CN201994288U - Anti-seepage lead frame - Google Patents

Anti-seepage lead frame Download PDF

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Publication number
CN201994288U
CN201994288U CN2011200220766U CN201120022076U CN201994288U CN 201994288 U CN201994288 U CN 201994288U CN 2011200220766 U CN2011200220766 U CN 2011200220766U CN 201120022076 U CN201120022076 U CN 201120022076U CN 201994288 U CN201994288 U CN 201994288U
Authority
CN
China
Prior art keywords
lead frame
antiseepage
seepage
groove
model
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2011200220766U
Other languages
Chinese (zh)
Inventor
王勇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Sanpu Semiconductor Co Ltd
Original Assignee
Shenzhen Sanpu Semiconductor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Sanpu Semiconductor Co Ltd filed Critical Shenzhen Sanpu Semiconductor Co Ltd
Priority to CN2011200220766U priority Critical patent/CN201994288U/en
Application granted granted Critical
Publication of CN201994288U publication Critical patent/CN201994288U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses an anti-seepage lead frame, which comprises a chip part, a middle pin, two lateral pins, a middle rib, a positioning hole and a rectangular groove, and is characterized by also comprising an anti-seepage groove, wherein the anti-seepage groove is positioned between the positioning hole and the rectangular groove. By applying the anti-seepage lead frame, the package test leakage current reject rate can be effectively reduced from 0.4-0.6 percent to 0.1-0.2 percent, the electronic component package yield is increased and the service life of electronic components is prolonged.

Description

A kind of antiseepage lead frame
Technical field
The utility model relates to a kind of lead frame, relates in particular to a kind of antiseepage lead frame.
Background technology
At present, TO-126 series electronic components and parts are quite extensive at charger for mobile phone and illuminating industry use, and its lead frame is to constitute one of TO-126 series electronic components and parts main raw material(s).At present, the electronic devices and components leakage current of producing by conventional lead frame is bigger, it is main because the space is bigger between encapsulation back lead frame and the plastic-sealed body, make in the electroplating technology process water or acid infiltrate in the components and parts easily, perhaps aqueous vapor is infiltrated in the components and parts easily in storage process, thus the reduction that causes.
The utility model content
The utility model purpose is to provide a kind of can improve the electronic devices and components encapsulation yield and the antiseepage lead frame in useful life.
For achieving the above object, the utility model comprises chip section, interim pins, two side pipe pin, middle muscle, location hole and rectangular recess, is characterized in also having the antiseepage groove; Described antiseepage groove is between location hole and rectangular recess.
Further, described antiseepage groove comprises curved section, and described curved section is along the circumference setting of location hole; And two straightways, described two straightways extend to the described chip section left and right sides from the two ends of curved section respectively.
The beneficial effects of the utility model are, use described antiseepage lead frame, can be effectively the bad ratio of packaging and testing leakage current be reduced to 0.1~0.2% from 0.4~0.6%, and then improve electronic devices and components encapsulation yield and useful life.
Description of drawings
Fig. 1 shows the schematic diagram of the TO-126 model lead frame of prior art.
Fig. 2 shows the schematic diagram of the utility model antiseepage lead frame.
Embodiment
Below in conjunction with accompanying drawing the utility model is described further.
Fig. 1 shows the schematic diagram of the TO-126 model lead frame 100 of prior art.Lead frame 100 comprises chip section 101, interim pins 106, two side pipe pin 102 and middle muscle 103, wherein, interim pins 106 is extended downward vertically from the lateral mid-point of chip section 101 bottoms, two side pipe pin 102 are arranged at the left and right sides of interim pins 106 symmetrically, the upper end of two side pipe pin 102 is provided with a head 121, and middle muscle 103 crosses described interim pins 106 and two side pipe pin 102; Described chip section 101 is provided with location hole 111 and is positioned at the rectangular recess 107 of location hole 111 belows; Employed strip 104 when the part that is connected with the bottom of interim pins 106 and two side pipe pin 102 is production lead frame of triode 100.
Fig. 2 shows the schematic diagram of the utility model antiseepage lead frame 200.Described antiseepage lead frame 200 is improvement of TO-126 model lead frame 100 shown in Figure 1, and the structure of its chip section 101, location hole 111, interim pins 106, two side pipe pin 102, middle muscle 103, strip 104 and rectangular recess 107 is all identical with above prior art of shape and annexation.
The characteristics of the utility model antiseepage lead frame 200 are that having a depth bounds between described location hole 111 and the rectangular recess 107 is the antiseepage groove 105 of 0.5mm~1mm; And it comprises a curved section and two straightways, and described curved section is along the circumference setting of location hole, and described two straightways extend to described chip section 101 left and right sides from the two ends of curved section respectively.
In addition, described antiseepage groove 105 and lead frame 100 disposable integral punch forming simultaneously, the device of producing described antiseepage lead frame 200 increases by a cover waterproof mould on the device basic of producing TO-126 model lead frame 100, make described antiseepage lead frame 200 have the structure of described antiseepage groove 105 by this waterproof mould.
Further, use antiseepage lead frame 200, the bad ratio of packaging and testing leakage current can be reduced to 0.1~02% from 0.4~0.6% with described antiseepage groove.
The shape of antiseepage groove 105 is not limited to shape described in the literary composition in the utility model, and the difform groove that plays the antiseepage effect all falls into protection range of the present utility model.

Claims (2)

1. an antiseepage lead frame comprises chip section, interim pins, two side pipe pin, middle muscle, location hole and rectangular recess, and it is characterized in that: described antiseepage lead frame also has the antiseepage groove; Described antiseepage groove is between location hole and rectangular recess.
2. according to the described antiseepage lead frame of claim 1, it is characterized in that: described antiseepage groove comprises,
Curved section, described curved section is along the circumference setting of location hole; And,
Article two, straightway, described two straightways extend to the described chip section left and right sides from the two ends of curved section respectively.
CN2011200220766U 2011-01-24 2011-01-24 Anti-seepage lead frame Expired - Fee Related CN201994288U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2011200220766U CN201994288U (en) 2011-01-24 2011-01-24 Anti-seepage lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011200220766U CN201994288U (en) 2011-01-24 2011-01-24 Anti-seepage lead frame

Publications (1)

Publication Number Publication Date
CN201994288U true CN201994288U (en) 2011-09-28

Family

ID=44670768

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011200220766U Expired - Fee Related CN201994288U (en) 2011-01-24 2011-01-24 Anti-seepage lead frame

Country Status (1)

Country Link
CN (1) CN201994288U (en)

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110928

Termination date: 20170124

CF01 Termination of patent right due to non-payment of annual fee