CN202062726U - Compound plate for packing - Google Patents

Compound plate for packing Download PDF

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Publication number
CN202062726U
CN202062726U CN2011201546537U CN201120154653U CN202062726U CN 202062726 U CN202062726 U CN 202062726U CN 2011201546537 U CN2011201546537 U CN 2011201546537U CN 201120154653 U CN201120154653 U CN 201120154653U CN 202062726 U CN202062726 U CN 202062726U
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CN
China
Prior art keywords
substrate
bonding
packing
compound plate
composite plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2011201546537U
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Chinese (zh)
Inventor
韩胜祥
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN2011201546537U priority Critical patent/CN202062726U/en
Application granted granted Critical
Publication of CN202062726U publication Critical patent/CN202062726U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses a compound plate for packing, which comprises a substrate, wherein the substrate is compounded with a bonding layer for bonding. The compound plate has the technical advantages that: 1, the procedure is simplified, and convenience, practicability, high efficiency and rapidness are realized; 2, the compound plate is clean and environmentally-friendly, and has low defective product rate and lower waste; 3, a bonding surface is fixedly sealed into a whole after thermal bonding and cooling, so the bonding fastness is strong; 4, a plastic film layer is formed on the surface of the substrate, so that the material intensity is enhanced, and waterproofness and heat preservation are realized; and 5, resin is taken as a bonding material, so that the compound plate is environmentally-friendly.

Description

The packing composite plate
Technical field
The utility model relates to a kind of packing composite plate, is applied to the printing packaging field.
Technical field
Current, manufacturing enterprises such as electronic chip, hardware ﹠ tools, medicine food require more and more higher to the packing of product, and specific requirement is generally as follows: 1. and attractive in appearance, directly perceived, allow client when the free choice of goods, not unpack and can see product clearly; 2. firm and durable, Theft-proof and anti-counter, client must destroy the packing of product when taking out commodity; 3. waterproof is anti-presses heat-insulation and heat-preservation; 4. the packing of product is simple, efficient quick.In order to satisfy above-mentioned requirements, present printing packaging enterprise is generally taking following method:
1. adopt printing paper+bonding layer structure of transparent plastic uptake shell+glue, there is significant disadvantages in such manner of packing: complex procedures, and time-consuming; Packaging operation requires high, and the gluing position has deviation glue to pollute surface of package slightly, and the defective products rate is higher, and waste is serious; Pack bonding instability, storage condition changes comes unglued than Da Yi; Packing does not have waterproof thermal-insulated effect; Because of technology of the package institute to and glue mostly be solvent-borne type so do not reach higher environmental requirement.
2. transparent folding box or vacuum formed box, the cost and the print request of this manner of packing are higher, are difficult on the market accept.
3. plastic bag packaging, such manner of packing exist softer no deflection, shortcoming withstand voltage, attractive in appearance, not of low grade.
All there is such-and-such shortcoming in above-mentioned three kinds of manner of packings commonly used, therefore, are necessary a kind of packing composite plate newly developed, overcome above-mentioned shortcoming.
The utility model content
Technical problem to be solved in the utility model is that the problems referred to above at present printing packaging exists provide a kind of packing composite plate easy and simple to handle, with low cost.
The utility model adopts following technical proposal to solve the problems of the technologies described above:
A kind of packing composite plate comprises a substrate, and compound one deck is used for bonding adhesive linkage on the substrate.
In order to increase the intensity of composite plate, be provided with a plastic membranous layer between described substrate and the adhesive linkage.
Described substrate is cardboard, drapery panel or leather board.
Described adhesive linkage adopts modified resin.
Described modified resin be second rare-acetate ethylene copolymer (EVA), polyamide (PA), expoxy propane (PO), thermoplastic polyurethane's elastomer (TPU) or polyester (PES).
The utility model brings following technological merit: 1. operation is simplified, and is convenient and easy, efficient quick.2. clean pollution-free, the defective products rate is low, wastes lower.3. hot sticky cooling back adhesive surface seals the formation one admittedly, and bonding intensity is strong.4. substrate surface forms the plastic cement rete, increases the strength of materials, and is waterproof thermal-insulated.5. jointing material is a resin, environmental protection.
Description of drawings
Accompanying drawing 1 is an overall structure schematic diagram of the present utility model
Description of symbols among the figure
1---substrate 2---adhesive linkage
3---plastic membranous layer
The specific embodiment
As shown in Figure 1, a kind of packing composite plate comprises a substrate 1, and compound one deck is used for bonding adhesive linkage 2 on the substrate 1.
In order to increase the intensity of composite plate, be provided with a plastic membranous layer 3 between described substrate 1 and the adhesive linkage 2.Described substrate 1, adhesive linkage 2, plastic membranous layer 3 adopt extrusion modling.
Described substrate 1 is cardboard, drapery panel or leather board.
Described adhesive linkage 3 adopts modified resin.
Described modified resin is EVA, PA, PO, TPU or PES.

Claims (5)

1. a packing composite plate comprises a substrate, it is characterized in that: compound one deck is used for bonding adhesive linkage on the substrate.
2. packing composite plate according to claim 1 is characterized in that: be provided with a plastic membranous layer between substrate and adhesive linkage.
3. packing composite plate according to claim 1 and 2 is characterized in that: described substrate is cardboard, drapery panel or leather board.
4. packing composite plate according to claim 1 is characterized in that: described adhesive linkage adopts modified resin.
5. packing composite plate according to claim 4 is characterized in that: described modified resin is EVA, PA, PO, TPU or PES.
CN2011201546537U 2011-05-16 2011-05-16 Compound plate for packing Expired - Fee Related CN202062726U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2011201546537U CN202062726U (en) 2011-05-16 2011-05-16 Compound plate for packing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011201546537U CN202062726U (en) 2011-05-16 2011-05-16 Compound plate for packing

Publications (1)

Publication Number Publication Date
CN202062726U true CN202062726U (en) 2011-12-07

Family

ID=45056603

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011201546537U Expired - Fee Related CN202062726U (en) 2011-05-16 2011-05-16 Compound plate for packing

Country Status (1)

Country Link
CN (1) CN202062726U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102828598A (en) * 2012-09-29 2012-12-19 陈伟文 Preparation method of flame-retardant product soft pack

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102828598A (en) * 2012-09-29 2012-12-19 陈伟文 Preparation method of flame-retardant product soft pack

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20111207

Termination date: 20150516

EXPY Termination of patent right or utility model