CN102214636A - Framework of SMD (Surface Mount Device) type diode - Google Patents
Framework of SMD (Surface Mount Device) type diode Download PDFInfo
- Publication number
- CN102214636A CN102214636A CN2011101536775A CN201110153677A CN102214636A CN 102214636 A CN102214636 A CN 102214636A CN 2011101536775 A CN2011101536775 A CN 2011101536775A CN 201110153677 A CN201110153677 A CN 201110153677A CN 102214636 A CN102214636 A CN 102214636A
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- China
- Prior art keywords
- framework
- foldback
- working face
- crossbeam
- lead
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Resistance Welding (AREA)
- Die Bonding (AREA)
Abstract
The invention provides a framework of an SMD (Surface Mount Device) type diode and relates to the improvement of the framework of the SMD type diode in the mass processing line. The positioning accuracy is high and no auxiliary frock is needed. A framework body is provided with a beam I of a layout lead I and is also provided with a beam II of a layout lead II, the two ends of the beam II are connected with the two ends of the beam I through a foldback structure; the foldback structure is U-shaped and a foldback line is arranged on the arm facing outwards of the U-shaped foldback structure. According to the invention, the two leads are on the same panel veneer in the process of blanking in order to thoroughly avoid moving from left to right probably in stack. The positions from beginning to end can be scored on the foldback structure by a foldback mark according to the size calculation, thus the positioning precise of the positions from beginning to end can be ensured. When in use, the upper beam just needs to be reversed along the foldback line with180 degrees, so the axis of a first working face, a second working face and a chip can be overlapped. The framework in the invention can ensure the welding positioning and greatly improve the efficiency of the auxiliary work before welding processing.
Description
Technical field
The present invention relates to improvement to chip diode framework on the processing line in enormous quantities.
Background technology
The chip diode work in-process, for raising the efficiency, at present, the mode that the applicant adopted adopts two lead frames shown in Fig. 5,6, and lead frame 1, lead frame 27 are provided with some lead-in wires one, lead-in wire two respectively on both.Then, be one by both with chips welding.The schemes of two lead frame opposites welding, in welding process, two the easy left and right sides of lead frame off normals, in case some deviations occur, then all over products on these two lead frames all deviation can occur, and there is hidden danger in the quality of product.Once carried out research of technique for this reason, and adopted the assist location frock that both are positioned before welding, but behind the location, when doing the clamping action, can move by the trace string, be difficult to guarantee positional precision between the two at last lead-in wire.
Summary of the invention
The present invention is directed to above problem, a kind of positioning accuracy height is provided, need not to adopt the framework of the chip diode of assist location frock.
Technical scheme of the present invention is: described frame body is provided with the crossbeam one of laying lead-in wire one, also is provided with the crossbeam two of laying lead-in wire two on the described frame body, and described crossbeam two links to each other by the structure of turning back with the two ends of crossbeam one; The described structure of turning back takes the shape of the letter U, and the described U-shaped structure arm toward the outer side of turning back is provided with the line of turning back.
Lead-in wire one on the described crossbeam one has working face one, and described working face one up; Lead-in wire two on the described crossbeam two has working face two, and described working face two up; Described crossbeam two along the described line of turning back after 180 ° of crossbeam one turnovers, working face one is over against described working face two, and leaves the space of the chip that described chip diode is set.
Two lead-in wires (be this case middle cross beam one, crossbeam two) of the present invention add man-hour at stamping-out, are on the same plate, go here and there got rid of thoroughly that both may occur when stacking about and move.Calculate according to size the position of location, front and back, can delineate the trace of turning back on the structure of turning back, and can guarantee the positioning accuracy of front and back position like this.During use, only need along the line of turning back 180 ° of axle center (three's focus of work point) that can guarantee working face one, working face two and chip of crossbeam two turnovers on top are overlapping.The present invention has guaranteed the welding orientation problem, and has improved the efficient of the preceding back work of welding processing greatly.
Description of drawings
Fig. 1 is a structural representation of the present invention;
1 is frame body among the figure, the 2nd, and the line of turning back, the 3rd, crossbeam two, 30th, working face two, 31st, the structure of turning back, the 311st, the arm in the outside, the 312nd, inboard arm, the 4th, crossbeam one, 40th, working face one,
Fig. 2 is an A-A cutaway view among Fig. 1,
Wherein a is the schematic diagram of first step operating state, and b is the schematic diagram of the second step operating state, and b is the schematic diagram of the 3rd step operating state,
Fig. 3 is the structural representation after the present invention turns down,
Fig. 4 is a B place partial enlarged drawing among Fig. 3,
5 is chips among the figure;
Fig. 5 is the structural representation of background technology of the present invention;
6 is lead frames one, 7th among the figure, lead frame two,
Fig. 6 is the reference view that background technology of the present invention is in the preceding state of welding.
Embodiment
The present invention is shown in Fig. 1-4, and described frame body 1 is provided with the crossbeam 1 of laying lead-in wire one, also is provided with the crossbeam 23 of laying lead-in wire two on the described frame body 1, and described crossbeam 23 links to each other by the structure 31 of turning back with the two ends of crossbeam 1; The described structure 31 of turning back takes the shape of the letter U, and described U-shaped structure 31 arm 311 toward the outer side of turning back is provided with the line of turning back.The line of turning back can come out by the impression punch process.
Lead-in wire one on the described crossbeam 1 has working face 1, and described working face 1 up; Lead-in wire two on the described crossbeam 23 has working face 2 30, and described working face 2 30 up; Described crossbeam 23 along the described line 2 of turning back after 180 ° of crossbeam 1 turnovers, working face 1 is over against described working face 2 30, and leaves the space of the chip 5 that described chip diode is set.Carry out welding processing then, the three promptly is connected as a single entity.
Principle of the present invention is: two frameworks (crossbeam one, two) are lumped together, and one-step punching through the bending welding, can effectively be avoided the off normal in the welding process behind the filling chip.Paste mutually with chip upper surface after superposed crossbeam is turned up 180 °, the welding back forms a pad.
Claims (2)
1. the framework of chip diode, described frame body are provided with the crossbeam one of laying lead-in wire one, it is characterized in that, also are provided with the crossbeam two of laying lead-in wire two on the described frame body, and described crossbeam two links to each other by the structure of turning back with the two ends of crossbeam one; The described structure of turning back takes the shape of the letter U, and the described U-shaped structure arm toward the outer side of turning back is provided with the line of turning back.
2. the framework of chip diode according to claim 1 is characterized in that, the lead-in wire one on the described crossbeam one has working face one, and described working face one up; Lead-in wire two on the described crossbeam two has working face two, and described working face two up; Described crossbeam two along the described line of turning back after 180 ° of crossbeam one turnovers, working face one is over against described working face two, and leaves the space of the chip that described chip diode is set.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110153677 CN102214636B (en) | 2011-06-09 | 2011-06-09 | Framework of SMD (Surface Mount Device) type diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110153677 CN102214636B (en) | 2011-06-09 | 2011-06-09 | Framework of SMD (Surface Mount Device) type diode |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102214636A true CN102214636A (en) | 2011-10-12 |
| CN102214636B CN102214636B (en) | 2012-10-03 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110153677 Active CN102214636B (en) | 2011-06-09 | 2011-06-09 | Framework of SMD (Surface Mount Device) type diode |
Country Status (1)
| Country | Link |
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| CN (1) | CN102214636B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107534036A (en) * | 2015-04-10 | 2018-01-02 | 德克萨斯仪器股份有限公司 | For chip and the lead frame of the electronic system of component with vertical stacking |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1316766A (en) * | 2000-01-25 | 2001-10-10 | 斯坦雷电气株式会社 | Indicating lamp |
| CN201466022U (en) * | 2009-04-27 | 2010-05-12 | 绍兴旭昌科技企业有限公司 | Lead frame and chip connecting structure encapsulated with micro-patch diode |
| CN202076259U (en) * | 2011-06-09 | 2011-12-14 | 扬州扬杰电子科技股份有限公司 | Frame of chip diode |
-
2011
- 2011-06-09 CN CN 201110153677 patent/CN102214636B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1316766A (en) * | 2000-01-25 | 2001-10-10 | 斯坦雷电气株式会社 | Indicating lamp |
| CN201466022U (en) * | 2009-04-27 | 2010-05-12 | 绍兴旭昌科技企业有限公司 | Lead frame and chip connecting structure encapsulated with micro-patch diode |
| CN202076259U (en) * | 2011-06-09 | 2011-12-14 | 扬州扬杰电子科技股份有限公司 | Frame of chip diode |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107534036A (en) * | 2015-04-10 | 2018-01-02 | 德克萨斯仪器股份有限公司 | For chip and the lead frame of the electronic system of component with vertical stacking |
| US10879154B2 (en) | 2015-04-10 | 2020-12-29 | Texas Instruments Incorporated | Flippable leadframe for packaged electronic system having vertically stacked chips and components |
| CN107534036B (en) * | 2015-04-10 | 2021-01-22 | 德克萨斯仪器股份有限公司 | Lead frame for electronic system with vertically stacked chips and assemblies |
| US11742263B2 (en) | 2015-04-10 | 2023-08-29 | Texas Instruments Incorporated | Flippable leadframe for packaged electronic system having vertically stacked chip and components |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102214636B (en) | 2012-10-03 |
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