CN202062379U - Unloading manipulator for sintering solar silicon wafers - Google Patents
Unloading manipulator for sintering solar silicon wafers Download PDFInfo
- Publication number
- CN202062379U CN202062379U CN2011200385010U CN201120038501U CN202062379U CN 202062379 U CN202062379 U CN 202062379U CN 2011200385010 U CN2011200385010 U CN 2011200385010U CN 201120038501 U CN201120038501 U CN 201120038501U CN 202062379 U CN202062379 U CN 202062379U
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- CN
- China
- Prior art keywords
- silicon chip
- silicon wafer
- unloading manipulator
- vacuum cup
- silicon wafers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model provides an unloading manipulator for sintering solar silicon wafers, which comprises a mechanical arm (1) capable of spatially moving. The unloading manipulator is characterized in that a vacuum sucker (2) is connected to the lower end of the mechanical arm (1) and connected with a vacuum pump by a pipeline (3), the vacuum sucker (2) can suck a silicon wafer (6) from the upper side of the silicon wafer (6) to convey the same, and the diameter of the vacuum sucker (2) is 2/5 to 4/5 of the width of the silicon wafer (6). The unloading manipulator can avoid abnormal force bearing of the edge of the silicon wafer due to the fact that the silicon wafer is in downward pressure when grabbed, the silicon wafer bears uniform force when sucked, and quality problems such as breakage, broken edges or concealed cracking and the like of the silicon wafer due to unloading are effectively prevented.
Description
Technical field
The utility model relates to the manufacturing equipment of solar cell, particularly relates to a kind of solar silicon wafers sintering unloading manipulator.
Background technology
Solar cell mainly is made of silicon chip, and sintering is the final key technology that solar silicon wafers is made, and it is under action of high temperature, will be printed on the conductive metal layer sintering of silicon chip surface, contacts with the P-N knot of electrode thereby finish silicon chip.Silicon chip is placed on the furnace zone of high temperature sintering furnace, by the furnace zone transmission, finishes sintering through a plurality of warm areas of high temperature sintering furnace.Existing high temperature sintering furnace, it is used to carry the furnace zone of silicon chip is the furnace zone, plane, silicon chip back of the body field contacts with surface, furnace zone face, contact area is big, if have the furnace zone surface abrasion or dirty etc. all can to cause the back of the body to produce qualities such as aluminium is protruding bad, thereby the increase internal resistance of cell, the energy conversion efficiency of reduction cell silicon chip.At this problem, we improve the furnace zone, dovetail groove is set on the furnace zone, silicon slice placed places in the dovetail groove, the both sides of the edge of silicon chip contact with two prisms of dovetail groove, and plane contact can not carried out with the furnace zone in the bottom surface of silicon chip, has reduced both contacts area greatly, even wearing and tearing are arranged the surface, furnace zone or the silicon chip back of the body that can not cause such as dirty produces quality bad phenomenon such as aluminium is protruding, improve the qualification rate of product and the energy conversion efficiency of cell silicon chip.But, its lower end of original silicon chip unloading manipulator is several suction nozzles, the mode of taking to grasp is transported silicon chip, promptly carrying out direct multiple spot by several suction nozzles and silicon chip on the furnace zone contacts, suction nozzle applies slight downforce on silicon chip, because silicon chip and furnace zone have only EDGE CONTACT stressed, thereby cause silicon chip breakage or latent splitting easily.
The utility model content
For addressing the above problem, the utility model proposes a kind of solar silicon wafers sintering unloading manipulator, it can not apply downforce to silicon chip when fetching and delivering silicon chip, can effectively avoid grasping breakage that silicon chip produces, collapse limit or latent quality problems such as split.
The purpose of this utility model is achieved in that a kind of solar silicon wafers sintering unloading manipulator, comprise the mechanical arm that to do spatial movement, the lower end of described mechanical arm is connected with a vacuum cup, described vacuum cup is connected with vavuum pump by pipeline, and described vacuum cup can be above silicon chip picks up silicon chip and transports.Because vacuum cup just picks up silicon chip above near silicon chip, directly do not contact with silicon chip, thereby silicon chip can not be subjected to downforce, and the contacted edge in silicon chip and furnace zone can not be subjected to unusual reaction of bearing yet, just can not produce to collapse limit, fragmentation or latent quality problems such as split; And the vacuum cup with big adsorption area, stressed even when silicon chip is drawn, also can prevent to produce fragmentation or latent splitting.
Further, the scratch diskette diameter of described vacuum cup is 2/5～4/5 of a described silicon chip width.
Further, described vacuum cup is lifted on the mounting bracket by bolt, and this mounting bracket is connected with the cylinder of described mechanical arm bottom.
Further, described mounting bracket is a spoke-like, is provided with lightening hole on the disc of mounting bracket, and described bolt is positioned at the end of disc.
Beneficial effect:
The utility model can avoid silicon chip to be subjected to downforce when grasping and the stressed anomaly in edge that causes, and silicon chip when being drawn stressed evenly, thereby effectively prevent because of breakage that discharging produces, collapse limit or latent quality problems such as split.
Description of drawings
Below in conjunction with accompanying drawing the utility model is described in further detail:
Fig. 1 is a structural representation of the present utility model.
Fig. 2 is a user mode schematic diagram of the present utility model.
The specific embodiment
Below with reference to accompanying drawing, preferred embodiment of the present utility model is described.
Referring to Fig. 1, a kind of solar silicon wafers sintering unloading manipulator, comprise the mechanical arm 1 that to do spatial movement, be connected with a vacuum cup 2 in the lower end of mechanical arm 1, described vacuum cup 2 is connected with vavuum pump by pipeline 3, scratch diskette 21 diameters of vacuum cup 2 are about 3/5 of as ready silicon chip 6 width, and described vacuum cup 2 can be above silicon chip 6 picks up silicon chip 6 and transports.
As shown in Figure 1, vacuum cup 2 is lifted on the mounting bracket 4 by three bolts 5, and this mounting bracket 4 is connected with the cylinder 11 of described mechanical arm 1 bottom.Mounting bracket 4 is a spoke-like, is provided with lightening hole 42 on three disc 41 of mounting bracket 4, and described bolt 5 is positioned at the end of disc 41.
As shown in Figure 2, furnace zone 7 is by support wheel 8 supportings, silicon chip 6 is positioned in the isosceles trapezoid groove 71 in furnace zone 7, the both sides of the edge of silicon chip 6 contact with the inclined side of the isosceles trapezoid groove 71 in furnace zone 7, vacuum cup 2 can the position at a distance of 2mm pick up silicon chip 6 above silicon chip 6, vacuum cup 2 does not directly contact with silicon chip 6, thereby silicon chip 6 can not be subjected to downforce, silicon chip 6 can not be subjected to unusual reaction of bearing with 7 contacted edges, furnace zone yet, quality problems such as does not split so can not produce to collapse limit, fragmentation or conceal; And the vacuum cup 2 with big adsorption area, stressed even when silicon chip 6 is drawn, also can prevent to produce fragmentation or latent splitting.
The above only is a kind of embodiment of the present utility model; not in order to restriction the utility model; all any modifications of within spirit of the present utility model and principle, being done, be equal to and replace and improvement etc., all should be included within the protection domain of the present utility model.
Claims (4)
1. solar silicon wafers sintering unloading manipulator, comprise the mechanical arm (1) that to do spatial movement, it is characterized in that: the lower end of described mechanical arm (1) is connected with a vacuum cup (2), described vacuum cup (2) is connected with vavuum pump by pipeline (3), and described vacuum cup (2) can pick up silicon chip (6) in the top of silicon chip (6) and transport.
2. solar silicon wafers sintering unloading manipulator according to claim 1 is characterized in that: scratch diskette (21) diameter of described vacuum cup (2) is 2/5～4/5 of described silicon chip (a 6) width.
3. solar silicon wafers sintering unloading manipulator according to claim 1 and 2, it is characterized in that: described vacuum cup (2) is lifted on the mounting bracket (4) by bolt (5), and this mounting bracket (4) is connected with the cylinder (11) of described mechanical arm (1) bottom.
4. solar silicon wafers sintering unloading manipulator according to claim 3, it is characterized in that: described mounting bracket (4) is spoke-like, be provided with lightening hole (42) on the disc (41) of mounting bracket (4), described bolt (5) is positioned at the end of disc (41).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200385010U CN202062379U (en) | 2011-01-31 | 2011-01-31 | Unloading manipulator for sintering solar silicon wafers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200385010U CN202062379U (en) | 2011-01-31 | 2011-01-31 | Unloading manipulator for sintering solar silicon wafers |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202062379U true CN202062379U (en) | 2011-12-07 |
Family
ID=45056257
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011200385010U Expired - Fee Related CN202062379U (en) | 2011-01-31 | 2011-01-31 | Unloading manipulator for sintering solar silicon wafers |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202062379U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108861596A (en) * | 2018-08-30 | 2018-11-23 | 佛山职业技术学院 | A kind of sucker clamp structure for solar silicon wafers detection robot |
| CN109300832A (en) * | 2018-08-28 | 2019-02-01 | 湖州景盛新能源有限公司 | Suction means is used in a kind of production of solar battery sheet |
-
2011
- 2011-01-31 CN CN2011200385010U patent/CN202062379U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109300832A (en) * | 2018-08-28 | 2019-02-01 | 湖州景盛新能源有限公司 | Suction means is used in a kind of production of solar battery sheet |
| CN108861596A (en) * | 2018-08-30 | 2018-11-23 | 佛山职业技术学院 | A kind of sucker clamp structure for solar silicon wafers detection robot |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111207 Termination date: 20150131 |
|
| EXPY | Termination of patent right or utility model |