CN202025724U - Reversed electrode preventer for placement machines - Google Patents
Reversed electrode preventer for placement machines Download PDFInfo
- Publication number
- CN202025724U CN202025724U CN2011200957946U CN201120095794U CN202025724U CN 202025724 U CN202025724 U CN 202025724U CN 2011200957946 U CN2011200957946 U CN 2011200957946U CN 201120095794 U CN201120095794 U CN 201120095794U CN 202025724 U CN202025724 U CN 202025724U
- Authority
- CN
- China
- Prior art keywords
- chip
- sensitive switch
- preventer
- reversed
- notch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model provides a reversed electrode preventer for placement machines, which comprises a chip table and a chip-expanding ring, the chip table is provided with a longitudinal notch, a microswitch is mounted in the notch, the chip-expanding ring is arranged on the chip table, and is also provided with a notch which corresponds to the chip table, and the notch of the chip-expanding ring is wider than the notch of the chip table. The reversed electrode preventer can automatically detect whether electrodes are reversed after a chip is mounted, consequently, the economic loss caused by the reversed electrodes of chips is prevented, and moreover, the reversed electrode preventer is favorable for automated production, thus increasing the working efficiency of production staff and further reducing the production cost.
Description
Technical field
The utility model relates to semiconductor packages bonding die equipment, particularly a kind of device that can detect bonding die device chip antipole.
Background technology
In existing semiconductor die package process, normally adopt earlier the circular loop that expands that chip is expanded sheet, again chip is placed on the die Bonder according to flow diagram by operating personnel after expanding sheet and finishing and produces.In the whole process, all rely on personnel operation to finish, and because operating personnel's carelessness, multiple factor such as not careful are anti-with the chip dress easily, thereby cause all output product all to be scrapped, cause very large economic loss.
The utility model content
The utility model is for solving the problems of the technologies described above, provide a kind of bonding die equipment to prevent the antipole device, can realize the purpose of detection chip antipole, can reach whether antipole of detection chip is installed behind the chip automatically, prevent the economic loss that the chip antipole causes, and be beneficial to automated production, to improve producers' operating efficiency, further reduce production costs.
In order to achieve the above object, the technical solution of the utility model is as follows:
A kind of bonding die equipment is prevented the antipole device, it is characterized in that: comprise that the chip platform that is provided with sensitive switch, described chip platform are provided with longitudinal fluting, sensitive switch is installed in the groove; Described expansion loop is arranged on the chip platform, expands loop and also is provided with and chip platform corresponding groove, expands the recess width of the recess width of loop greater than the chip platform.
The power line of described sensitive switch and operation keyboard+the 12V power line is connected.
The power line of described sensitive switch is the power line of two 0.12 ㎡, twines to be spring-like.
Described sensitive switch inside is a transducer.
Principle of the present utility model is:
Behind the machine, the transducer of sensitive switch must be in its groove on the chip platform on the chip, and sensitive switch remains at normally off, can guarantee that like this operation keyboard supply signal can not interrupt.Anti-as the fruit chip dress, promptly expand the sheet ring groove and do not aim at microswitch push-button, and be pressed on the microswitch push-button, sensitive switch gets an electric shock and will disconnect, the signal that causes supplying with operation keyboard will interrupt, and any button will lose function on the clicking operation keyboard, and equipment can't start.
The beneficial effects of the utility model are as follows:
The utility model can be after chip be installed detection chip antipole whether automatically, prevent the economic loss that the chip antipole causes, and be beneficial to automated production, to improve producers' operating efficiency, further reduce production costs.
Description of drawings
Fig. 1 is the plan structure schematic diagram of chip platform of the present utility model
Fig. 2 is the plan structure schematic diagram of expansion loop of the present utility model
Fig. 3 is the side-looking structural representation of expansion loop of the present utility model
Fig. 4 is chip polarity of the present utility model and expansion sheet ring groove corresponding diagram
Wherein Reference numeral is: 1 chip platform, and the groove on the 2 chip platforms, 3 sensitive switches, 4 expand loop, and 5 expand the groove on the loop, 6 power lines, 7 operation keyboards.
Embodiment
Below in conjunction with accompanying drawing the utility model is described further.
Shown in Fig. 1-4, a kind of bonding die equipment is prevented the antipole device, comprises the chip platform 1 that is provided with sensitive switch 3, and described chip platform 1 is provided with longitudinal fluting 2, and sensitive switch 3 is installed in the groove 2; Described expansion loop 4 is arranged on the chip platform 1, expands loop 4 and also is provided with and chip platform 1 corresponding groove 5, expands the recess width of the recess width of loop 4 greater than chip platform 1.
The power line 6 of described sensitive switch 3 and operation keyboard 7+the 12V power line is connected.
The power line 6 of described sensitive switch 3 twines and is spring-like, is convenient to chip platform 1 and can not be broken in the process of walking.
Described sensitive switch 3 inside are a transducer.
The concrete installation steps of the utility model can be:
The first step: the groove that on the chip platform, processes a 20mm*8.5mm.
Second one: sensitive switch is installed in the groove that the chip platform processes.
The 3rd one: measure two normally closed wiring piles of sensitive switch inner sensor with universal instrument, and connect the power line of 0.12 ㎡.
The 4th the step: with sensor power supply line be parallel to keyboard+the 12V power line on.
The 5th step: process the groove of a 30mm*3mm in a side that expands loop, sensitive switch is with to expand the sheet ring groove parallel, and the assurance sensitive switch can not run in groove.
The 6th step: the chip that will expand sheet is placed on the chip platform, because pad pasting expansion sheet has the chip rotation phenomenon unavoidably, so that the groove of expansion loop is processed as 30mm is wide, is exactly in order to calibrate its anglec of rotation on die Bonder.
Behind the machine, the transducer of sensitive switch must be in its groove on the chip platform on the chip, and sensitive switch remains at normally off, can guarantee that like this operation keyboard supply signal can not interrupt.Anti-as the fruit chip dress, promptly expand the sheet ring groove and do not aim at microswitch push-button, and be pressed on the microswitch push-button, sensitive switch gets an electric shock and will disconnect, the signal that causes supplying with operation keyboard will interrupt, and any button will lose function on the clicking operation keyboard, and equipment can't start.
Claims (4)
1. a bonding die equipment is prevented the antipole device, and it is characterized in that: comprise that the chip platform that is provided with sensitive switch, described chip platform are provided with longitudinal fluting, sensitive switch is installed in the groove; Described expansion loop is arranged on the chip platform, expands loop and also is provided with and chip platform corresponding groove, expands the recess width of the recess width of loop greater than the chip platform.
2. a kind of bonding die equipment according to claim 1 is prevented the antipole device, it is characterized in that: the power line of described sensitive switch and operation keyboard+the 12V power line is connected.
3. a kind of bonding die equipment according to claim 1 is prevented the antipole device, and it is characterized in that: the power line of described sensitive switch is the power line of two 0.12 ㎡, twines to be spring-like.
4. a kind of bonding die equipment according to claim 1 is prevented the antipole device, and it is characterized in that: described sensitive switch inside is a transducer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200957946U CN202025724U (en) | 2011-04-02 | 2011-04-02 | Reversed electrode preventer for placement machines |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200957946U CN202025724U (en) | 2011-04-02 | 2011-04-02 | Reversed electrode preventer for placement machines |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202025724U true CN202025724U (en) | 2011-11-02 |
Family
ID=44850666
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011200957946U Expired - Fee Related CN202025724U (en) | 2011-04-02 | 2011-04-02 | Reversed electrode preventer for placement machines |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202025724U (en) |
-
2011
- 2011-04-02 CN CN2011200957946U patent/CN202025724U/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN202025724U (en) | Reversed electrode preventer for placement machines | |
| CN203460241U (en) | Punching device capable of avoiding blocking | |
| CN203545121U (en) | Double-station turntable transmission system | |
| CN202833065U (en) | Water pump controller | |
| CN203003459U (en) | Full-automatic screw driving machine | |
| CN206966395U (en) | The protection device of punching machine mold | |
| CN203297919U (en) | Hydraulic machine with switch for protecting two hands | |
| CN203508812U (en) | Die-cutting machine die plate fixing device | |
| CN206316846U (en) | A kind of numerical control depth cooling system for substituting cutting fluid | |
| CN203002853U (en) | Re-punching recognition device of chain link plate | |
| CN101586914A (en) | Silicon leak detection structure of polycrystalline silicon ingot device | |
| CN103111491A (en) | Fracture detecting device for machining punch of pipe-expanding machine | |
| CN104140202A (en) | Quick cutting device for solar glass tubes | |
| CN204204807U (en) | A kind of bonding die antipole detects false alarm prevention device | |
| CN201440190U (en) | Tool equipment for processing liquid crystal circuit board | |
| CN203366103U (en) | Integrated control circuit for tear-off lid composite punch | |
| CN202845366U (en) | Swing type degumming water-spraying device for polycrystalline silicon chips | |
| CN103035546B (en) | A kind of small size bonding point two-wire bonding method | |
| CN203141736U (en) | Cooling steel belt conveying device for producing polyester resin | |
| CN203542136U (en) | Dual-bore rod drilling fixture tool | |
| CN202516799U (en) | Full-automatic enzyme labeling immune plate washer | |
| CN202845583U (en) | Ballast machine rim die structure | |
| CN202749934U (en) | Motor fixing support | |
| CN205129516U (en) | Ice cooling water system for water cooled generator of central authorities | |
| CN202293384U (en) | Tablet machine with protective device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111102 Termination date: 20160402 |