CN202059578U - Silicon microphone packaging - Google Patents
Silicon microphone packaging Download PDFInfo
- Publication number
- CN202059578U CN202059578U CN201120091538XU CN201120091538U CN202059578U CN 202059578 U CN202059578 U CN 202059578U CN 201120091538X U CN201120091538X U CN 201120091538XU CN 201120091538 U CN201120091538 U CN 201120091538U CN 202059578 U CN202059578 U CN 202059578U
- Authority
- CN
- China
- Prior art keywords
- silicon microphone
- wiring board
- metal level
- encapsulation
- shell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 57
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 57
- 239000010703 silicon Substances 0.000 title claims abstract description 57
- 238000004806 packaging method and process Methods 0.000 title abstract description 7
- 239000002184 metal Substances 0.000 claims abstract description 28
- 238000005538 encapsulation Methods 0.000 claims description 37
- 239000003292 glue Substances 0.000 claims description 24
- 238000006243 chemical reaction Methods 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 10
- 238000009434 installation Methods 0.000 claims description 7
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 238000005516 engineering process Methods 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 3
- 239000010410 layer Substances 0.000 abstract 4
- 239000000758 substrate Substances 0.000 abstract 2
- 239000012790 adhesive layer Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 description 11
- 238000010276 construction Methods 0.000 description 6
- 230000009931 harmful effect Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Images
Abstract
The utility model discloses a silicon microphone packaging, comprising a silicon microphone acoustoelectric converting chip, a shell and a circuit board. The acoustoelectric converting chip is fixed with the circuit board via an adhesive layer, the circuit board comprises a substrate and a metal layer arranged on the substrate, and the shell is fixedly combined with the metal layer located at the edge of the circuit board to form an outer frame of the silicon microphone. Moreover, the circumference of an installing face of the circuit board for packaging the silicon microphone acoustoelectric converting chip is equipped with an adhesive-blocking part. Compared with a conventional technology, the silicon microphone packaging provided by the utility model can prevent the gluewater from spilling over to the metal layer at the edge of the circuit board when the packaging is carried out, and avoid a bad effect when the shell is assembled with the metal layer to make the combination of the shell and the circuit board more firm.
Description
Technical field
The utility model relates to the encapsulation field of silicon microphone, relate in particular to a kind of when preventing to encapsulate the glue between acoustic-electro conversion chip and the wiring board overflow, reduce the bad silicon microphone of product.
Background technology
Along with the development of portable terminal consumer electronics product, the application of microphone (as silicon microphone) product is more extensive.
At present, traditional silicon microphone encapsulation as shown in Figure 9, comprise silicon microphone 1, wiring board 3 and shell 5, fixing between silicon microphone 1 and the wiring board 3 by glue-line 2 bondings, wiring board 3 comprises base material 31 and is successively set on metal level 32 and solder mask 4 on the base material 31 that shell 5 is arranged on the metal level 32 at wiring board 3 edges and fixes by modes such as bonding or welding.The encapsulation of the silicon microphone of this structure and since in the vertical direction glue-line 2 and wiring board 3 edges exist certain altitude poor, cause glue-line 2 to overflow the bonding plane of wiring board 3 easily, excessive glue may cause and cover the metal level 32 that is arranged on wiring board 3 edges; Influence wiring board 3 and fix, cause the insecure of product combination, cause the bad of properties of product with the encapsulation of shell 5.
So, be necessary the silicon microphone encapsulation of said structure is further improved, to avoid above-mentioned defective.
Summary of the invention
Technical problem to be solved in the utility model is: a kind of silicon microphone encapsulation is provided, and glue overflows to the metal level at wiring board edge in the time of can preventing to encapsulate, and the harmful effect when avoiding shell and metal level assembling makes shell more firm with combining of wiring board.
For solving the problems of the technologies described above, the technical solution of the utility model is: a kind of silicon microphone encapsulation, bag
Draw together silicon microphone acoustic-electro conversion chip, shell and wiring board, described acoustic-electro conversion chip is fixed by glue-line and described wiring board; Described wiring board comprises base material and is located at metal level on the described base material, described shell be positioned at the metal level secure bond at described wiring board edge and surround the external frame of described silicon microphone, and the wiring board installed surface periphery that encapsulates described silicon microphone acoustic-electro conversion chip is provided with retaining glue portion.
In addition, preferred construction is, described retaining glue portion is the local formed groove of described metal level of removing.
In addition, preferred construction is that described groove is an annular.
In addition, preferred construction is that described groove forms by the local metal level of removing described wiring board installed surface periphery.
In addition, preferred construction is that described wiring board installed surface is provided with the installation portion that removes to expect the described silicon microphone of formed encapsulation by metal level.
In addition, preferred construction is, described retaining glue portion is the boss that is arranged on described wiring board installed surface periphery.
In addition, preferred construction is that described boss is the solder mask that is arranged on PCB surface.
After adopting above-mentioned technical scheme, than conventional art, glue overflow to the metal level at wiring board edge when silicon microphone encapsulation provided by the utility model can prevent to encapsulate, and the harmful effect when avoiding shell and metal level assembling makes shell more firm with combining of wiring board.
Description of drawings
By below in conjunction with accompanying drawing embodiment being described, above-mentioned feature of the present utility model and technological merit will become apparent and understand easily.
Fig. 1 is the generalized section of the utility model embodiment one silicon microphone encapsulation.
Fig. 2 is the generalized section of the utility model embodiment one wiring board.
Fig. 3 is the vertical view of the silicon microphone encapsulation wiring board that relates to of the utility model embodiment one.
Fig. 4 is the generalized section of the utility model embodiment two silicon microphones encapsulation.
Fig. 5 is the vertical view of the silicon microphone encapsulation wiring board that relates to of the utility model embodiment two.
Fig. 6 is the vertical view of the silicon microphone encapsulation wiring board that relates to of the utility model embodiment three.
Fig. 7 is the generalized section of the utility model embodiment four silicon microphones encapsulation.
Fig. 8 is the vertical view of the silicon microphone encapsulation circuit board structure that relates to of the utility model embodiment four.
Fig. 9 is the silicon microphone encapsulation generalized section of prior art.
Embodiment
Below in conjunction with the drawings and specific embodiments the utility model is done further detailed description.
In the following description, only the mode by explanation is described some one exemplary embodiment of the present utility model, undoubtedly, those of ordinary skill in the art can recognize, under the situation that does not depart from spirit and scope of the present utility model, can revise described embodiment with various mode.Therefore, accompanying drawing and be described in just illustratively in essence rather than is used to limit the protection range of claim.In addition, in this manual, identical Reference numeral indicates identical part.
Embodiment one:
Fig. 1 is the generalized section of the utility model embodiment one silicon microphone encapsulation; Fig. 2 is the generalized section of the utility model embodiment one wiring board.As depicted in figs. 1 and 2, the silicon microphone encapsulation comprises silicon microphone 1, wiring board 3 and shell 5, and is fixing by glue-line 2 encapsulation between silicon microphone 1 and the wiring board 3.Wiring board 3 comprises base material 31, and the metal level 32 that combines with base material 31, wherein be positioned at the metal level 32 at wiring board 3 edges and shell 5 is combined together to form silicon microphone by technologies such as bonding or welding external frame, on the wiring board 3 of silicon microphone 1 encapsulating face periphery, be provided with the retaining glue 33a of portion of annular, the retaining glue 33a of portion is a groove, and metal level 32 goes material to form by technologies such as etchings.
This design, when carrying out the assembling of shell and wiring board, glue-line between acoustic-electro conversion chip and the wiring board overflow glue can the metal level that stops and hold the edge that prevents to spill into wiring board by retaining glue portion on, avoid influencing the firmness of the assembling of shell and metal level, improved product quality.
Fig. 3 is the vertical view of the silicon microphone encapsulation wiring board that relates to of the utility model embodiment one, and as shown in Figure 3, wiring board 3 be a rectangle, and the installation region of encapsulating structure correspondence is square, and the silicon microphone of corresponding installation is the silicon microphone acoustic-electro conversion chip; Wiring board 3 is provided with the packaging area that the annular retaining glue 33a of portion surrounds, and the edge of wiring board 3 is used for assembling with the electronic units such as shell of microphone.
In the present embodiment, preferred, on the faying face between wiring board 3 and the silicon microphone 1, remove solder mask 4, can further reduce height like this, more help the microminiaturization of product design.
Embodiment two:
Fig. 4 is the generalized section of the utility model embodiment two silicon microphones encapsulation, Fig. 5 is the vertical view of the silicon microphone encapsulation wiring board that relates to of the utility model embodiment two, as shown in Figure 4 and Figure 5, this implementation process is that with the main distinction of embodiment one structure of wiring board is different, the surface of wiring board 3 is provided with retaining glue 33b of portion and installation portion 34 in this implementation process, acoustic-electro conversion chip 1 correspondence is installed in the installation portion 34, and fixing with wiring board 3 by glue-line 2, wherein installation portion 34 is to go material to form by metal level 31 on the wiring board installed surface.
This design of this implementation process can realize above-mentioned technique effect equally, and the faying face in this implementation process between silicon microphone acoustic-electro conversion chip and the wiring board has removed metal level, can further reduce the product height, more help the microminiaturization of product design.
Embodiment three;
Fig. 6 is the vertical view of the silicon microphone encapsulation wiring board that relates to of the utility model embodiment three, as shown in Figure 6, the structure that this implementation process and the main distinction of above-mentioned implementation process are to keep off glue portion is different, and the retaining glue 33c of portion is along three side settings of square structure packaging area in this implementation process.This design can be carried out circuit according to the actual needs and improve and architecture advances except that the technique effect that can realize above-mentioned embodiment, has satisfied more production actual demand.
Embodiment four:
Fig. 7 is the generalized section of the utility model embodiment four silicon microphones encapsulation, Fig. 8 is the vertical view of the silicon microphone encapsulation wiring board that relates to of the utility model embodiment four, as shown in Figure 7 and Figure 8, the structure that this implementation process and the main distinction of above-mentioned execution mode are to keep off glue portion is different, in this implementation process, outward flange at the retaining glue 33a of portion of groove structure also is provided with the boss 41 that is made of solder mask, and boss 41 can stop that glue overflows, and further improves the retaining colloidality energy of retaining glue portion.
Under above-mentioned instruction of the present utility model, those skilled in the art can be on the basis of the foregoing description
Carry out various improvement and distortion, as keep off the boss that glue portion only can be that the wiring board installed surface side face at the encapsulation acoustic-electro conversion chip is provided with, retaining glue portion is interrupted around the wiring board installed surface periphery that is arranged on the described microphone acoustic-electro conversion chip of encapsulation, and also can be designed to other can structure; The neither enforcement that influences the invention.These improvement and distortion all drop in the protection range of the present utility model, it will be understood by those skilled in the art that the just better the purpose of this utility model of explaining of above-mentioned specific descriptions, and protection range of the present utility model is limited by claim and equivalent thereof.
Claims (7)
1. a silicon microphone encapsulation comprises silicon microphone acoustic-electro conversion chip, shell and wiring board, and described acoustic-electro conversion chip is fixed by glue-line and described wiring board; Described wiring board comprises base material and is located at metal level on the described base material, described shell be positioned at the metal level secure bond at described wiring board edge and surround the external frame of described silicon microphone, it is characterized in that the wiring board installed surface periphery that encapsulates described silicon microphone acoustic-electro conversion chip is provided with retaining glue portion.
2. silicon microphone encapsulation according to claim 1 is characterized in that,
Described retaining glue portion is the local formed groove of described metal level of removing.
3. silicon microphone encapsulation according to claim 2 is characterized in that,
Described groove is an annular.
4. according to claim 2 or 3 described silicon microphone encapsulation, it is characterized in that,
Described groove forms by the local metal level of removing described wiring board installed surface periphery.
5. silicon microphone encapsulation according to claim 1 is characterized in that,
Described wiring board installed surface is provided with the installation portion that removes to expect the described silicon microphone of formed encapsulation by metal level.
6. silicon microphone encapsulation according to claim 1 is characterized in that,
Described retaining glue portion is the boss that is arranged on described wiring board installed surface periphery.
7. silicon microphone encapsulation according to claim 6 is characterized in that,
Described boss is the solder mask that is arranged on PCB surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120091538XU CN202059578U (en) | 2011-03-31 | 2011-03-31 | Silicon microphone packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120091538XU CN202059578U (en) | 2011-03-31 | 2011-03-31 | Silicon microphone packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202059578U true CN202059578U (en) | 2011-11-30 |
Family
ID=45019540
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201120091538XU Expired - Lifetime CN202059578U (en) | 2011-03-31 | 2011-03-31 | Silicon microphone packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202059578U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103200509A (en) * | 2013-04-09 | 2013-07-10 | 歌尔声学股份有限公司 | Mems microphone |
| CN103347239A (en) * | 2013-06-08 | 2013-10-09 | 歌尔声学股份有限公司 | MEMS microphone and assembling method thereof |
| CN106875982A (en) * | 2017-03-01 | 2017-06-20 | 深圳市佳鑫帆科技有限公司 | A kind of Medical Devices shell cambered surface transition connecting plate and its adhering method |
-
2011
- 2011-03-31 CN CN201120091538XU patent/CN202059578U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103200509A (en) * | 2013-04-09 | 2013-07-10 | 歌尔声学股份有限公司 | Mems microphone |
| CN103200509B (en) * | 2013-04-09 | 2015-11-11 | 歌尔声学股份有限公司 | Mems microphone |
| CN103347239A (en) * | 2013-06-08 | 2013-10-09 | 歌尔声学股份有限公司 | MEMS microphone and assembling method thereof |
| CN106875982A (en) * | 2017-03-01 | 2017-06-20 | 深圳市佳鑫帆科技有限公司 | A kind of Medical Devices shell cambered surface transition connecting plate and its adhering method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200609 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20111130 |