CN201960775U - Cement fiber melamine veneering plate - Google Patents

Cement fiber melamine veneering plate Download PDF

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Publication number
CN201960775U
CN201960775U CN2011200308438U CN201120030843U CN201960775U CN 201960775 U CN201960775 U CN 201960775U CN 2011200308438 U CN2011200308438 U CN 2011200308438U CN 201120030843 U CN201120030843 U CN 201120030843U CN 201960775 U CN201960775 U CN 201960775U
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CN
China
Prior art keywords
melamine
veneering
cement fibre
impregnated paper
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2011200308438U
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Chinese (zh)
Inventor
王妙琴
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN2011200308438U priority Critical patent/CN201960775U/en
Application granted granted Critical
Publication of CN201960775U publication Critical patent/CN201960775U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses a cement fiber melamine veneering plate, which comprises a cement fiber base plate (1) and is characterized in that a melamine impregnated paper veneering layer (2) is also glued on the cement fiber base plate (1). The structure glued with the melamine veneering plate layer adopts the melamine impregnated paper veneering layer with the advantages of environment protection, high-temperature resistance, scratch resistance, difficult cracking, no drainage, no degumming and the like, so the prepared veneering plate has the advantages that the cost is low, the fireproof and moistureproof effects are good, the installation is convenient, in addition, the surface is not easy to scratch and crack, and the drainage and the degumming can not occur in wet weather.

Description

The Cement fibre melamine faced chipboard
Technical field
The utility model relates to a kind of Cement fibre melamine faced chipboard.
Background technology
Ornament materials is extremely many with various descriptions of materials in recent years, and as density board, glass magnesium plate etc., but its fire prevention, moisture-protective ring guaranteed request do not reach.Granite, marble, ceramic tile etc. still exist price height, Heavy Weight, installation trouble, defectives such as easy surperficial scratch, cracking for another example.
Summary of the invention
The utility model is at the above-mentioned deficiency of prior art, provides that a kind of cost is low, fire prevention, moisture effect be good, easy for installation, and is difficult for surperficial scratch, Cement fibre melamine faced chipboard not easy to crack.
In order to solve the problems of the technologies described above, the technical solution of the utility model is: a kind of Cement fibre melamine faced chipboard, this thick china comprises Cement fibre substrate (cement fibrolite plate), also bonding one deck melamine impregnated paper wainscot layer on the described Cement fibre substrate.
Cement fibre substrate described in the utility model and melamine impregnated paper wainscot are the commercially available prod.
The utility model Cement fibre substrate and melamine impregnated paper wainscot layer are bonded as one by high temperature hot pressing.
The structure of the thick china of above-mentioned bonding one deck melamine impregnated paper wainscot, the melamine impregnated paper wainscot that is adopted has environmental protection, high temperature resistant, anti scuffing, not easy to crack, not bleed, advantage such as do not come unstuck, therefore, the thick china of preparing has that cost is low, fire prevention, moisture effect are good, easy for installation, and be difficult for surperficial scratch, not easy to crack, can bleed during wet weather, the advantage that is difficult for coming unstuck yet.
As preferably, the thickness of described Cement fibre substrate is 5 ~ 7mm.Adopt above-mentioned thickness, effectively controlled the weight of substrate, do not influence the overall performance of substrate simultaneously again.
As preferably, the thickness of described melamine impregnated paper wainscot layer is 1.5 ~ 2.5mm.Adopt the melamine impregnated paper wainscot layer of above-mentioned thickness, the panel of preparation is difficult for coming unstuck, bleed, and wear life is long.
Description of drawings
The structural representation of accompanying drawing the utility model melamine faced chipboard.
As shown in the figure: 1. Cement fibre substrate, 2. melamine impregnated paper wainscot layer.
The specific embodiment
Below by embodiment the utility model is described in further detail.
As shown in drawings, this practical new Cement fibre melamine faced chipboard comprises Cement fibre substrate 1, also bonding one deck melamine impregnated paper wainscot layer 2 on the described Cement fibre substrate 1.
The thickness of Cement fibre substrate 1 is 6mm, and the thickness of melamine impregnated paper wainscot layer is 2mm, prepares the specification thick china of length * wide=1.22 meter * 2.44 meters.
Cement fibre melamine faced chipboard preparation technology of the present utility model is: adopt at the Cement fibre substrate surface through high temperature hot pressing one deck melamine impregnated paper wainscot layer; 1000 tons of hot pressing pressures, hot pressing time are 50 seconds, and hot pressing temperature is 170 ℃ ~ 190 ℃, obtain Cement fibre melamine faced chipboard of the present utility model.

Claims (3)

1. Cement fibre melamine faced chipboard, this thick china comprises Cement fibre substrate (1), it is characterized in that: described Cement fibre substrate (1) is gone up also bonding one deck melamine impregnated paper wainscot layer (2).
2. Cement fibre melamine faced chipboard according to claim 1 is characterized in that: the thickness of described Cement fibre substrate (1) is 5 ~ 7mm.
3. Cement fibre melamine faced chipboard according to claim 1 is characterized in that: the thickness of described melamine impregnated paper wainscot layer (2) is 1.5 ~ 2.5mm.
CN2011200308438U 2011-01-29 2011-01-29 Cement fiber melamine veneering plate Expired - Fee Related CN201960775U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2011200308438U CN201960775U (en) 2011-01-29 2011-01-29 Cement fiber melamine veneering plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011200308438U CN201960775U (en) 2011-01-29 2011-01-29 Cement fiber melamine veneering plate

Publications (1)

Publication Number Publication Date
CN201960775U true CN201960775U (en) 2011-09-07

Family

ID=44523305

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011200308438U Expired - Fee Related CN201960775U (en) 2011-01-29 2011-01-29 Cement fiber melamine veneering plate

Country Status (1)

Country Link
CN (1) CN201960775U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102619313A (en) * 2011-01-29 2012-08-01 王妙琴 Cement fiber melamine laminated board and manufacturing method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102619313A (en) * 2011-01-29 2012-08-01 王妙琴 Cement fiber melamine laminated board and manufacturing method thereof
CN102619313B (en) * 2011-01-29 2015-06-10 王妙琴 Cement fiber melamine laminated board and manufacturing method thereof

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110907

Termination date: 20150129

EXPY Termination of patent right or utility model