CN202076259U - Frame of chip diode - Google Patents
Frame of chip diode Download PDFInfo
- Publication number
- CN202076259U CN202076259U CN 201120192335 CN201120192335U CN202076259U CN 202076259 U CN202076259 U CN 202076259U CN 201120192335 CN201120192335 CN 201120192335 CN 201120192335 U CN201120192335 U CN 201120192335U CN 202076259 U CN202076259 U CN 202076259U
- Authority
- CN
- China
- Prior art keywords
- crossbeam
- fold
- frame
- chip diode
- working face
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Led Device Packages (AREA)
Abstract
The utility model discloses a frame of a chip diode, and relates to the improvement on a frame of a chip diode in a mass machining line. The frame of a chip diode is high in positioning precision and needs no auxiliary positioning tool. The frame body is provided with a first crossbeam for arranging a first lead wire, and with a second crossbeam for arranging a second lead wire. Two ends of the second crossbeam and two ends of the first crossbeam are connected via fold-back structures. Each fold-back structure is of a U shape, and the arm of each U-shaped fold-back structure is provided with a fold-back line, wherein the arm faces outwardly. According to the utility model, when machined for punching, the two lead wires stay in the same plate, thereby thoroughly preventing the two lead wires from moving left and right and mixing together when the lead wires are piled together. Based on the calculation of dimension, the positioning of the two crossbeams back and forth can be obtained, and fold-back marks can be drawn on the fold-back structures, thereby guaranteeing the positioning precision of the position back and forth. When the frame of a chip diode is used, a worker only needs to fold the second crossbeam above the fold-back lines 180 degrees so as to ensure that axle centers of a first working face and a second working face are overlapped with the axle center of chips. The frame of a chip diode ensures the welding positioning and enables the efficiency of auxiliary work before welding to be substantially improved.
Description
Technical field
The utility model relates to the improvement to chip diode framework on the processing line in enormous quantities.
Background technology
The chip diode work in-process, for raising the efficiency, at present, the mode that the applicant adopted adopts two lead frames shown in Fig. 5,6, and lead frame 1, lead frame 27 are provided with some lead-in wires one, lead-in wire two respectively on both.Then, be one by both with chips welding.The schemes of two lead frame opposites welding, in welding process, two the easy left and right sides of lead frame off normals, in case some deviations occur, then all over products on these two lead frames all deviation can occur, and there is hidden danger in the quality of product.Once carried out research of technique for this reason, and adopted the assist location frock that both are positioned before welding, but behind the location, when doing the clamping action, can move by the trace string, be difficult to guarantee positional precision between the two at last lead-in wire.
The utility model content
The utility model provides a kind of positioning accuracy height at above problem, need not to adopt the framework of the chip diode of assist location frock.
The technical solution of the utility model is: described frame body is provided with the crossbeam one of laying lead-in wire one, also is provided with the crossbeam two of laying lead-in wire two on the described frame body, and described crossbeam two links to each other by the structure of turning back with the two ends of crossbeam one; The described structure of turning back takes the shape of the letter U, and the described U-shaped structure arm toward the outer side of turning back is provided with the line of turning back.
Lead-in wire one on the described crossbeam one has working face one, and described working face one up; Lead-in wire two on the described crossbeam two has working face two, and described working face two up; Described crossbeam two along the described line of turning back after 180 ° of crossbeam one turnovers, working face one is over against described working face two, and leaves the space of the chip that described chip diode is set.
Two lead-in wires (be this case middle cross beam one, crossbeam two) of the present utility model add man-hour at stamping-out, are on the same plate, go here and there got rid of thoroughly that both may occur when stacking about and move.Calculate according to size the position of location, front and back, can delineate the trace of turning back on the structure of turning back, and can guarantee the positioning accuracy of front and back position like this.During use, only need along the line of turning back 180 ° of axle center (three's focus of work point) that can guarantee working face one, working face two and chip of crossbeam two turnovers on top are overlapping.The utility model has been guaranteed the welding orientation problem, and has improved the efficient of the preceding back work of welding processing greatly.
Description of drawings
Fig. 1 is a structural representation of the present utility model;
1 is frame body among the figure, the 2nd, and the line of turning back, the 3rd, crossbeam two, 30th, working face two, 31st, the structure of turning back, the 311st, the arm in the outside, the 312nd, inboard arm, the 4th, crossbeam one, 40th, working face one,
Fig. 2 is an A-A cutaway view among Fig. 1,
Wherein a is the schematic diagram of first step operating state, and b is the schematic diagram of the second step operating state, and b is the schematic diagram of the 3rd step operating state,
Fig. 3 is the structural representation after the utility model turnover,
Fig. 4 is a B place partial enlarged drawing among Fig. 3,
5 is chips among the figure;
Fig. 5 is the structural representation of the utility model background technology;
6 is lead frames one, 7th among the figure, lead frame two,
Fig. 6 is the reference view that the utility model background technology is in the preceding state of welding.
Embodiment
The utility model is shown in Fig. 1-4, and described frame body 1 is provided with the crossbeam 1 of laying lead-in wire one, also is provided with the crossbeam 23 of laying lead-in wire two on the described frame body 1, and described crossbeam 23 links to each other by the structure 31 of turning back with the two ends of crossbeam 1; The described structure 31 of turning back takes the shape of the letter U, and described U-shaped structure 31 arm 311 toward the outer side of turning back is provided with the line of turning back.The line of turning back can come out by the impression punch process.
Lead-in wire one on the described crossbeam 1 has working face 1, and described working face 1 up; Lead-in wire two on the described crossbeam 23 has working face 2 30, and described working face 2 30 up; Described crossbeam 23 along the described line 2 of turning back after 180 ° of crossbeam 1 turnovers, working face 1 is over against described working face 2 30, and leaves the space of the chip 5 that described chip diode is set.Carry out welding processing then, the three promptly is connected as a single entity.
Principle of the present utility model is: two frameworks (crossbeam one, two) are lumped together, and one-step punching through the bending welding, can effectively be avoided the off normal in the welding process behind the filling chip.Paste mutually with chip upper surface after superposed crossbeam is turned up 180 °, the welding back forms a pad.
Claims (2)
1. the framework of a chip diode, described frame body are provided with the crossbeam one of laying lead-in wire one, it is characterized in that, also are provided with the crossbeam two of laying lead-in wire two on the described frame body, and described crossbeam two links to each other by the structure of turning back with the two ends of crossbeam one; The described structure of turning back takes the shape of the letter U, and the described U-shaped structure arm toward the outer side of turning back is provided with the line of turning back.
2. the framework of a kind of chip diode according to claim 1 is characterized in that, the lead-in wire one on the described crossbeam one has working face one, and described working face one up; Lead-in wire two on the described crossbeam two has working face two, and described working face two up; Described crossbeam two along the described line of turning back after 180 ° of crossbeam one turnovers, working face one is over against described working face two, and leaves the space of the chip that described chip diode is set.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120192335 CN202076259U (en) | 2011-06-09 | 2011-06-09 | Frame of chip diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120192335 CN202076259U (en) | 2011-06-09 | 2011-06-09 | Frame of chip diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202076259U true CN202076259U (en) | 2011-12-14 |
Family
ID=45114348
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201120192335 Expired - Lifetime CN202076259U (en) | 2011-06-09 | 2011-06-09 | Frame of chip diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202076259U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102214636A (en) * | 2011-06-09 | 2011-10-12 | 扬州扬杰电子科技股份有限公司 | Framework of SMD (Surface Mount Device) type diode |
| CN105449075A (en) * | 2015-11-06 | 2016-03-30 | 常州志得电子有限公司 | Novel surface mount diode manufacturing process and special welding mold thereof |
-
2011
- 2011-06-09 CN CN 201120192335 patent/CN202076259U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102214636A (en) * | 2011-06-09 | 2011-10-12 | 扬州扬杰电子科技股份有限公司 | Framework of SMD (Surface Mount Device) type diode |
| CN105449075A (en) * | 2015-11-06 | 2016-03-30 | 常州志得电子有限公司 | Novel surface mount diode manufacturing process and special welding mold thereof |
| CN105449075B (en) * | 2015-11-06 | 2018-02-13 | 常州志得电子有限公司 | A kind of stick chip type diode manufacturing process and its special welding mould |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20111214 Effective date of abandoning: 20121003 |