CN201994270U - Uncovering device for semiconductor package - Google Patents
Uncovering device for semiconductor package Download PDFInfo
- Publication number
- CN201994270U CN201994270U CN2011200515692U CN201120051569U CN201994270U CN 201994270 U CN201994270 U CN 201994270U CN 2011200515692 U CN2011200515692 U CN 2011200515692U CN 201120051569 U CN201120051569 U CN 201120051569U CN 201994270 U CN201994270 U CN 201994270U
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- China
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- supporting region
- packaging part
- package
- bearing
- semiconductor package
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- Expired - Fee Related
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Abstract
The utility model relates to an uncovering device for a semiconductor package. The uncovering device comprises a movable bearing base, a package base, a bearing and an uncovering clamp groove, wherein the movable bearing base is provided with a bearing hole; the package base is fixedly connected with the movable bearing base and is provided with a package cover carrying region, a package lower surface carrying region and a package outer pin carrying region; the package cover carrying region and the package outer pin carrying region are recessed into the surface of the package lower surface carrying region; the package cover carrying region is positioned on the middle part of the package lower surface carrying region; the package outer pin carrying region is positioned on the two sides of the package lower surface carrying region; the bearing is arranged in the bearing hole of the movable bearing base; one end of the bearing is provided with a knob, and the other end of the bearing is connected with a movable component in a stress mode; and one end of the uncovering clamp groove is fixed in the movable component, and the other end of the uncovering clamp groove is inserted into the lower end of the package cover carrying region. By using the uncovering device, a cover of the semiconductor package can be conveniently opened, and the package can be prevented from being damaged.
Description
Technical field
The utility model is a kind of hood-opening device that is used for semiconductor package part, particularly has knob, can carry out the hood-opening device that flexible is uncapped according to the semiconductor package part of different length.
Background technology
Fast development along with photoelectric technology, the light sensation chip of increasing high integration miniaturization is gone into operation in the semiconductor packages, because of the light sensation chip is responded to by the matrix induction zone, the shape size is more and more littler, integrated level is more and more higher, and then the induction of the matrix in unit are window is little more and more littler, requires more and more stricter to cleanliness factor on the matrix induction window like this, the existence of dust or foreign matter will be serious problems like this, will be a problem urgently to be separated to the semiconductor encapsulation field.
A lot of solutions are provided at this association area of this problem, but still can not thoroughly light sensation chip cleanliness factor be reached desirable requirement, so will there be the yield loss of a part, for retrieving the yield loss of this part, this association area mostly adopts the heavy industry mode of uncapping, but the common instrument of uncapping tends to make semiconductor package part the inside bonding wire circuit and product appearance impaired, badly influences the yield of product.
The utility model content
The purpose of this utility model is to provide a kind of hood-opening device that is used for semiconductor package part, and this device can be opened the packaging part lid, and prevents that packaging part is impaired.
The purpose of this utility model is achieved in that
A kind of hood-opening device that is used for semiconductor package part comprises: a live bearing pedestal, and this live bearing pedestal is provided with dead eye; One enclosure base, this enclosure base is fixedlyed connected with the live bearing pedestal, enclosure base is provided with packaging part lid supporting region, packaging part lower surface supporting region and packaging part external pin supporting region, described packaging part lid supporting region and packaging part external pin supporting region are recessed into packaging part lower surface supporting region surface, packaging part lid supporting region is positioned at packaging part lower surface supporting region middle part, and packaging part external pin supporting region is positioned at packaging part lower surface supporting region both sides; One bearing, this bearing are installed in the dead eye of live bearing pedestal, and the one end is provided with the knob other end and is connected with a movable part is stressed; One draw-in groove of uncapping, this draw-in groove one end of uncapping is fixed in the movable part, and the draw-in groove other end of uncapping is inserted into packaging part lid supporting region lower end.
Preferably, described draw-in groove parts integral body or the top layer of uncapping is wear-resisting flexible material structure.
Preferably, also be provided with fixing live bearing parts on the described bearing, these parts have adjustable screw thread, also are provided with the screw thread that is complementary with adjustable screw thread on the bearing.
Utilize the utility model can open the semiconductor package part lid apace, and because the draw-in groove parts of uncapping that are used to uncap adopt wear-resisting flexible material structure can not cause damage to semiconductor package part outward appearance and bonding wire.Further, the utility model also can carry out flexible according to the semiconductor package part of different length by fixing live bearing parts, is fit to uncapping of different model semiconductor package part.
Description of drawings
Fig. 1 is a kind of hood-opening device stereogram that is used for semiconductor package part of the present utility model.
Fig. 2 is the vertical view that is used for a kind of semiconductor package part of a kind of hood-opening device operation instruction that is used for semiconductor package part of the present utility model.
Embodiment
Fig. 1 is a kind of hood-opening device stereogram that is used for semiconductor package part of the present utility model.
Fig. 2 is the vertical view that is used for a kind of semiconductor package part of a kind of hood-opening device operation instruction that is used for semiconductor package part of the present utility model.
With reference to shown in Figure 1, the hood-opening device that the utility model is used for semiconductor package part comprises: a live bearing pedestal 1, and this live bearing pedestal is provided with dead eye; One enclosure base 2, this enclosure base is fixedlyed connected with the live bearing pedestal, enclosure base is provided with packaging part lid supporting region 21, packaging part lower surface supporting region 22 and packaging part external pin supporting region 23, below the surface of packaging part lid supporting region 21 and packaging part external pin supporting region 23 recessed packaging part lower surface supporting regions 22, packaging part lid supporting region 21 is positioned at packaging part lower surface supporting region 22 middle parts, and packaging part external pin supporting region 23 is positioned at the both sides of packaging part lower surface supporting region 22; One bearing 3, this bearing are installed in the dead eye of live bearing pedestal, and the one end is provided with knob 4 other ends and 5 stressed connections an of movable part; One draw-in groove 6 of uncapping, this draw-in groove one end of uncapping is fixed in the movable part 5, and the draw-in groove other end of uncapping is inserted into packaging part lid supporting region 21 lower ends.
As preferred implementation of the present utility model, described draw-in groove 6 integral body or the top layer of uncapping is wear-resisting flexible material structure.
As preferred implementation of the present utility model, also be provided with fixing live bearing parts on the described bearing 3, these parts have adjustable screw thread, also are provided with the screw thread that is complementary with adjustable screw thread on the bearing.
Again referring to shown in Figure 2, packaging part external pin 11 is connected by lead with chip circuit in the packaging part colloid 14, plays the conducting effect; Packaging part lid 12 is used for dust protection and foreign matter, the protection chip; Packaging part lid projection 13 shaped design according to packaging part lid 12 outsides have aperture in the middle of it, are convenient to printing opacity and make the chip induction; Packaging part colloid 14 is used for dust protection and foreign matter, the protection chip.
Operation instruction:
Knob 4 is pulled outward, get a semiconductor package part as shown in Figure 2, be positioned over the hood-opening device that is used for semiconductor package part of the present utility model, make its packaging part lid 12 aim at packaging part lid supporting region 21, packaging part colloid 14 is positioned at packaging part lower surface supporting region 22, packaging part external pin 11 enters packaging part external pin supporting region 23, then knob 4 is pushed away inward, and the action of uncapping is promptly finished in the back rotation that puts in place.
Below the utility model is described in detail, the above only is the preferred embodiment of one of the utility model, when can not limiting the utility model practical range,
Be allly to do impartial change and modify, all should still belong in the utility model covering scope according to the application's scope.
Claims (3)
1. a hood-opening device that is used for semiconductor package part is characterized in that, comprising:
One live bearing pedestal, this live bearing pedestal is provided with dead eye;
One enclosure base, this enclosure base is fixedlyed connected with the live bearing pedestal, enclosure base is provided with packaging part lid supporting region, packaging part lower surface supporting region and packaging part external pin supporting region, described packaging part lid supporting region and packaging part external pin supporting region are recessed into packaging part lower surface supporting region surface, packaging part lid supporting region is positioned at packaging part lower surface supporting region middle part, and packaging part external pin supporting region is positioned at packaging part lower surface supporting region both sides;
One bearing, this bearing are installed in the dead eye of live bearing pedestal, and the one end is provided with the knob other end and is connected with a movable part is stressed;
One draw-in groove of uncapping, this draw-in groove one end of uncapping is fixed in the movable part, and the draw-in groove other end of uncapping is inserted into packaging part lid supporting region lower end.
2. the hood-opening device that is used for semiconductor package part according to claim 1 is characterized in that, described draw-in groove parts integral body or the top layer of uncapping is wear-resisting flexible material structure.
3. the hood-opening device that is used for semiconductor package part according to claim 1 and 2 is characterized in that, also is provided with fixing live bearing parts on the described bearing, and these parts have adjustable screw thread, also are provided with the screw thread that is complementary with adjustable screw thread on the bearing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200515692U CN201994270U (en) | 2011-03-01 | 2011-03-01 | Uncovering device for semiconductor package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200515692U CN201994270U (en) | 2011-03-01 | 2011-03-01 | Uncovering device for semiconductor package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201994270U true CN201994270U (en) | 2011-09-28 |
Family
ID=44670750
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011200515692U Expired - Fee Related CN201994270U (en) | 2011-03-01 | 2011-03-01 | Uncovering device for semiconductor package |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201994270U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105945865A (en) * | 2016-06-14 | 2016-09-21 | 潘敏舟 | Cap opener used for opening top cap of CPU |
| CN110095706A (en) * | 2018-12-24 | 2019-08-06 | 纳瑞科技(北京)有限公司 | A kind of DECAP case |
-
2011
- 2011-03-01 CN CN2011200515692U patent/CN201994270U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105945865A (en) * | 2016-06-14 | 2016-09-21 | 潘敏舟 | Cap opener used for opening top cap of CPU |
| CN110095706A (en) * | 2018-12-24 | 2019-08-06 | 纳瑞科技(北京)有限公司 | A kind of DECAP case |
| CN110095706B (en) * | 2018-12-24 | 2021-01-08 | 纳瑞科技(北京)有限公司 | DECAP case |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110928 Termination date: 20160301 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |