ring-shaped inductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201120177026 CN202093932U (en) 2011-05-30 2011-05-30 Glue pouring and fixing device for ring-shaped inductor

Publications (1)

Publication Number Publication Date
CN202093932U true CN202093932U (en) 2011-12-28

Family

ID=45368983

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201120177026 Expired - Fee Related CN202093932U (en) 2011-05-30 2011-05-30 Glue pouring and fixing device for ring-shaped inductor

Country Status (1)

Country Link
CN (1) CN202093932U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102842417A (en) * 2012-06-20 2012-12-26 山亿新能源股份有限公司 Insulating structure for encapsulation of inverter inductor
CN104682722A (en) * 2013-11-26 2015-06-03 台达电子企业管理(上海)有限公司 Power switching device and assembling method thereof

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102842417A (en) * 2012-06-20 2012-12-26 山亿新能源股份有限公司 Insulating structure for encapsulation of inverter inductor
CN104682722A (en) * 2013-11-26 2015-06-03 台达电子企业管理(上海)有限公司 Power switching device and assembling method thereof
US9668384B2 (en) 2013-11-26 2017-05-30 Delta Electronics (Shanghai) Co., Ltd. Power conversion device and method for assembling the same
CN104682722B (en) * 2013-11-26 2018-01-26 台达电子企业管理(上海)有限公司 Power supply change-over device and its assemble method

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20111228

Termination date: 20200530