CN202083516U - 基于微熔技术压力传感器 - Google Patents
基于微熔技术压力传感器 Download PDFInfo
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- CN202083516U CN202083516U CN2011201988265U CN201120198826U CN202083516U CN 202083516 U CN202083516 U CN 202083516U CN 2011201988265 U CN2011201988265 U CN 2011201988265U CN 201120198826 U CN201120198826 U CN 201120198826U CN 202083516 U CN202083516 U CN 202083516U
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- pressure
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- pressure sensor
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 18
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 18
- 239000010703 silicon Substances 0.000 claims abstract description 18
- 239000011888 foil Substances 0.000 claims description 11
- 239000006060 molten glass Substances 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
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- 230000008447 perception Effects 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 230000008676 import Effects 0.000 claims description 3
- 239000012530 fluid Substances 0.000 abstract description 7
- 230000035945 sensitivity Effects 0.000 abstract description 7
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- 230000007547 defect Effects 0.000 abstract 1
- 230000007613 environmental effect Effects 0.000 abstract 1
- 238000004880 explosion Methods 0.000 abstract 1
- 238000005259 measurement Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000005245 sintering Methods 0.000 description 4
- 239000012943 hotmelt Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- UCHOFYCGAZVYGZ-UHFFFAOYSA-N gold lead Chemical compound [Au].[Pb] UCHOFYCGAZVYGZ-UHFFFAOYSA-N 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
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- 238000005520 cutting process Methods 0.000 description 1
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- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000009628 steelmaking Methods 0.000 description 1
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN2011201988265U CN202083516U (zh) | 2011-06-14 | 2011-06-14 | 基于微熔技术压力传感器 |
Applications Claiming Priority (1)
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CN2011201988265U CN202083516U (zh) | 2011-06-14 | 2011-06-14 | 基于微熔技术压力传感器 |
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CN202083516U true CN202083516U (zh) | 2011-12-21 |
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CN2011201988265U Expired - Fee Related CN202083516U (zh) | 2011-06-14 | 2011-06-14 | 基于微熔技术压力传感器 |
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CN (1) | CN202083516U (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102661822A (zh) * | 2012-04-28 | 2012-09-12 | 无锡永阳电子科技有限公司 | 硅应变片金属封装传感器 |
CN104390739A (zh) * | 2014-11-26 | 2015-03-04 | 西安微纳传感器研究所有限公司 | 压阻式微熔高温压力传感器及其制造方法 |
CN106908193A (zh) * | 2017-02-24 | 2017-06-30 | 中国电子科技集团公司第三十八研究所 | 一种耐腐蚀玻璃微熔压力变送器感压芯体及其制作方法 |
-
2011
- 2011-06-14 CN CN2011201988265U patent/CN202083516U/zh not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102661822A (zh) * | 2012-04-28 | 2012-09-12 | 无锡永阳电子科技有限公司 | 硅应变片金属封装传感器 |
CN104390739A (zh) * | 2014-11-26 | 2015-03-04 | 西安微纳传感器研究所有限公司 | 压阻式微熔高温压力传感器及其制造方法 |
CN106908193A (zh) * | 2017-02-24 | 2017-06-30 | 中国电子科技集团公司第三十八研究所 | 一种耐腐蚀玻璃微熔压力变送器感压芯体及其制作方法 |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Pressure sensor based on micro-melting technology Effective date of registration: 20140625 Granted publication date: 20111221 Pledgee: Bank of Changan, Limited by Share Ltd, Baoji Jinling subbranch Pledgor: Baoji Huamin Measurement Control Instrument Co., Ltd. Registration number: 2014990000507 |
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PLDC | Enforcement, change and cancellation of contracts on pledge of patent right or utility model | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20150728 Granted publication date: 20111221 Pledgee: Bank of Changan, Limited by Share Ltd, Baoji Jinling subbranch Pledgor: Baoji Huamin Measurement Control Instrument Co., Ltd. Registration number: 2014990000507 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Pressure sensor based on micro-melting technology Effective date of registration: 20150731 Granted publication date: 20111221 Pledgee: Bank of Changan, Limited by Share Ltd, Baoji Jinling subbranch Pledgor: Baoji Huamin Measurement Control Instrument Co., Ltd. Registration number: 2015990000629 |
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Date of cancellation: 20160809 Granted publication date: 20111221 Pledgee: Bank of Changan, Limited by Share Ltd, Baoji Jinling subbranch Pledgor: Baoji Huamin Measurement Control Instrument Co., Ltd. Registration number: 2015990000629 |
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PLDC | Enforcement, change and cancellation of contracts on pledge of patent right or utility model | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Pressure sensor based on micro-melting technology Effective date of registration: 20160809 Granted publication date: 20111221 Pledgee: Bank of Changan, Limited by Share Ltd, Baoji Jinling subbranch Pledgor: Baoji Huamin Measurement Control Instrument Co., Ltd. Registration number: 2016990000692 |
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PLDC | Enforcement, change and cancellation of contracts on pledge of patent right or utility model | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20170809 Granted publication date: 20111221 Pledgee: Bank of Changan, Limited by Share Ltd, Baoji Jinling subbranch Pledgor: Baoji Huamin Measurement Control Instrument Co., Ltd. Registration number: 2016990000692 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Pressure sensor based on micro-melting technology Effective date of registration: 20170810 Granted publication date: 20111221 Pledgee: Bank of Changan, Limited by Share Ltd, Baoji Jinling subbranch Pledgor: Baoji Huamin Measurement Control Instrument Co., Ltd. Registration number: 2017610000088 |
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Date of cancellation: 20180817 Granted publication date: 20111221 Pledgee: Bank of Changan, Limited by Share Ltd, Baoji Jinling subbranch Pledgor: Baoji Huamin Measurement Control Instrument Co., Ltd. Registration number: 2017610000088 |
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Granted publication date: 20111221 Termination date: 20190614 |
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CF01 | Termination of patent right due to non-payment of annual fee |