CN202049940U

CN202049940U - Radiating component

Info

Publication number: CN202049940U
Application number: CN2011201641531U
Authority: CN
Inventors: 詹义文
Original assignee: DELTA TECHNOLOGY (DONGGUAN) Co Ltd
Current assignee: DELTA TECHNOLOGY (DONGGUAN) Co Ltd
Priority date: 2011-05-20
Filing date: 2011-05-20
Publication date: 2011-11-23
Anticipated expiration: 2021-05-20

Abstract

The utility model provides a radiating component, which comprises a base plate, a chip, a heat conduction component, a radiating device and a fixing device. The chip is arranged on the base plate, the heat conduction component is disposed on the chip, the radiating device is disposed on the heat conduction component and provided with a base and a plurality of radiating fins, the radiating device is fixedly arranged on the base plate via the fixing device, the fixing device comprises at least one first locking component, at least one elastic component and at least one second locking component, the first locking component is provided with a penetrating portion and an abutting portion, the penetrating portion is penetratingly provided with the base plate from the bottom of the base plate and is penetratingly provided with the base so as to form an arrangement portion, the abutting portion is abutted to the bottom of the base plate, the elastic component is sleeved on the arrangement portion and is abutted to the base, the second locking component is locked on the arrangement portion and is used for being abutted to the elastic component and preventing the elastic component from being separated from the arrangement portion.

Description

Radiating subassembly

Technical field

The utility model relates to a kind of radiating subassembly, refers to that especially a kind of elastic force by elastic parts dynamically adjusts the radiating subassembly that strength is set of heat abstractor.

Background technology

Along with the lifting of electronic installation inside chip instruction cycle and the increase of consumed power, the heat of corresponding generation is also along with sharp increase.For chip can be moved under normal working temperature, need the setting of heat abstractor usually, to reduce the operating temperature of electronic installation, guarantee the normal operation of electronic installation.

Generally speaking; electronic installation mainly comprises a substrate, a chip and a heat abstractor; its chips is arranged on the substrate; heat abstractor then is arranged on the chip; in addition; in heat abstractor is arranged at process on the chip; one heat-conductive assembly also can additionally be set usually between chip and heat abstractor; dispel the heat the heat that chip was produced is conducted to heat abstractor by heat-conductive assembly; what is more; can utilize screw that heat abstractor is locked on substrate and the chip, finish Assembly Action with this.

Yet, dimensional tolerance because of heat-conductive assembly or chip itself, cause when the assembling heat abstractor is on heat-conductive assembly, heat abstractor can't be smooth on the heat-conductive assembly and and produce a gap between the heat-conductive assembly, thus, the radiating effect of heat abstractor can reduce because of existing air in the gap, smooth on chip or heat-conductive assembly though can make heat abstractor pass through the locking force of screw by rigid mode with screw locking, however but the method can cause chip to have the excessive and situation of easy damage of local pressure.

Therefore, how to develop a kind of above-mentioned prior art defective and structure assembling simple radiating assembly of improving, real in pressing for the problem of solution at present.

Summary of the invention

Main purpose of the present utility model is for providing a kind of radiating subassembly, not only the structure assembling is simple for it, and can solve existing heat abstractor because of can't smoothly on heat-conductive assembly, causing radiating effect relatively poor, or smooth on heat-conductive assembly because of need by the rigid method of screw locking is come, cause chip to have the excessive and defective of easy damage of local pressure.

For reaching above-mentioned purpose, better embodiment of the present utility model comprises: substrate for a kind of radiating subassembly is provided; Chip is arranged on the substrate; Heat-conductive assembly is arranged on the chip; Heat abstractor is arranged on the heat-conductive assembly, and has pedestal and a plurality of radiating fin; And fixture, in order to heat abstractor is fixedly arranged on the substrate, comprise: at least one first locked assembly, have the portion of wearing and top, the portion that wherein wears wears substrate by a bottom surface of substrate, and wears pedestal and form the portion of setting, and the top is replaced mutually with the bottom surface; At least one elastic parts sheathedly is provided with portion and replaces mutually with pedestal; And at least one second locked assembly, be locked in the portion of setting, in order to replacing mutually, and prevent that elastic parts is broken away from by the portion of setting with elastic parts.

Wherein, this substrate is made of circuit board or mainboard.

Wherein, this substrate has at least one perforated holes, and described perforated holes wears the corresponding setting of portion with this, makes this portion of wearing run through this perforated holes and wears this substrate.

Wherein, this heat-conductive assembly is made of conducting strip or thermal grease.

Wherein, the number of this fixture is 4.

Wherein, this elastic parts is made of spring.

Wherein, described a plurality of radiating fins partly block, with ccontaining this second locked assembly.

Wherein, this wears portion and this top is one of the forming.

Wherein in, this first locked assembly is a screw, this second locked assembly is a bolt.

Wherein, be arranged on the end face of this pedestal described a plurality of radiating fin compartments.

Technique effect of the present utility model is, this radiating subassembly is close on the heat-conductive assembly heat abstractor by the elastic force that elastic parts provided of fixture, so can promote the radiating efficiency of heat abstractor, avoid chip to have the excessive situation of local pressure simultaneously and take place, to prolong the useful life of chip.

Description of drawings

Fig. 1: it is the structural representation of the radiating subassembly of the utility model preferred embodiment.

Fig. 2: it is the top view of radiating subassembly shown in Figure 1.

Wherein, description of reference numerals is as follows:

1: radiating subassembly

10: substrate

101: the bottom surface

102: the first perforated holes

11: chip

12: heat-conductive assembly

13: heat abstractor

130: pedestal

131: radiating fin

132: end face

14: fixture

140: the first locked assemblies

140a: wear portion

140b: top

141: elastic parts

142: the second locked assemblies

143: portion is set

Embodiment

Some exemplary embodiments that embody the utility model feature and advantage will be described in detail in the explanation of back segment.Be understood that the utility model can have various variations on different modes, yet it does not break away from scope of the present utility model, and explanation wherein and the accompanying drawing usefulness that ought explain in itself, but not in order to restriction the utility model.

See also Fig. 1 and Fig. 2, wherein Fig. 1 is the structural representation of the radiating subassembly of the utility model preferred embodiment, and Fig. 2 is the top view of radiating subassembly shown in Figure 1.As shown in Figures 1 and 2, radiating subassembly 1 mainly comprises a substrate 10, a chip 11, one heat-conductive assemblies 12, a heat abstractor 13 and a fixture 14.Wherein substrate 10 can be but is not limited to and is made of circuit board or mainboard.

Chip 11 is arranged on the substrate 10, and can be but be not limited to and formed by ball grid array (BGA) encapsulation.Heat-conductive assembly 12 is arranged on the chip 11, and in order to the heat energy that produced of conduction chip 11, and in present embodiment, heat-conductive assembly 12 is constituted by conducting strip, but not as limit, also can be made of thermal grease.

Heat abstractor 13 is arranged on this heat-conductive assembly 12, in order to heat-conductive assembly 12 is discharged by conducting the heat energy that receives on the chip 11, and comprise a pedestal 130 and a plurality of radiating fin 131, be arranged on the end face 132 of pedestal 130 wherein a plurality of radiating fin 131 compartments.

Fixture 14 is in order to be fixedly arranged on heat abstractor 13 on the substrate 10, and comprise at least one first locked assembly 140, one elastic parts 141 and one second locked assembly 142, wherein first locked assembly 140 can be but is not limited to a screw and constitutes, and comprise integrated one and wear a 140a of portion and a top 140b, wear the 140a of portion and wear substrate 10 by a bottom surface 101 of substrate 10, and wear the pedestal 130 of heat abstractor 13, and then formation one is provided with portion 143 on the end face 132 of pedestal 130, this is provided with portion 143 can have screw thread, top 140b then in wearing the bottom surface 101 of the 140a of portion by substrate 10 when wearing substrate 10 and pedestal 130, replaces with bottom surface 101 mutually.

Elastic parts 141 is sheathed on the portion of setting 143, and replaces mutually with the end face 132 of pedestal 130, and can be but do not limit by spring and constituted.Second locked assembly 142 can be made of bolt, but not as limit, it is locked in the portion of setting 143, in order to replacing mutually with elastic parts 141, and prevents that elastic parts 141 breaks away from by portion 143 is set, and is fixedly arranged on heat abstractor 13 on the substrate 10 simultaneously.

Can learn by Fig. 1, when assembling is finished, that is the top 140b of first locked assembly 140 is resisted against the bottom surface 101 of substrate 10, and second locked assembly 142 is locked in the portion that is provided with 143 of first locked assembly 140 that has worn substrate 10 and pedestal 130, to prevent that elastic parts 141 is when being provided with portion 143 and breaking away from, because elastic parts 141 is replaced mutually with the end face 132 and second locked assembly 142 of pedestal 130 respectively, therefore just can be directly elastic force by elastic parts 141 heat abstractor 13 is close on the heat-conductive assembly 12, thus, not only can avoid producing the slit between heat abstractor 13 and the heat-conductive assembly 12, and then the radiating efficiency of lifting heat abstractor 13, and because the elastic force of this case by elastic parts 141 makes heat abstractor 13 be close to heat-conductive assembly 12, but not reach as the existing rigid mode of screw locking of utilizing, therefore chip 11 can't have the excessive situation generation of local pressure, so can reduce the risk that chip 11 damages.

Please consult Fig. 1 again, in some embodiment, substrate 10 also can have at least one first perforated holes 102, the corresponding setting of the 140a of the portion that wears of first perforated holes 102 and first locked assembly 140, make the portion 140a of wearing to run through first perforated holes 102 and wear substrate 10, this outer frame 130 also can have at least one second perforated holes (not shown), equally with the corresponding setting of the 140a of the portion that wears of first locked assembly 140, so the portion 140a of wearing can run through second perforated holes and wear pedestal 130.

Please consult Fig. 2 again, for the elastic force that makes elastic parts 141 can act on the heat abstractor 13 uniformly, allow heat abstractor 13 positively be close on the heat-conductive assembly 12 with this, in present embodiment, the number of fixture 14 is good with four, that is first locked assembly 140, elastic parts 141 and second locked assembly 142 be good with four respectively, but not as limit, can change according to actual demand.In addition, in present embodiment, do not hindered when making second locked assembly 142 be locked in the portion 143 of setting by radiating fin 131, radiating fin 131 partly can be blocked, with this form can ccontaining second locked assembly 142 the space, so not as limit, the different aspects of implementing also can be arranged according to actual demand, for example when the volume adequacy of second locked assembly 142, then can directly be arranged at adjacent radiating fin 131 formed compartments, the end face 132 that also or directly is arranged at pedestal 130 is not provided with on the redundant space of radiating fin 131, and this moment, the position of first perforated holes 102 and second through hole can corresponding second being provided with the position of locked assembly 142 and change.

In sum, the utility model provides a kind of radiating subassembly, its elastic force that elastic parts provided by fixture is close on the heat-conductive assembly heat abstractor, so can promote the radiating efficiency of heat abstractor, avoid chip to have the excessive situation of local pressure simultaneously and take place, to prolong the useful life of chip.

The utility model must be modified arbitrarily by those skilled in the art, yet does not take off the scope as the desire protection of attached claim institute.

Claims

1. a radiating subassembly is characterized in that, comprises:

Substrate;

Chip is arranged on this substrate;

Heat-conductive assembly is arranged on this chip;

Heat abstractor is arranged on this heat-conductive assembly, and has a pedestal and a plurality of radiating fin; And

Fixture in order to this heat abstractor is fixedly arranged on this substrate, comprises:

At least one first locked assembly has the portion of wearing and top, and wherein this portion that wears wears this substrate by the bottom surface of this substrate, and wears this pedestal and form one one is set, and this top is replaced mutually with this bottom surface;

At least one elastic parts, sheathed this are provided with portion and replace mutually with this pedestal; And

At least one second locked assembly is locked in this and is provided with in the portion, in order to replacing mutually with this elastic parts, and prevents that this elastic parts is broken away from by this portion of setting.

2. radiating subassembly as claimed in claim 1 is characterized in that this substrate is made of circuit board or mainboard.

3. radiating subassembly as claimed in claim 1 is characterized in that this substrate has at least one perforated holes, and described perforated holes wears the corresponding setting of portion with this, makes this portion of wearing run through this perforated holes and wears this substrate.

4. radiating subassembly as claimed in claim 1 is characterized in that this heat-conductive assembly is made of conducting strip or thermal grease.

5. radiating subassembly as claimed in claim 1 is characterized in that, the number of this fixture is 4.

6. radiating subassembly as claimed in claim 1 is characterized in that this elastic parts is made of spring.

7. radiating subassembly as claimed in claim 1 is characterized in that, described a plurality of radiating fins partly block, with ccontaining this second locked assembly.

8. radiating subassembly as claimed in claim 1 is characterized in that, this wears portion and this top is one of the forming.

9. radiating subassembly as claimed in claim 1 is characterized in that, this first locked assembly is a screw, and this second locked assembly is a bolt.

10. radiating subassembly as claimed in claim 1 is characterized in that, is arranged on the end face of this pedestal described a plurality of radiating fin compartments.