CN202056572U - COBLED encapsulation module capable of wide-angle lighting - Google Patents

COBLED encapsulation module capable of wide-angle lighting Download PDF

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Publication number
CN202056572U
CN202056572U CN2011200315056U CN201120031505U CN202056572U CN 202056572 U CN202056572 U CN 202056572U CN 2011200315056 U CN2011200315056 U CN 2011200315056U CN 201120031505 U CN201120031505 U CN 201120031505U CN 202056572 U CN202056572 U CN 202056572U
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CN
China
Prior art keywords
chip
substrate
wide
cobled
module capable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2011200315056U
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Chinese (zh)
Inventor
王超群
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DONGGUAN VIKIN OPTOELETRONIC Co Ltd
Original Assignee
DONGGUAN VIKIN OPTOELETRONIC Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DONGGUAN VIKIN OPTOELETRONIC Co Ltd filed Critical DONGGUAN VIKIN OPTOELETRONIC Co Ltd
Priority to CN2011200315056U priority Critical patent/CN202056572U/en
Application granted granted Critical
Publication of CN202056572U publication Critical patent/CN202056572U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

Provided is a COBLED encapsulation module capable of wide-angle lighting, relating to the technical field of LED chip modules, particularly a COBLED encapsulation module capable of wide-angle lighting. Chips are fixedly arranged on the surface of a substrate, the electrode of each chip is electrically connected to the circuit on the substrate, fluorescent powder and encapsulation adhesive are coated on the chips, and the fluorescent powder and the encapsulation adhesive are independently coated on each chip. the chips can illuminate at an angle of 180 degrees respectively after being conducted because the chips are fixedly arranged on the surface of the substrate and each chip is independently encapsulated. In this way, the lighting area is greatly improved with the same number of light sources.

Description

A kind of COBLED package module of wide-angle illumination
Technical field
The utility model relates to led chip encapsulation technology field, refers in particular to a kind of LED package module with wide-angle illumination.
Background technology
As everyone knows, light emitting diode (LED) is a kind of semiconductor solid luminescence device, it is to utilize the solid semiconductor wafer as luminescent material, when two ends add forward voltage, carrier in the semiconductor takes place compoundly to cause photo emissions and produce light, be the most popular current light source technology, the characteristics of led light source are: energy-conservation, consumed energy reduces 80% with the incandescent lamp of light efficiency; Use low-tension supply (between 6-24V), security is good; Volume is little, can be prepared into the device of different shape; Life-span is long; Response time is fast: the response time of incandescent lamp is a Millisecond, and the response time of LED lamp is a nanosecond; No poisonous metal mercury is to the pollution of environment etc., and along with the Application and Development of high-powered LED lamp, the LED lamp has developed to the module direction of functional illumination from happiness whence angle points light source, and development prospect is incomparably wide.
Yet, from application practice, find, the domestic and international at present LED lamp of producing, have it significantly not enough: promptly led light source is in manufacture process, for preventing that the fluorescent material levelling on the chip from influencing glow color and brightness, the position of placing chip on substrate all is made into the sinking pit, and each chip is placed in the pit on the substrate, and coating covers fluorescent material and packaging plastic thereon again.Because each chip is placed in the pit on the substrate, when its electrode connects when luminous, the light of emission is because the restriction of pit, and the scattering of light angle diminishes, and makes the light angle scope narrow down, if want large area lighting, can only can solve this difficult problem with the source side of adding lustre to.
Summary of the invention
The purpose of this utility model is to overcome above-mentioned weak point of the prior art, and a kind of COB LED package module with wide-angle illumination is provided.
The utility model is achieved by the following technical solution: the substrate surface at plane directly is installed with chip, and the electrode of chip is electrically connected with circuit on the substrate, is coated with fluorescent material on the chip, and each chip independently is coated with packaging plastic.
Because each chip is installed in substrate surface, and each chip individual packages, make after each chip conducting, can accomplish that 180 degree are luminous.Like this, under same quantity of light source, improved the field of illumination greatly.
Description of drawings
Accompanying drawing 1 is the utility model front view
Accompanying drawing 2 is the utility model cutaway view
Accompanying drawing 3 is the utility model stereogram.
The specific embodiment
See accompanying drawing 1~3, the utility model comprises substrate 1, chip 2 and fluorescent material and packaging plastic 3, and substrate 1 surface is installed with chip 2, and the electrode of chip 2 is electrically connected with circuit on the substrate 1, coating fluorescent material and packaging plastic 3 on the chip 2, each chip 2 independently is coated with fluorescent material and packaging plastic 3.
When using the utility model, substrate 1 is electrically connected external circuit, and chip 2 gets electroluminescence, because each chip 2 is installed in substrate surface, and each chip 2 individual packages, and protrude substrate surface, and make after each chip 2 conducting, can accomplish that 180 degree are luminous.

Claims (1)

1. the COBLED package module of wide-angle illumination, comprise substrate (1), chip (2) and fluorescent material and packaging plastic (3), it is characterized in that: substrate (1) surface is installed with chip (2), the electrode of chip (2) is electrically connected with circuit on the substrate (1), chip (2) is gone up coating fluorescent material packaging plastic (3), and each chip (2) independently is coated with fluorescent material and packaging plastic (3).
CN2011200315056U 2011-01-30 2011-01-30 COBLED encapsulation module capable of wide-angle lighting Expired - Fee Related CN202056572U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2011200315056U CN202056572U (en) 2011-01-30 2011-01-30 COBLED encapsulation module capable of wide-angle lighting

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011200315056U CN202056572U (en) 2011-01-30 2011-01-30 COBLED encapsulation module capable of wide-angle lighting

Publications (1)

Publication Number Publication Date
CN202056572U true CN202056572U (en) 2011-11-30

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011200315056U Expired - Fee Related CN202056572U (en) 2011-01-30 2011-01-30 COBLED encapsulation module capable of wide-angle lighting

Country Status (1)

Country Link
CN (1) CN202056572U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103199087A (en) * 2012-01-06 2013-07-10 太极光光电股份有限公司 Light mixing light-emitting diode (LED) lamp panel

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103199087A (en) * 2012-01-06 2013-07-10 太极光光电股份有限公司 Light mixing light-emitting diode (LED) lamp panel

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20111130

Termination date: 20140130