CN204204807U - A kind of bonding die antipole detects false alarm prevention device - Google Patents
A kind of bonding die antipole detects false alarm prevention device Download PDFInfo
- Publication number
- CN204204807U CN204204807U CN201420718136.1U CN201420718136U CN204204807U CN 204204807 U CN204204807 U CN 204204807U CN 201420718136 U CN201420718136 U CN 201420718136U CN 204204807 U CN204204807 U CN 204204807U
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- China
- Prior art keywords
- chip platform
- base plate
- reference column
- antipole
- spread sheet
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- Expired - Fee Related
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Abstract
The utility model provides a kind of bonding die antipole and detects false alarm prevention device, belong to the technical field of semiconductor packages bonding die, comprise chip platform base plate, chip platform inductor, circular spread sheet ring, described chip platform base plate central authorities are provided with base plate spacing hole, described base plate spacing hole top is provided with inductor fixing lug boss, the side of described inductor fixing lug boss is provided with described chip platform inductor, described circular spread sheet ring is provided with above described chip platform base plate, described circular spread sheet ring side is provided with locating notch, it is characterized in that: described chip platform base plate side is provided with reference column screwed hole, described reference column screwed hole is fixed with chip platform reference column, described locating notch coordinates with described chip platform reference column.The utility model passes through base plate spacing hole, chip platform reference column, coordinates with the locating notch of circular spread sheet ring, and achieve location, chip direction and prevent antipole from detecting the generation of wrong report, this apparatus structure is simple, effectively can reduce the generation of antipole scrap products.
Description
Technical field
The utility model belongs to the technical field of semiconductor packages bonding die, and especially a kind of bonding die antipole detects false alarm prevention device.
Background technology
In existing semiconductor die package process, normally first adopt circular spread sheet ring to carry out spread sheet to chip, again chip to be placed in die Bonder according to flow diagram by operating personnel after spread sheet completes and to produce.In whole process, human users is all relied on to complete, and due to the carelessness of operating personnel, the many factors such as not careful, easily that chip is anti-loaded, thus cause all output product all to be scrapped, cause very large economic loss.
Prior art Patent number is 20112009579.4, a kind of reversed electrode preventer for placement machines is disclosed, this device is provided with sensitive switch, circular spread sheet ring is arranged in chip platform, sensitive switch remains at normally off, as fruit chip is anti-loaded, namely spread sheet ring groove does not aim at microswitch push-button, and be pressed on microswitch push-button, sensitive switch gets an electric shock and will disconnect, cause the signal interruption supplying operation keyboard, on clicking operation keyboard, any button will lose function, equipment cannot start, but this checkout gear detects after chip, make semiconductor chip will carry out the anti-antipole of full inspection ability, effectively can not reduce scrappage.
In the production process of chip, even if misoperation is anti-loaded by chip, circular spread sheet ring also can arrive chip platform smoothly, thus can not the parts of accurate detection chip whether install correctly, thus cause reporting phenomenon by mistake, therefore must increase follow-up detection, avoid scrapping of chip integral product.
Utility model content
The purpose of this utility model is the problems referred to above existed for existing technology, provide a kind of bonding die antipole and detect false alarm prevention device, when solving chip, antipole detects the problem easily producing wrong report, achieves the location in chip direction and prevents antipole from detecting the generation of wrong report.
For this reason, the technical solution that the utility model is taked is:
A kind of bonding die antipole detects false alarm prevention device, comprise chip platform base plate, chip platform inductor, circular spread sheet ring, described chip platform base plate central authorities are provided with base plate spacing hole, described base plate spacing hole top is provided with inductor fixing lug boss, the side of described inductor fixing lug boss is provided with described chip platform inductor, described circular spread sheet ring is provided with above described chip platform base plate, described circular spread sheet ring side is provided with locating notch, described chip platform base plate side is provided with reference column screwed hole, described reference column screwed hole is fixed with chip platform reference column, described locating notch coordinates with described chip platform reference column.
As preferred further, the minimum diameter of described base plate spacing hole is greater than the internal diameter of described circular spread sheet ring, the external diameter of the little described spread sheet ring of maximum inner diameter of described base plate spacing hole.
As preferred further, described chip platform reference column is cylinder, and the diameter of described chip platform reference column is 36mm ~ 40mm, and the height of described chip platform reference column is 9mm ~ 11mm.
As preferred further, described chip platform reference column and described circular spread sheet ring are in the same side.
As preferred further, described chip platform inductor is metal sensor.
As preferred further, described metal sensor is normally off.
The beneficial effect of technique scheme is:
(1) the utility model is provided with base plate spacing hole, the minimum diameter of base plate spacing hole is greater than the internal diameter of circular spread sheet ring, the external diameter of the little spread sheet ring of maximum inner diameter of base plate spacing hole, when chip is anti-loaded, base plate spacing hole is for stopping that circular spread sheet ring enters chip platform, chip platform inductor just can not sense signal, and die bonder cannot start, and realizes the object preventing chip antipole;
(2) the utility model is provided with chip platform reference column, when the anti-loaded pole of chip, chip platform reference column can stop that the skew of circular spread sheet ring enters chip platform, locating notch coordinates with chip platform reference column, can conveniently position to the direction of chip, simplify operating process, the location in chip direction can be realized and prevent antipole from detecting the generation of wrong report, the workload of installation and measuring antipole can be reduced, effectively reduce the scrappage detecting antipole after installing, even arrive the generation not having antipole scrap products;
(3) the utility model passes through base plate spacing hole, chip platform reference column, coordinates with the locating notch of circular spread sheet ring, achieve location, chip direction and prevent antipole from detecting the generation of wrong report, this apparatus structure is simple, effectively can reduce the generation of antipole scrap products.
Accompanying drawing explanation
Fig. 1 is the structural representation that bonding die antipole of the present utility model detects false alarm prevention device.
Fig. 2 is the structural representation of chip platform base plate of the present utility model.
In figure: 1, chip platform base plate; 2, chip platform inductor; 3, circular spread sheet ring; 4, chip platform reference column; 101, base plate spacing hole; 102, reference column screwed hole; 103, inductor fixing lug boss; 301, locating notch.
Embodiment
For making feature of the present utility model and advantage clearly, be described below in conjunction with specific embodiment.
As depicted in figs. 1 and 2, a kind of bonding die antipole detects false alarm prevention device, comprise chip platform base plate 1, chip platform inductor 2, circular spread sheet ring 3, described chip platform base plate 1 central authorities are provided with base plate spacing hole 101, described base plate spacing hole 101 top is provided with inductor fixing lug boss 103, the side of described inductor fixing lug boss 103 is provided with described chip platform inductor 2, described circular spread sheet ring 3 is provided with above described chip platform base plate 1, described circular spread sheet ring 3 side is provided with locating notch 301, described chip platform base plate 1 side is provided with reference column screwed hole 102, described reference column screwed hole 102 is fixed with chip platform reference column 4, described locating notch 301 coordinates with described chip platform reference column 4.
In the present embodiment, the minimum diameter of described base plate spacing hole 101 is greater than the internal diameter of described circular spread sheet ring 3, the external diameter of the little described spread sheet ring 3 of maximum inner diameter of described base plate spacing hole 101, when chip is anti-loaded, base plate spacing hole 101 is for stopping that circular spread sheet ring 3 enters chip platform, chip platform inductor 2 just can not sense signal, and die bonder cannot start, and realizes the object preventing chip antipole.
In the present embodiment, described chip platform reference column 4 is cylinder, and the diameter of described chip platform reference column 4 is 36mm ~ 40mm, and the height of described chip platform reference column 4 is 9mm ~ 11mm, when the anti-loaded pole of chip, chip platform reference column 4 can stop that the skew of circular spread sheet ring 2 enters chip platform; Locating notch 301 coordinates with chip platform reference column 4,
Can conveniently position to the direction of chip, simplify operating process, the location in chip direction can be realized and prevent antipole from detecting the generation of wrong report, the workload of installation and measuring antipole can be reduced, effectively reduce the scrappage detecting antipole after installing, even arrive the generation not having antipole scrap products.
In the present embodiment, described chip platform reference column 4 and described circular spread sheet ring 3, in the same side, can not realize spacing effect at homonymy, when antipole is installed, circular spread sheet ring 3 also can enter in chip platform smoothly, chip platform inductor 2 cisco unity malfunction, thus produces antipole scrap products.
In the present embodiment, described chip platform inductor 2 is metal sensor, and metal sensor is normally off, and when chip is installed correct, chip platform inductor 2 just can sense signal, and circular spread sheet ring 3 can enter chip platform smoothly, carries out spread sheet to chip; When chip installs antipole, chip platform inductor 2 just can not sense signal, and die bonder, with regard to cisco unity malfunction, realizes the object that antipole detects; Due in prior art, even if chip installs antipole, circular spread sheet ring 3 also normally can enter chip platform, and die bonder normally runs, and produces wrong report phenomenon.
During use, be placed on chip platform base plate 1 by circular spread sheet ring 3, the locating notch 301 of chip platform reference column 4 and circular spread sheet ring 3 coordinates, and whether correctly just can detect each parts mount position; The generation that can realize location, chip direction and prevent antipole from reporting by mistake.
In addition to the implementation, the utility model can also have other execution modes.All employings are equal to the technical scheme of replacement or equivalent transformation formation, all drop in protection range of the present utility model.
Claims (5)
1. a bonding die antipole detects false alarm prevention device, comprise chip platform base plate, chip platform inductor, circular spread sheet ring, described chip platform base plate central authorities are provided with base plate spacing hole, described base plate spacing hole top is provided with inductor fixing lug boss, the side of described inductor fixing lug boss is provided with described chip platform inductor, described circular spread sheet ring is provided with above described chip platform base plate, described circular spread sheet ring side is provided with locating notch, it is characterized in that: described chip platform base plate side is provided with reference column screwed hole, described reference column screwed hole is fixed with chip platform reference column, described locating notch coordinates with described chip platform reference column.
2. bonding die antipole according to claim 1 detects false alarm prevention device, it is characterized in that: the minimum diameter of described base plate spacing hole is greater than the internal diameter of described circular spread sheet ring, the external diameter of the little described spread sheet ring of maximum inner diameter of described base plate spacing hole.
3. bonding die antipole according to claim 1 detects false alarm prevention device, and it is characterized in that: described chip platform reference column is cylinder, the diameter of described chip platform reference column is 36mm ~ 40mm, and the height of described chip platform reference column is 9mm ~ 11mm.
4. the bonding die antipole according to any one of claim 1 ~ 3 detects false alarm prevention device, it is characterized in that: described chip platform reference column and described circular spread sheet ring are in the same side.
5. the bonding die antipole according to any one of claim 1 ~ 3 detects false alarm prevention device, and it is characterized in that: described chip platform inductor is metal sensor, described metal sensor is normally off.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420718136.1U CN204204807U (en) | 2014-11-26 | 2014-11-26 | A kind of bonding die antipole detects false alarm prevention device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420718136.1U CN204204807U (en) | 2014-11-26 | 2014-11-26 | A kind of bonding die antipole detects false alarm prevention device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204204807U true CN204204807U (en) | 2015-03-11 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420718136.1U Expired - Fee Related CN204204807U (en) | 2014-11-26 | 2014-11-26 | A kind of bonding die antipole detects false alarm prevention device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204204807U (en) |
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2014
- 2014-11-26 CN CN201420718136.1U patent/CN204204807U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150311 Termination date: 20151126 |